Abstract: The long sides of a rectangular control chip and the long sides of a rectangular memory chip are arranged parallel with first sides of the upper surface of a wiring substrate in a BGA. A lid includes a pair of first brims and a pair of second brims, the widths of the second brims are formed wider than those of the first brims, and a mounting area for mounting chip parts and a junction base area for joining the lid are secured outside the short sides of the control chip mounted on the upper surface of the wiring substrate and outside the short sides of the memory chip mounted on the upper surface of the wiring substrate, which enables the wide-width second brims of the lid to be disposed on the junction base area. Hence, the mounting area of the BGA can be reduced.

Abstract: The long sides of a rectangular control chip and the long sides of a rectangular memory chip are arranged parallel with first sides of the upper surface of a wiring substrate in a BGA. A lid includes a pair of first brims and a pair of second brims, the widths of the second brims are formed wider than those of the first brims, and a mounting area for mounting chip parts and a junction base area for joining the lid are secured outside the short sides of the control chip mounted on the upper surface of the wiring substrate and outside the short sides of the memory chip mounted on the upper surface of the wiring substrate, which enables the wide-width second brims of the lid to be disposed on the junction base area. Hence, the mounting area of the BGA can be reduced.

Abstract: A semiconductor device including a substrate, a semiconductor chip mounted on the substrate, and an encapsulation resin encapsulating the semiconductor chip, wherein the encapsulation resin contains a first resin region composed of a first resin composition, a second resin region composed of a second resin composition, and a mixed layer formed between the first resin region and the second resin region so as to have the first resin composition and the second resin composition mixed therein is provided.

Abstract: Differences in contraction forces of a sealing resin can be alleviated and strain on a package can be reduced even when electronic components are unevenly positioned on a substrate. An electronic device (100) includes a substrate 102, electronic components (104, 108) mounted on one face of the substrate 102, and a sealing resin 118 formed on the one face of the substrate 102 and which seals the electronic components. The sealing resin 118 includes a first resin region 120 made up of a first resin composition and a second resin region 122 made up of a second resin composition, and is formed so as to have, as seen in planar view, a region in which only the first resin region 120 exists and a region in which only the second resin region 122 exists.

Abstract: A semiconductor device including a substrate, a semiconductor chip mounted on the substrate, and an encapsulation resin encapsulating the semiconductor chip, wherein the encapsulation resin contains a first resin region composed of a first resin composition, a second resin region composed of a second resin composition, and a mixed layer formed between the first resin region and the second resin region so as to have the first resin composition and the second resin composition mixed therein is provided.

Abstract: A bumper absorber includes an upper leg and a lower leg, each of which extends in a longitudinal direction of an automobile, and a spanning portion. The spanning portion connects the upper leg and the lower leg, and faces an outer surface side of the bumper absorber in a longitudinal direction of the automobile. Each of the upper leg and the lower leg includes a buckling inductive portion that serves as a starting point of the buckling that is caused when the spanning portion receives an impact load. The buckling inductive portion is formed as an angular transition portion in which the angle of inclination between inner side surfaces changes. The inner side surfaces mutually face between the upper leg and the lower leg that include the buckling inductive portion.

Abstract: It is an object of the present invention to provide a shock absorbing structure for a vehicle that enables a simple and appropriate tuning of a load displacement characteristic, so that a desired amount of collision energy can be absorbed. In the present invention, each of two side walls which is integrally provided with top wall, to which a shock is applied, has a rectangular wave shape corrugated at a plurality of corrugated sections positioned to be opposed to each other in a direction perpendicular to a direction in which the shock is applied. In addition, outer flanges are integrally formed on an end section of each of the side walls, and a slit extending in the direction in which the shock is applied is formed on each of the corrugated sections.

Abstract: A bumper absorber (2) includes an upper leg (2b) and a lower leg (2c), each of which extends in a longitudinal direction of an automobile, and a spanning portion (2d). The spanning portion (2d) connects the upper leg (2b) and the lower leg (2c), and faces an outer surface side of the bumper absorber (2) in a longitudinal direction of the automobile. Each of the upper leg (2b) and the lower leg (2c) includes a buckling inductive portion (2f that serves as a starting point of the buckling that is caused when the spanning portion (2d) receives an impact load. The buckling inductive portion (2f) is formed as an angular transition portion in which the angle of inclination between inner side surfaces changes. The inner side surfaces mutually face between the upper leg (2b) and the lower leg (2c) that include the buckling inductive portion (2f).

Abstract: It is an object of the present invention to provide a shock absorbing structure for a vehicle that enables a simple and appropriate tuning of a load displacement characteristic, so that a desired amount of collision energy can be absorbed. In the present invention, each of two side walls which is integrally provided with top wall, to which a shock is applied, has a rectangular wave shape corrugated at a plurality of corrugated sections positioned to be opposed to each other in a direction perpendicular to a direction in which the shock is applied. In addition, outer flanges are integrally formed on an end section of each of the side walls, and a slit extending in the direction in which the shock is applied is formed on each of the corrugated sections.