Patents by Inventor Hirotsugu Komiya

Hirotsugu Komiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for evaluating the quality of abrasive grains, polishing method and abrasive for polishing glass
    Patent number: 7025796
    Abstract: A method for evaluating the quality of abrasive grains for polishing glass, which comprises adding abrasive grains to be measured, to an aqueous medium having silica dissolved therein, to have the silica adsorbed on the abrasive grains under such a condition that the silica undergoes substantially no polymerization in the aqueous medium, followed by solid-liquid separation to separate the abrasive grains from the mother liquor, and measuring the concentration of silica remaining in the mother liquor to measure the adsorption rate (?) of silica on the abrasive grains.
    Type: Grant
    Filed: November 21, 2003
    Date of Patent: April 11, 2006
    Assignee: Seimi Chemical Co., Ltd.
    Inventors: Hirotsugu Komiya, Sumihisa Yamaguchi, Tetsufumi Hisatsune, Atsuyoshi Takenaka, Shigeaki Yonemori
  • Method for evaluating the quality of abrasive grains, polishing method and abrasive for polishing glass
    Publication number: 20040139764
    Abstract: A method for evaluating the quality of abrasive grains for polishing glass, which comprises adding abrasive grains to be measured, to an aqueous medium having silica dissolved therein, to have the silica adsorbed on the abrasive grains under such a condition that the silica undergoes substantially no polymerization in the aqueous medium, followed by solid-liquid separation to separate the abrasive grains from the mother liquor, and measuring the concentration of silica remaining in the mother liquor to measure the adsorption rate (&eegr;) of silica on the abrasive grains.
    Type: Application
    Filed: November 21, 2003
    Publication date: July 22, 2004
    Applicant: Seimi Chemical Co., Ltd.
    Inventors: Hirotsugu Komiya, Sumihisa Yamaguchi, Tetsufumi Hisatsune, Atsuyoshi Takenaka, Shigeaki Yonemori