Abstract: As an embodiment, a pair of first conductive films 12, 13 are formed from the side face to the bottom face of the sheet part 11a of a magnetic core 11, and one end 14b of the conductive wire of the coil 14 and the other end 14c of the conductive wire are joined to the side faces 12a, 13a of the first conductive films 12, 13, respectively. Also, as an embodiment, the joined parts 14b1, 14c1 are sandwiched by the side faces 12a, 13a of the first conductive films 12, 13 and the part 15a of the magnetic sheath 15 covering the side face of the sheet part 11a of the magnetic core 11, wherein the parts of the magnetic sheath 15 covering the joined parts 14b1, 14c1 are sandwiched by the side faces 12a, 13a of the first conductive films 12, 13 and the side faces 16a, 17a of second conductive films 16, 17 as well as the side faces 18a, 19a of third conductive films 18, 19.

Abstract: As an embodiment, a pair of first conductive films 12, 13 are formed from the side face to the bottom face of the sheet part 11a of a magnetic core 11, and one end 14b of the conductive wire of the coil 14 and the other end 14c of the conductive wire are joined to the side faces 12a, 13a of the first conductive films 12, 13, respectively. Also, as an embodiment, the joined parts 14b1, 14c1 are sandwiched by the side faces 12a, 13a of the first conductive films 12, 13 and the part 15a of the magnetic sheath 15 covering the side face of the sheet part 11a of the magnetic core 11, wherein the parts of the magnetic sheath 15 covering the joined parts 14b1, 14c1 are sandwiched by the side faces 12a, 13a of the first conductive films 12, 13 and the side faces 16a, 17a of second conductive films 16, 17 as well as the side faces 18a, 19a of third conductive films 18, 19.

Abstract: An electronic part is made from a laminated object including stacked abutting ceramic green sheets each carrying an electrically conductive paste having a contact portion in proximity to an edge of the sheet. The laminated object is fired to form a laminated body including ceramic insulator layers abutting electrically conductive internal electrode layers including contact segments in proximity to a side of the object. The body is then processed so the contact segments are exposed on the side of the object. Then an external electrode is formed on the polished body where the contact segment is exposed by using a dry process so the external electrode and the contact segment abut to establish an electric contact between the external electrode and the contact segments. The firing step causes the paste to move relative to the edges of the sheets so the contact segments are displaced relative to the edges of the sheets.

Abstract: An electronic device has an element assembly, in which electronic parts elements are disposed, and external electrodes of metal film which are formed on surfaces of the element assembly of the electronic device so as to extend and connect to the electronic parts elements, respectively. Further, in this electronic device, the external electrode is made up of an anchor layer adhered on the surface of the element assembly of the electronic device, a solder-resist layer formed to cover the anchor layer, and a solder-wettable layer formed to cover a surface of the solder-resistant layer and showing a superior wettability with respect to molten solder, in which the external electrode further includes an intermediate layer provided between the solder-resistant layer and the solder-wettable layer and made of an alloy containing both metal materials forming the solder-resistant layer and the solder-wettable layer.

Abstract: An electronic device has an element assembly, in which electronic parts elements are disposed, and external electrodes of metal film which are formed on surfaces of the element assembly of the electronic device so as to extend and connect to the electronic parts elements, respectively. Further, in this electronic device, the external electrode is made up of an anchor layer adhered on the surface of the element assembly of the electronic device, a solder-resist layer formed to cover the anchor layer, and a solder-wettable layer formed to cover a surface of the solder-resistant layer and showing a superior wettability with respect to molten solder, in which the external electrode further comprises an intermediate layer provided between the solder-resistant layer and the solder-wettable layer and made of an alloy containing both metal materials forming the solder-resistant layer and the solder-wettable layer.