Patents by Inventor Hiroshi Yamabe

Hiroshi Yamabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140056679
    Abstract: A wafer exchange apparatus is provided that is compact with excellent accessibility. The wafer exchange apparatus of the present invention includes a first and a second hands (10), (20), a first lifting means (30), a casing (40), a horizontal moving means (50) and a second lifting means (60). The first and the second hands (10), (20) are formed in shapes segmented in the left and right direction with generally line symmetry, and support a wafer (100). The first lifting means (30) moves the second hand (20) upward and downward. The casing (40) has the first lifting means (30) built-in, and supports the first hand (10) at a constant position in height while supporting the second hand (20) movably upward and downward. The horizontal moving means (50) moves the casing (40) horizontally. The second lifting means (60) moves the casing (40) upward and downward.
    Type: Application
    Filed: April 5, 2012
    Publication date: February 27, 2014
    Applicant: TAZMO CO., LTD.
    Inventors: Hiroshi Yamabe, Hitoshi Obata, Katsuhiro Yamazoe, Yoshiki Nishijima, Kosuke Sakata, Shinichi Imai, Hiroaki Tsukimoto, Keiichi Matsukawa
  • Patent number: 7005009
    Abstract: The object of the present invention is to provide an apparatus suitable for forming a thick film having a thickness on a surface of a substrate such as a glass substrate, a semiconductor wafer or the like. In the apparatus according to the present invention, a stock station for a substrate and a treatment station for a substrate are adjacent to each other, portions for coating, film-forming, cleaning and drying are provided in the treatment station, a tray having a concave portion for accommodating a substrate defined on the surface thereof is provided, and a transfer device circulates the tray around the portions for coating, film-forming, cleaning and drying.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: February 28, 2006
    Assignees: Tokyo Ohka Kogyo Co., Ltd., Tazmo Co., Ltd.
    Inventors: Taiichiro Aoki, Seiji Ohishi, Hiroshi Yamabe, Hitoshi Obata
  • Publication number: 20030134044
    Abstract: The object of the present invention is to provide an apparatus suitable for forming a thick film having a thickness on a surface of a substrate such as a glass substrate, a semiconductor wafer or the like. In the apparatus according to the present invention, a stock station for a substrate and a treatment station for a substrate are adjacent to each other, portions for coating, film-forming, cleaning and drying are provided in the treatment station, a tray having a concave portion for accommodating a substrate defined on the surface thereof is provided, and a transfer device circulates the tray around the portions for coating, film-forming, cleaning and drying.
    Type: Application
    Filed: December 3, 2002
    Publication date: July 17, 2003
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Taiichiro Aoki, Seiji Ohishi, Hiroshi Yamabe, Hitoshi Obata