Patents by Inventor Hiroya Fukunga

Hiroya Fukunga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sealant for one drop fill process containing photo-curable resin and heat-curable resin
    Patent number: 8337965
    Abstract: A sealant for a one drop fill process of the invention contains the following components (1), (2), (3), and (4): (1) a curing agent composed of a reaction product produced by reacting an acid compound and a polyamine containing, within its molecule, at least one active hydrogen and at least two nitrogen atoms; (2) a heat-curable resin; (3) an acylphosphine-based photoinitiator; and (4) a photo-curable resin. A heat-curable resin containing a bisphenol A propylene oxide-modified epoxy resin is preferably used as the heat-curable resin (2), and a photo-curable resin containing a bisphenol A acrylate-modified resin is preferably used as the photo-curable resin (4).
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: December 25, 2012
    Assignee: Adeka Corporation
    Inventors: Kazuyuki Itano, Hiroya Fukunga, Hirokatsu Shinano, Rieko Hamada, Takahiro Otsuka
  • SEALANT FOR ONE DROP FILL PROCESS CONTAINING PHOTO-CURABLE RESIN AND HEAT-CURABLE RESIN
    Publication number: 20110054061
    Abstract: A sealant for a one drop fill process of the invention contains the following components (1), (2), (3), and (4): (1) a curing agent composed of a reaction product produced by reacting an acid compound and a polyamine containing, within its molecule, at least one active hydrogen and at least two nitrogen atoms; (2) a heat-curable resin; (3) an acylphosphine-based photoinitiator; and (4) a photo-curable resin. A heat-curable resin containing a bisphenol A propylene oxide-modified epoxy resin is preferably used as the heat-curable resin (2), and a photo-curable resin containing a bisphenol A acrylate-modified resin is preferably used as the photo-curable resin (4).
    Type: Application
    Filed: January 5, 2010
    Publication date: March 3, 2011
    Applicant: ADEKA CORPORATION
    Inventors: Kazuyuki Itano, Hiroya Fukunga, Hirokatsu Shinano, Rieko Hamada, Takahiro Otsuka