Patents by Inventor Hirotake Baba

Hirotake Baba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6866718
    Abstract: A sealant applicator 1 is provided for applying a waterproofing treatment to a wire assembly, a plurality of wires are aligned in a line according to their diameters in a holder 4 provided on a wire laying board 3. Positioning members 21 of a main unit 2 are fitted to the holder 4. A pair of nozzles 22 are opposed to each other at the opposite sides of the aligned wires, and is caused to discharge a specified amount of the sealant by a feeding mechanism 26 while being moved in a wire alignment direction by a moving mechanism 27 and being brought closer to the wires by a relatively moving mechanism 25. This enables a variation of clearances between the wires and the nozzles to be reduced and the sealant to be uniformly applied.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: March 15, 2005
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Hisato Chujo, Koshi Abe, Hirotake Baba, Kenichi Uchiyama
  • Publication number: 20030037726
    Abstract: A sealant applicator 1 is provided for applying a waterproofing treatment to a wire assembly, a plurality of wires are aligned in a line according to their diameters in a holder 4 provided on a wire laying board 3. Positioning members 21 of a main unit 2 are fitted to the holder 4. A pair of nozzles 22 are opposed to each other at the opposite sides of the aligned wires, and is caused to discharge a specified amount of the sealant by a feeding mechanism 26 while being moved in a wire alignment direction by a moving mechanism 27 and being brought closer to the wires by a relatively moving mechanism 25. This enables a variation of clearances between the wires and the nozzles to be reduced and the sealant to be uniformly applied.
    Type: Application
    Filed: October 16, 2002
    Publication date: February 27, 2003
    Applicant: Sumitomo Wiring Systems, Ltd.
    Inventors: Hisato Chujo, Koshi Abe, Hirotake Baba, Kenichi Uchiyama