Patents by Inventor Hiroto Ohsaki

Hiroto Ohsaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light-emitting device
    Patent number: 9360204
    Abstract: A light-emitting device includes a light-emitting element and a wavelength conversion layer. The light-emitting device further includes the translucent member having a translucent base and the wavelength conversion layer formed on the translucent base. The wavelength conversion layer does not contact the light-emitting element, and is sealed in the light-emitting device.
    Type: Grant
    Filed: April 21, 2014
    Date of Patent: June 7, 2016
    Assignee: PANASONIC CORPORATION
    Inventors: Toshiyuki Fukuda, Yutaka Harada, Hiroto Ohsaki, Toshio Fujii
  • LIGHT-EMITTING DEVICE
    Publication number: 20140226308
    Abstract: A light-emitting device includes a light-emitting element and a wavelength conversion layer. The light-emitting device further includes the translucent member having a translucent base and the wavelength conversion layer formed on the translucent base. The wavelength conversion layer does not contact the light-emitting element, and is sealed in the light-emitting device.
    Type: Application
    Filed: April 21, 2014
    Publication date: August 14, 2014
    Applicant: PANASONIC CORPORATION
    Inventors: Toshiyuki FUKUDA, Yutaka HARADA, Hiroto OHSAKI, Toshio FUJII
  • Semiconductor device and manufacturing method thereof, and camera module including the same
    Patent number: 8227814
    Abstract: A semiconductor device includes: an insulating base; a semiconductor element provided on the insulating base; a protector provided on the semiconductor element; and a frame provided on a periphery of the insulating base and surrounding the semiconductor element. A region inside the frame is filled with a sealing resin, and at least one groove is provided in an upper corner portion of the frame on the semiconductor element side of the frame.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: July 24, 2012
    Assignee: Panasonic Corporation
    Inventors: Shoichi Tanaka, Hiroto Ohsaki
  • Semiconductor device and manufacturing method thereof, and camera module including the same
    Patent number: 7973323
    Abstract: A semiconductor device includes: an insulating base; a semiconductor element provided on the insulating base; a protector provided on the semiconductor element; and a frame provided on a periphery of the insulating base and surrounding the semiconductor element. A region inside the frame is filled with a sealing resin, and at least one groove is provided in an upper corner portion of the frame on the semiconductor element side of the frame.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: July 5, 2011
    Assignee: Panasonic Corporation
    Inventors: Shoichi Tanaka, Hiroto Ohsaki
  • OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20090230408
    Abstract: An optical device includes a semiconductor substrate including a device region formed thereon, the device region including at least one of a light-receiving region and a light-emitting region; a light-transmissive flattening film covering the device region, and including a first concave portion located in a region on an outer side of the device region; a light-transmissive member formed on the light-transmissive flattening film; and a light-transmissive adhesive layer bonding together the light-transmissive flattening film and the light-transmissive member, and filling the first concave portion.
    Type: Application
    Filed: March 2, 2009
    Publication date: September 17, 2009
    Inventors: Hu Meng, Hiroto Ohsaki
  • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND CAMERA MODULE INCLUDING THE SAME
    Publication number: 20090146174
    Abstract: A semiconductor device includes: an insulating base; a semiconductor element provided on the insulating base; a protector provided on the semiconductor element; and a frame provided on a periphery of the insulating base and surrounding the semiconductor element. A region inside the frame is filled with a sealing resin, and at least one groove is provided in an upper corner portion of the frame on the semiconductor element side of the frame.
    Type: Application
    Filed: September 29, 2008
    Publication date: June 11, 2009
    Inventors: Shoichi TANAKA, Hiroto Ohsaki