Abstract: It is an object of the invention to continuously perform, under a desired condition and for a long time period, a film formation process capable of producing a high quality film. A film formation apparatus comprises: a discharge outlet disposed within a film formation chamber and facing a film formation surface of a substrate; a material accommodating section disposed outside the film formation chamber and having material containers each containing a film formation material; a heating device for heating the film formation material contained within the material-containers; discharge passages which are air-tightly communicated with the discharge outlet and the material accommodating section; escape passages branching from the discharge passages for diverting the film formation material flowing towards the discharge outlet.

Abstract: A film formation source of a vacuum film formation apparatus for forming thin film on the film formation surface of a substrate includes a material accommodating unit containing a film formation material; a heater for heating the film formation material contained within the material accommodating unit; and a film formation flow control unit provided at an emission outlet of the material accommodating unit for controlling the direction of the film formation flow. The film formation flow control unit provides a strong directivity to the film formation flow with respect to the moving direction of the film formation surface relative to the film formation source.

Abstract: Film formation is conducted with a high level of directivity. A film formation source of a vacuum film formation apparatus, includes a material container for housing a film forming material, a heating unit for heating the film forming material inside the material container, and a rectifier provided at an ejection port of the material container. In this source, the rectifier includes a passage partitioned into fine openings, and a set directivity is obtained on the basis of the cross-sectional area Sa of each opening within the rectifier, the distance L from the ejection tip of the rectifier to the film formation target surface, and the film formation rate R for the film forming material at a point on the film formation target surface directly above the center of the rectifier.

Abstract: It is an object of the present invention to easily adjust the percentage of each component when mixing together several film formation materials, so as to prevent deviation among film formation areas. A film formation source of a vacuum film formation apparatus comprises: a plurality of material accommodating units containing a plurality of film formation materials; a plurality of heating means for heating the film formation materials contained within the material accommodating units; a plurality of discharge outlets for discharging atom flows or molecule flows of film formation materials; a plurality of discharge passages for air-tightly communicating the material accommodating units with discharge outlets.

Abstract: A film formation source of a vacuum film formation apparatus for forming thin film on the film formation surface of a substrate comprises: a material accommodating unit containing a film formation material; heating means for heating the film formation material contained within the material accommodating unit; a film formation flow control unit provided at an emission outlet of the material accommodating unit for controlling the direction of the film formation flow. The film formation flow control unit provides a strong directivity to the film formation flow with respect to the moving direction of the film formation surface relative to the film formation source.

Abstract: Film formation is conducted with a high level of directivity. A film formation source of a vacuum film formation apparatus, comprises a material container for housing a film forming material, heating means for heating the film forming material inside the material container, and a rectifier provided at an ejection port of the material container. In this source, the rectifier comprises a passage partitioned into fine openings, and a set directivity is obtained on the basis of the cross-sectional area Sa of each opening within the rectifier, the distance L from the ejection tip of the rectifier to the film formation target surface, and the film formation rate R for the film forming material at a point on the film formation target surface directly above the center of the rectifier.

Abstract: It is an object of the invention to continuously perform, under a desired condition and for a long time period, a film formation process capable of producing a high quality film. A film formation apparatus comprises: a discharge outlet disposed within a film formation chamber and facing a film formation surface of a substrate; a material accommodating section disposed outside the film formation chamber and having material containers each containing a film formation material; a heating device for heating the film formation material contained within the material-containers; discharge passages which are air-tightly communicated with the discharge outlet and the material accommodating section; escape passages branching from the discharge passages for diverting the film formation material flowing towards the discharge outlet.

Abstract: A mask for vacuum deposition that is held by a mask frame is provided. The mask comprises a mask body for deposition; a guide member fixed to at least one side of the mask body for deposition; and tension applying means that, when the guide member is held by the mask frame, applies a predetermined tension to the mask body for deposition via the guide member.

Abstract: A mask for vacuum deposition cthat is held by a mask frame is provided. The mask comprises a mask body for deposition; a guide member fixed to at least one side of the mask body for deposition; and tension applying means that, when the guide member is held by the mask frame, applies a predetermined tension to the mask body for deposition via the guide member.

Abstract: A mask for vacuum deposition capable of adjusting tension of a mask for vacuum deposition and easily dismounting the mask for vacuum deposition from a mask frame and an organic EL display panel are provided. A mask 1 for vacuum deposition that is held by a mask frame 11 is provided. The mask comprises a mask body 10 for vacuum deposition; a guide member 12 adhered to at least one side of the mask body 10 for vacuum deposition; a tension applying means 14 for applying predetermined tension to the mask body 10 for vacuum deposition via the guide member 12 when the guide member 12 is held by the mask frame 11; and a fixing means 21 for fixing the guide member and mask frame in the vertical direction to a mask surface.

Abstract: A mask for vacuum deposition that is held by a mask frame is provided. The mask comprises a mask body for deposition; a guide member fixed to at least one side of the mask body for deposition; and tension applying means that, when the guide member is held by the mask frame, applies a predetermined tension to the mask body for deposition via the guide member.

Abstract: An organic electroluminescent display device includes an organic electroluminescent element formed on a substrate thereof and having an organic compound layer group sandwiched between cathodes and anodes. The organic compound layer group has laminated electroluminescence functional layers formed of at least one kind of organic compound. Further, the organic electroluminescent display device includes an airtight case that encloses the organic electroluminescent element with a space formed between the airtight case itself and the organic electroluminescent element and isolates the organic electroluminescent element from outside air, and a filler gas filling the space within the airtight case. The filler gas contains at least one kind of combustion supporting gas.