Abstract: A power conversion device comprises a power conversion circuit, and a multilayer substrate that includes the power conversion circuit, and has a wiring pattern. The wiring pattern of the multilayer substrate includes a power supply pattern, and a ground pattern. The multilayer substrate includes a first layer and a second layer. The power supply pattern includes a first layer power supply pattern portion in the first layer. The ground pattern includes a second layer ground pattern portion in the second layer. The first layer power supply pattern portion and the second layer ground pattern portion overlap with each other at least in part in a direction perpendicular to a plate surface of the multilayer substrate.

Abstract: A driving device includes an electric motor, a rotating shaft, a motor housing, a printed circuit board, an electric power converting circuit, a rear frame end working as a heat radiating member, gel working as a heat transfer member, multiple mounted parts and so on. The heat radiating member is located on a side of the printed circuit board and facing a motor-side surface of the printed circuit board, to which multiple switching elements are mounted. The gel is plastically deformed and adhered to the switching elements and the heat radiating member for transferring heat of the switching elements to the heat radiating member. At least one of the mounted parts is mounted to the printed circuit board and located at a position between a through-hole opposing area and one of the switching elements, which is located at a position closest to a rotational angle sensor mounted to the printed circuit board in the through-hole opposing area.

Abstract: A power conversion device comprise: a power conversion circuit that is configured to convert a supplied electric power to output the converted power; a control circuit that is configured to control an operation of the power conversion circuit; a multilayer substrate that has a different layers, power wiring patterns of the power conversion circuit and a control wiring pattern of the control circuit being arranged on the multilayer substrate, the power wiring patterns being disposed in different layers of the multilayer substrate; a via that extends across the power wiring patterns in the different layers; and a solid-shaped conductive member that is provided in the via to electrically connect the respective power wiring patterns to each other.

Abstract: A power conversion device comprises: a power conversion circuit that converts a supplied electric power; a current detection circuit that detects a current; a control circuit that controls an operation of the power conversion circuit; and a multilayer substrate that is provided with the power conversion circuit, the current detection circuit, and the control circuit. The multilayer substrate includes a printed wiring, and the printed wiring includes a transmission pattern that transmits a detection signal detected by the current detection circuit to the control circuit. An on-off fluctuation unit of the power conversion circuit fluctuates. The whole of the transmission pattern is disposed at a position different from the on-off fluctuation unit in a direction perpendicular to a plate surface of the multilayer substrate.

Abstract: A redundant circuit device including a first system circuit and a second system circuit having identical function, the redundant circuit device comprises: a substrate that is partitioned into a first region in which a part of the first system circuit is provided and a second region in which a part of the second system circuit is provided, each of the first region and the second region having a printed wiring; a first mount component that is included in the first system circuit, has three or more pins, and is surface-mounted on one surface of the substrate; and a second mount component that is included in the second system circuit, has an identical number of pins as that of the first mount component and having an identical function as that of the first mount component, and is surface-mounted on the one surface.

Abstract: An electronic apparatus includes a wiring board. The wiring board includes a wiring and a through-hole and is provided by dividing a multi-board providing board into the wiring board. The electronic apparatus further includes a circuit component having a surface mounting structure, mounted to the wiring board, and electrically connected to the wiring. A side wall of the wiring board has a cut portion that is provided when cutting and dividing the multi-board providing board. In the wiring board, the through-hole is formed adjacent to the cut portion without arranging the circuit component between the cut portion and the through-hole.

Abstract: A drive device for use in a vehicle includes a motor, a substrate, and at least one inter-system ground connection capacitor. The motor includes a plurality of motor windings within one housing. Multiple inverters are mounted on the substrate. Each inverter is connected to a different battery and a different ground to form a system, where each of the motor windings is associated with its own system. The inter-system ground connection capacitor is mounted on the substrate, and electrically connects the grounds of the systems together to reduce electrical noise propagated outside the drive device to other parts in the vehicle.

Abstract: An electronic apparatus includes a wiring board. The wiring board includes a wiring and a through-hole and is provided by dividing a multi-board providing board into the wiring board. The electronic apparatus further includes a circuit component having a surface mounting structure, mounted to the wiring board, and electrically connected to the wiring. A side wall of the wiring board has a cut portion that is provided when cutting and dividing the multi-board providing board. In the wiring board, the through-hole is formed adjacent to the cut portion without arranging the circuit component between the cut portion and the through-hole.

Abstract: A power conversion device comprises a power conversion circuit, and a multilayer substrate that includes the power conversion circuit, and has a wiring pattern. The wiring pattern of the multilayer substrate includes a power supply pattern, and a ground pattern. The multilayer substrate includes a first layer and a second layer. The power supply pattern includes a first layer power supply pattern portion in the first layer. The ground pattern includes a second layer ground pattern portion in the second layer. The first layer power supply pattern portion and the second layer ground pattern portion overlap with each other at least in part in a direction perpendicular to a plate surface of the multilayer substrate.

Abstract: A power conversion device comprises: a power conversion circuit that converts a supplied electric power; a current detection circuit that detects a current; a control circuit that controls an operation of the power conversion circuit; and a multilayer substrate that is provided with the power conversion circuit, the current detection circuit, and the control circuit. The multilayer substrate includes a printed wiring, and the printed wiring includes a transmission pattern that transmits a detection signal detected by the current detection circuit to the control circuit. An on-off fluctuation unit of the power conversion circuit fluctuates. The whole of the transmission pattern is disposed at a position different from the on-off fluctuation unit in a direction perpendicular to a plate surface of the multilayer substrate.

Abstract: A driving device includes an electric motor, a rotating shaft, a motor housing, a printed circuit board, an electric power converting circuit, a rear frame end working as a heat radiating member, gel working as a heat transfer member, multiple mounted parts and so on. The heat radiating member is located on a side of the printed circuit board and facing a motor-side surface of the printed circuit board, to which multiple switching elements are mounted. The gel is plastically deformed and adhered to the switching elements and the heat radiating member for transferring heat of the switching elements to the heat radiating member. At least one of the mounted parts is mounted to the printed circuit board and located at a position between a through-hole opposing area and one of the switching elements, which is located at a position closest to a rotational angle sensor mounted to the printed circuit board in the through-hole opposing area.

Abstract: A power conversion device comprise: a power conversion circuit that is configured to convert a supplied electric power to output the converted power; a control circuit that is configured to control an operation of the power conversion circuit; a multilayer substrate that has a different layers, power wiring patterns of the power conversion circuit and a control wiring pattern of the control circuit being arranged on the multilayer substrate, the power wiring patterns being disposed in different layers of the multilayer substrate; a via that extends across the power wiring patterns in the different layers; and a solid-shaped conductive member that is provided in the via to electrically connect the respective power wiring patterns to each other.

Abstract: A redundant circuit device including a first system circuit and a second system circuit having identical function, the redundant circuit device comprises: a substrate that is partitioned into a first region in which a part of the first system circuit is provided and a second region in which a part of the second system circuit is provided, each of the first region and the second region having a printed wiring; a first mount component that is included in the first system circuit, has three or more pins, and is surface-mounted on one surface of the substrate; and a second mount component that is included in the second system circuit, has an identical number of pins as that of the first mount component and having an identical function as that of the first mount component, and is surface-mounted on the one surface.

Abstract: An electronic control unit has a substrate that includes a terminal connection portion that is a through hole that extends through the substrate from a first surface to a second surface. A resist opening along an outer edge of the terminal connection portion exposes a circuit pattern from a surface resist layer. A plurality of vias are disposed at positions adjacent to the resist opening in a heat receiving area to facilitate the transfer of heat during a soldering process from the first surface to the second surface.

Abstract: In an electronic control unit, a current circuit part is provided on a substrate and includes a switching element. During the control of a control target, a current having a relatively large value of a predetermined value or more flows in the current circuit part. A control circuit part is provided on the substrate and includes a control part that controls actuation of the switching element on the basis of a control signal to control the control target. A current input part is provided on the substrate so as to be located opposite to the control circuit with respect to the current circuit portion. To the current input portion, the current to be supplied to the control target via the current circuit portion is input.

Abstract: A drive device for use in a vehicle includes a motor, a substrate, and at least one inter-system ground connection capacitor. The motor includes a plurality of motor windings within one housing. Multiple inverters are mounted on the substrate. Each inverter is connected to a different battery and a different ground to form a system, where each of the motor windings is associated with its own system. The inter-system ground connection capacitor is mounted on the substrate, and electrically connects the grounds of the systems together to reduce electrical noise propagated outside the drive device to other parts in the vehicle.

Abstract: An electronic control unit has a substrate that includes a terminal connection portion that is a through hole that extends through the substrate from a first surface to a second surface. A resist opening along an outer edge of the terminal connection portion exposes a circuit pattern from a surface resist layer. A plurality of vias are disposed at positions adjacent to the resist opening in a heat receiving area to facilitate the transfer of heat during a soldering process from the first surface to the second surface.

Abstract: A body is located between a protected component and a disturbing object and is inclined relative to a vertical direction. The protected component is located outside an interior of a vehicle. The body includes a lowermost portion in the vertical direction. The lowermost portion has a foreign matter discharge portion. An upper side of the protected component in the vertical direction is at least partially exposed from the body.

Abstract: In an electronic control unit, a current circuit part is provided on a substrate and includes a switching element. During the control of a control target, a current having a relatively large value of a predetermined value or more flows in the current circuit part. A control circuit part is provided on the substrate and includes a control part that controls actuation of the switching element on the basis of a control signal to control the control target. A current input part is provided on the substrate so as to be located opposite to the control circuit with respect to the current circuit portion. To the current input portion, the current to be supplied to the control target via the current circuit portion is input.

Abstract: A circuit board is held by a holding member. A connector portion is located on an opposite side of the circuit board from the holding member. A connector terminal is projected from a portion of the peripheral wall portion, bent at a bent portion toward the circuit board, and connected with the circuit board. The connector terminal includes a projected portion, which is located closer to the peripheral wall portion than the bent portion, and an inserted portion, which is inserted in a through hole of the circuit board. The projected portion is shifted from the inserted portion when viewed from a side of the connector portion.