Abstract: A touch type input device includes: a resistive film; an electrode formed along a portion of an outer periphery of the resistive film; a conductor installed with a gap between the resistive film and the conductor; a first line drawn from the electrode; and a second line connected to the conductor, wherein the resistive film and the conductor are configured to contact in a position touched by a user.

Abstract: A package includes: a plurality of lead frames configured to extend inwardly from an outer circumferential portion of the package; a die pad region surrounded with the lead frames in a plane view; a semiconductor chip mounted on the die pad region; a plurality of bonding pads disposed on the semiconductor chip; and a plurality of bonding wires configured to connect the lead frames and the bonding pads, respectively, wherein the bonding wires are respectively connected to front end portions of the lead frames by bonding with an angle ranging from 45 to 135 degrees with respect to a trace of front end portions of the lead frames in the plane view.

Abstract: The door handle device includes: a contact sensing unit including a guide groove and a contact sensing electrode, the guide groove configured to guide a water droplet falling on a door, the contact sensing electrode disposed in the guide groove and configured to sense a contact with the door; a locking unit configured to execute unlocking and locking of a door; and a control unit configured to instruct to the locking unit to keep locking the door if determining that the water droplet is in contact with the door, on the basis of a sensing result by the contact sensing electrode. There are provided: a contact sensing device; a door handle device and a control method for such a door handle device; and an electronic key system, for preventing a misoperation due to a water droplet adhering to a door handle of vehicles, which has an electrostatic locking mechanism.

Abstract: A package-in-substrate includes an exposed pad having a surface that is capable of contacting the outside; a semiconductor chip arranged on a surface opposite to the surface of the exposed pad; a molding resin for molding the semiconductor chip; and a lead frame extending from a side surface of the molding resin and having a leading end portion with a machined shape. The leading end portion of the lead frame is cut to have a cutting angel that is an acute angle formed by an extended straight line of the lead frame with respect to a top surface of a package.

Abstract: A package includes: a plurality of lead frames configured to extend inwardly from an outer circumferential portion of the package; a die pad region surrounded with the lead frames in a plane view; a semiconductor chip mounted on the die pad region; a plurality of bonding pads disposed on the semiconductor chip; and a plurality of bonding wires configured to connect the lead frames and the bonding pads, respectively, wherein the bonding wires are respectively connected to front end portions of the lead frames by bonding with an angle ranging from 45 to 135 degrees with respect to a trace of front end portions of the lead frames in the plane view.

Abstract: A package includes: a plurality of lead frames configured to extend inwardly from an outer circumferential portion of the package; a die pad region surrounded with the lead frames in a plane view; a semiconductor chip mounted on the die pad region; a plurality of bonding pads disposed on the semiconductor chip; and a plurality of bonding wires configured to connect the lead frames and the bonding pads, respectively, wherein the bonding wires are respectively connected to front end portions of the lead frames by bonding with an angle ranging from 45 to 135 degrees with respect to a trace of front end portions of the lead frames in the plane view.

Abstract: A package-in-substrate includes an exposed pad having a surface that is capable of contacting the outside; a semiconductor chip arranged on a surface opposite to the surface of the exposed pad; a molding resin for molding the semiconductor chip; and a lead frame extending from a side surface of the molding resin and having a leading end portion with a machined shape. The leading end portion of the lead frame is cut to have a cutting angel that is an acute angle formed by an extended straight line of the lead frame with respect to a top surface of a package.

Abstract: A package includes: a plurality of lead frames configured to extend inwardly from an outer circumferential portion of the package; a die pad region surrounded with the lead frames in a plane view; a semiconductor chip mounted on the die pad region; a plurality of bonding pads disposed on the semiconductor chip; and a plurality of bonding wires configured to connect the lead frames and the bonding pads, respectively, wherein the bonding wires are respectively connected to front end portions of the lead frames by bonding with an angle ranging from 45 to 135 degrees with respect to a trace of front end portions of the lead frames in the plane view.

Abstract: An input method using a software keyboard, includes: displaying a software keyboard on a display device having a touch panel; monitoring an input from a user and detecting a sequence including input of an original character string, deletion of some or all of the original character string and re-input of a new character string; acquiring at least one of an incorrect input character contained in the original character string and a corresponding correct input character contained in the new character string; and correcting the software keyboard based on the incorrect input character and the correct input character.

Abstract: A reception interface circuit receives a luminance signal for each of multiple colors and a clock signal as input signals. A timing control unit receives the luminance signals received by the reception interface circuit, and controls the timing and format thereof such that they match drivers. A transmission interface circuit transmits the signals generated by the timing controller IC to the drivers. The timing controller IC is included within a rectangular package as a built-in component. The reception interface circuit is arranged on a first short side of the package. The transmission interface circuit is arranged on a second short side of the package. The image data is input via input terminals arranged on the first short side. The output signals of the transmission interface circuit are output via output terminals arranged on the second short side.

Abstract: A semiconductor device receives differential input signals, performs predetermined signal processing, and outputs differential output signals. Plural rear surface electrodes, disposed in an m-row, n-column (m and n being integers) matrix form, on a rear surface of the semiconductor device, are formed. The rear surface electrodes for the differential input signals or differential output signals are disposed in rows, 1, 2, m?1, and m, or in columns, 1, 2, n?1, and n, of a matrix. Furthermore, a pair of rear surface electrodes for differential input signals that for a pair, and a pair of rear surface electrodes PAD for differential output signals that form a pair, are respectively disposed so as to be adjacent.

Abstract: A mounting substrate having a structure allowing reduction of the cost and an electronic apparatus formed by surface-mounting a semiconductor device thereon are provided. The mounting substrate is a mounting substrate mounted with a semiconductor device having external terminals alignedly arrayed in the form of a matrix, and includes junctions arrayed on a surface to which the semiconductor device is opposed so that the external terminals are bonded thereto respectively and wires connected to the junctions respectively and extracted out of a region to which the semiconductor device is bonded. The wires connected to inwardly arrayed 4 rows by n columns (n: integer of not less than 5) of the junctions respectively are formed on a first wiring layer. The wires connected to the junctions set in two annular arrays surrounding the outer sides of the 4 rows by n columns of junctions respectively are formed on a second wiring layer different from the first wiring layer.

Abstract: A mounting substrate having a structure allowing reduction of the cost and an electronic apparatus formed by surface-mounting a semiconductor device thereon are provided. The mounting substrate is a mounting substrate mounted with a semiconductor device having external terminals alignedly arrayed in the form of a matrix, and includes junctions arrayed on a surface to which the semiconductor device is opposed so that the external terminals are bonded thereto respectively and wires connected to the junctions respectively and extracted out of a region to which the semiconductor device is bonded. The wires connected to inwardly arrayed 4 rows by n columns (n: integer of not less than 5) of the junctions respectively are formed on a first wiring layer. The wires connected to the junctions set in two annular arrays surrounding the outer sides of the 4 rows by n columns of junctions respectively are formed on a second wiring layer different from the first wiring layer.

Abstract: A reception interface circuit receives a luminance signal for each of multiple colors and a clock signal as input signals. A timing control unit receives the luminance signals received by the reception interface circuit, and controls the timing and format thereof such that they match drivers. A transmission interface circuit transmits the signals generated by the timing controller IC to the drivers. The timing controller IC is included within a rectangular package as a built-in component. The reception interface circuit is arranged on a first short side of the package. The transmission interface circuit is arranged on a second short side of the package. The image data is input via input terminals arranged on the first short side. The output signals of the transmission interface circuit are output via output terminals arranged on the second short side.

Abstract: A semiconductor device receives differential input signals, performs predetermined signal processing, and outputs differential output signals. Plural rear surface electrodes, disposed in an m-row, n-column (m and n being integers) matrix form, on a rear surface of the semiconductor device, are formed. The rear surface electrodes for the differential input signals or differential output signals are disposed in rows, 1, 2, m?1, and m, or in columns, 1, 2, n?1, and n, of a matrix. Furthermore, a pair of rear surface electrodes for differential input signals that for a pair, and a pair of rear surface electrodes PAD for differential output signals that form a pair, are respectively disposed so as to be adjacent.