Patents by Inventor Hiroyoshi Chin

Hiroyoshi Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laminating apparatus and laminating method therefor, and printing apparatus
    Patent number: 8778108
    Abstract: A laminating apparatus is composed of a transporting device for transporting a card, a film supplying device for supplying a film, a compression bonding device for thermally compression bonding a laminate material on the film onto the card, a driving device for shifting the compression bonding device from a standby location to a compression bonding location, a film taking-up device for taking up the film, a first guide for guiding the film in a supply side of the film, a second guide for guiding the film in a take-up side of the film, and a third guide for guiding the film in an upstream side of the second guide and in a downstream side of the compression bonding device, wherein the third guide moves in conjunction with the compression bonding device.
    Type: Grant
    Filed: April 1, 2011
    Date of Patent: July 15, 2014
    Assignee: Victor Company of Japan, Ltd.
    Inventors: Fumio Sato, Hiroyoshi Chin, Tomonori Sumida
  • Laminating apparatus and laminating method therefor, and printing apparatus
    Publication number: 20110265931
    Abstract: A laminating apparatus is composed of a transporting device for transporting a card, a film supplying device for supplying a film, a compression bonding device for thermally compression bonding a laminate material on the film onto the card, a driving device for shifting the compression bonding device from a standby location to a compression bonding location, a film taking-up device for taking up the film, a first guide for guiding the film in a supply side of the film, a second guide for guiding the film in a take-up side of the film, and a third guide for guiding the film in an upstream side of the second guide and in a downstream side of the compression bonding device, wherein the third guide moves in conjunction with the compression bonding device.
    Type: Application
    Filed: April 1, 2011
    Publication date: November 3, 2011
    Applicant: Victor Company of Japan, Ltd.
    Inventors: Fumio Sato, Hiroyoshi Chin, Tomonori Sumida
  • Laminating apparatus mounted with improved mechanism
    Patent number: 7882880
    Abstract: A laminating apparatus is composed of a thermo compression bonding section, a first bobbin holder and a second bobbin holder. The thermo compression bonding section pulls a laminating film having a member for forming a protective film out from a roll of the laminating film, which is wrapped around a core bobbin in a cylindrical shape, and overlaps the protective film on one surface of a card and thermally compresses the protective film against the one surface of the card so as to be bonded.
    Type: Grant
    Filed: April 4, 2007
    Date of Patent: February 8, 2011
    Assignee: Victor Company of Japan, Limited
    Inventor: Hiroyoshi Chin
  • LAMINATING APPARATUS MOUNTED WITH IMPROVED MECHANISM
    Publication number: 20070235141
    Abstract: A laminating apparatus is composed of a thermo compression bonding section, a first bobbin holder and a second bobbin holder. The thermo compression bonding section pulls a laminating film having a member for forming a protective film out from a roll of the laminating film, which is wrapped around a core bobbin in a cylindrical shape, and overlaps the protective film on one surface of a card and thermally compresses the protective film against the one surface of the card so as to be bonded.
    Type: Application
    Filed: April 4, 2007
    Publication date: October 11, 2007
    Applicant: VICTOR COMPANY OF JAPAN, LIMITED
    Inventor: Hiroyoshi Chin