Abstract: A semiconductor apparatus examination method includes a step of detecting light from a plurality of positions in a semiconductor apparatus (D) and acquiring a waveform corresponding to each of the plurality of positions, a step of extracting a waveform corresponding to a specific timing from the waveform corresponding to each of the plurality of positions and generating an image corresponding to the specific timing based on the extracted waveform, and a step of extracting a feature point based on a brightness distribution correlation value in the image corresponding to the specific timing and identifying a position of a drive element in the semiconductor apparatus based on the feature point.

Abstract: A solid immersion lens unit includes a solid immersion lens having a contact surface for coming into contact with semiconductor device formed of a silicon substrate and a spherical surface to be disposed to face an objective lens; a holder holding the solid immersion lens; and an optical element held by the holder to be positioned between the objective lens and the solid immersion lens. The solid immersion lens transmits light having at least a part of wavelength in a range of 200 nm or greater and 1100 nm or lower. The optical element corrects aberration caused by a difference in refractive indices between the silicon substrate and the solid immersion lens.

Abstract: Provided is a cooling unit to be used in an inspection of a semiconductor device. The cooling unit includes a jacket for dissipating heat of the semiconductor device. The jacket is provided with a light passing portion for passing light from the semiconductor device. The jacket has a space defining surface that faces the semiconductor device and defines a space between the space defining surface and the semiconductor device in a state where the light passing portion faces the semiconductor device. The jacket is provided with a supply flow path through which a fluid to be supplied to the space flows.

Abstract: The present disclosure relates to a metalens unit including a metalens having a structure for reducing a thickness. The metalens unit includes a metalens and a holding portion for the metalens. The metalens includes a base portion and a first antenna portion. The first antenna portion is constituted by a plurality of first antennas each having a first refractive index and a first intermediate portion having a second refractive index and positioned between the plurality of first antennas. A first antenna portion is formed such that one-dimensional arrangement constituted by some of end surfaces of the plurality of first antennas includes a pattern in which at least one of a size of the end surface, a shape of the end surface, and an arrangement pitch is changed along a reference line.

Abstract: A semiconductor apparatus examination method includes a step of detecting light from a plurality of positions in a semiconductor apparatus (D) and acquiring a waveform corresponding to each of the plurality of positions, a step of extracting a waveform corresponding to a specific timing from the waveform corresponding to each of the plurality of positions and generating an image corresponding to the specific timing based on the extracted waveform, and a step of extracting a feature point based on a brightness distribution correlation value in the image corresponding to the specific timing and identifying a position of a drive element in the semiconductor apparatus based on the feature point.

Abstract: A confocal microscope unit according to an embodiment includes: a first subunit which includes a light source, a pinhole plate, and a photodetector; a second subunit which includes a light source, a pinhole plate, and a photodetector; a scan mirror which scans excitation light output from the first and second subunits on a sample via a microscope optical system and guides fluorescence generated from the sample in response to the excitation light and focused by the microscope optical system to the first and second subunits; and a main housing which is attachable to a connection port and to which the scan mirror, the first subunit, and the second subunit are fixed, wherein the first subunit and the second subunit are disposed in the main housing so that incident angles of two excitation lights to the scan mirror are displaced from each other by a predetermined angle.

Abstract: Embodiments are for a confocal microscope unit attached to a connection port of a microscope including: light sources which output irradiation light to a sample to be observed; photodetectors which detect observation light generated from a sample in response to the irradiation light; a scan mirror which scans the irradiation light on the sample and guides the observation light generated from the sample to the photodetectors; a scan lens which guides the irradiation light scanned by the scan mirror to the microscope optical system and guides the observation light focused by the microscope optical system to the scan mirror; a lens barrel to which the scan lens is fixed; an attachment portion which attaches the lens barrel to the connection port; and a movable portion which supports the lens barrel so that an angle of the lens barrel with respect to the attachment portion is changeable.

Abstract: A confocal microscope unit according to an embodiment includes: a first subunit which includes a light source, a pinhole plate, and a photodetector; a second subunit which includes a light source, a pinhole plate, and a photodetector; a scan mirror which scans excitation light on a sample and guides fluorescence generated from the sample to the first and second subunits; a scan lens which guides the excitation light and guides the fluorescence to the scan mirror; and a main housing which is attachable to a connection port and to which the scan mirror, the scan lens, and the subunits are fixed, wherein the first subunit includes a dichroic mirror that separates the excitation light and fluorescence handled by the own unit from those handled by the second subunit.

Abstract: Provided is a cooling unit to be used in an inspection of a semiconductor device. The cooling unit includes a jacket for dissipating heat of the semiconductor device. The jacket is provided with a light passing portion for passing light from the semiconductor device. The jacket has a space defining surface that faces the semiconductor device and defines a space between the space defining surface and the semiconductor device in a state where the light passing portion faces the semiconductor device. The jacket is provided with a supply flow path through which a fluid to be supplied to the space flows.

Abstract: A solid immersion lens unit includes a solid immersion lens having a contact surface for coming into contact with semiconductor device formed of a silicon substrate and a spherical surface to be disposed to face an objective lens; a holder holding the solid immersion lens; and an optical element held by the holder to be positioned between the objective lens and the solid immersion lens. The solid immersion lens transmits light having at least a part of wavelength in a range of 200 nm or greater and 1100 nm or lower. The optical element corrects aberration caused by a difference in refractive indices between the silicon substrate and the solid immersion lens.

Abstract: The present disclosure relates to a metalens unit including a metalens having a structure for reducing a thickness. The metalens unit includes a metalens and a holding portion for the metalens. The metalens includes a base portion and a first antenna portion. The first antenna portion is constituted by a plurality of first antennas each having a first refractive index and a first intermediate portion having a second refractive index and positioned between the plurality of first antennas. A first antenna portion is formed such that one-dimensional arrangement constituted by some of end surfaces of the plurality of first antennas includes a pattern in which at least one of a size of the end surface, a shape of the end surface, and an arrangement pitch is changed along a reference line.

Abstract: An inspection system includes a laser light source, an optical system for laser marking that irradiates a semiconductor device with laser light from a metal layer side, a control unit that controls the laser light source to control laser marking, a two-dimensional camera that detects light from the semiconductor device on a substrate side and outputs an optical reflection image, and an analysis unit that generates a pattern image of the semiconductor device, and the control unit controls the laser light source so that laser marking is performed until a mark image appears in a pattern image.

Abstract: A photostimulation apparatus includes an objective lens arranged to face a biological object, a light source configured to output light to be radiated toward the biological object via the objective lens, a shape acquisition unit configured to acquire information about a shape with a refractive index difference in the biological object, a hologram generation unit configured to generate aberration correction hologram data for correcting aberrations due to the shape with the refractive index difference on the basis of the information acquired by the shape acquisition unit, and a spatial light modulator on which a hologram based on the aberration correction hologram data is presented and which modulates the light output from the light source.

Abstract: A solid immersion lens holder includes a first member having a first opening disposing a spherical face portion therein so that a part of the spherical face portion protrudes toward an objective lens side and a second member having a second opening disposing a contact portion therein so that a contact face protrudes toward a side opposite to the objective lens side. The first member includes three protrusion portions extending from an inner face of the first opening toward a center of the first opening and configured to be contactable with the spherical face portion.

Abstract: A solid immersion lens holder includes a first member having a first opening disposing a spherical face portion therein so that a part of the spherical face portion protrudes toward an objective lens side and a second member having a second opening disposing a contact portion therein so that a contact face protrudes toward a side opposite to the objective lens side. The first member includes three plate members disposed on the objective lens side with respect to the first opening. Each of the three plate members is provided with a protrusion portion capable of contacting the spherical face portion.

Abstract: An optical module (1A) includes a polarization beam splitter (10A) having a light splitting surface (11), polarization elements (20, 40), and respectively arranged on an optical path of a first polarization component (L2) transmitted through the light splitting surface (11) and an optical path of a second polarization component (L4) reflected by the light splitting surface (11), a reflective SLM (30) that modulates and reflects the first polarization component (L2) passing through the polarization element (20), and a reflective SLM (50) that modulates and reflects the second polarization component (L4) passing through the polarization element (40). The first modulation light (L3) passing through the polarization element (20) again and then reflected by the light splitting surface (11) and the second modulation light (L5) passing through the polarization element (40) again and then transmitted through the light splitting surface (11) are combined with each other.

Abstract: An inspection system includes a laser light source, an optical system for laser marking that irradiates a semiconductor device with laser light from a metal layer side, a control unit that controls the laser light source to control laser marking, a two-dimensional camera that detects light from the semiconductor device on a substrate side and outputs an optical reflection image, and an analysis unit that generates a pattern image of the semiconductor device, and the control unit controls the laser light source so that laser marking is performed until a mark image appears in a pattern image.

Abstract: An inspection system includes a laser light source, an optical system for laser marking that irradiates a semiconductor device with laser light from a metal layer side, a control unit that controls the laser light source to control laser marking, a two-dimensional camera that detects light from the semiconductor device on a substrate side and outputs an optical reflection image, and an analysis unit that generates a pattern image of the semiconductor device, and the control unit controls the laser light source so that laser marking is performed until a mark image appears in a pattern image.

Abstract: A microscope apparatus (1A) includes a biological sample table (11) that supports the biological sample (B), an objective lens (12) disposed to face the biological sample table (11), a laser light source (13) that outputs light with which the biological sample (B) is irradiated via the objective lens (12), a shape measurement unit (20) that acquires a surface shape of the biological sample (B), a control unit (40) that generates aberration correction hologram data for correcting an aberration caused by the surface shape of the biological sample (B) on the basis of information acquired in the shape measurement unit (20), a first spatial light modulator (33) to which a hologram based on the aberration correction hologram data is presented and that modulates the light output from the laser light source (31), and a photodetector (37) that detects an intensity of light to be detected (L2) generated in the biological sample (B).

Abstract: An optical unit includes a relay optical system configured to relay a primary image forming surface of an optical microscope to a secondary image forming surface of a side of an imaging device, an optical element holder disposed on an optical axis in the relay optical system, a field lens disposition portion configured to dispose a field lens on the optical axis on a front stage side of the optical element holder, and a Bertrand lens insertion/extraction portion configured to dispose a Bertrand lens on the optical axis on a rear stage side of the optical element holder so that insertion and extraction of the Bertrand lens are possible.