Abstract: An electronic device includes an upper package including an upper chip, a lower package including a lower chip, a printed circuit board above which the upper package and the lower package are laminated, solder balls connecting the upper package and the lower package, solder balls connecting the lower package and the printed circuit board. The lower package has a thermal expansion coefficient set between a thermal expansion coefficient of the upper package and a thermal expansion coefficient of the printed circuit board.

Abstract: A vehicle system includes: a vehicle device; and an external device that is operable alone and communicably connected to the vehicle device. The external device receives data from the vehicle device and enables an access from an external terminal that changes the received data. According to the vehicle system, it is possible to access data obtained from the vehicle device without a person boarding a vehicle, without starting the vehicle device, and with remote operation.

Abstract: A vehicle system of an embodiment includes a vehicular device and an external device solely operable and is communicably connected to the vehicular device. The external device is accessible from an external terminal device, and reflects a result of an access therefrom on the vehicular device.

Abstract: A vehicle system includes: a vehicle device having a first function that is commonly implemented regardless of a type of the vehicle system; and an external device that operates alone and independently from the vehicle device, has a second function that is selectively implemented in accordance with the type, and is connected to the vehicle device via a communication line. The vehicle device is configured to execute the second function via the external device. The external device is configured to execute the first function via the vehicle device.

Abstract: An electronic device includes a circuit board, a lower IC package in which a lower IC chip is sealed on a lower package substrate by a lower resin portion being mounted on the substrate via a lower solder connection portion, and an upper IC package in which an upper IC chip is sealed on an upper package substrate by an upper resin portion being mounted on the lower IC package via an upper solder connection portion. The upper IC package is provided with a rigid body having a smaller linear expansion coefficient in a plane direction than that of the upper resin portion. The rigid body is arranged directly above a boundary between the lower IC chip and the lower resin portion.

Abstract: An electronic device includes a circuit board, a lower IC package in which a lower IC chip is sealed on a lower package substrate by a lower resin portion being mounted on the substrate via a lower solder connection portion, and an upper IC package in which an upper IC chip is sealed on an upper package substrate by an upper resin portion being mounted on the lower IC package via an upper solder connection portion. The upper IC package is provided with a rigid body having a smaller linear expansion coefficient in a plane direction than that of the upper resin portion. The rigid body is arranged directly above a boundary between the lower IC chip and the lower resin portion.

Abstract: An electronic device includes an upper package, a lower package and a printed circuit board. The upper package includes an upper chip. The lower package includes a lower chip. The upper package and the lower package are stacked on the printed circuit board. The thermal diffusion layer is disposed in a vicinity of the lower chip at the lower package.

Abstract: An electronic device includes an upper package including an upper chip, a lower package including a lower chip, a printed circuit board above which the upper package and the lower package are laminated, solder balls connecting the upper package and the lower package, solder balls connecting the lower package and the printed circuit board. The lower package has a thermal expansion coefficient set between a thermal expansion coefficient of the upper package and a thermal expansion coefficient of the printed circuit board.

Abstract: In an electronic device, a silicone adhesive bonding first and second members is made from a composition comprising: (A) 100 parts by mass of an organopolysiloxane containing in one molecule at least two alkenyl groups and being free of silicon-bonded hydroxyl and alkoxy groups wherein the content of cyclic siloxanes having 4 to 20 siloxane units is at most 0.1 mass %; (B) an organopolysiloxane containing in one molecule at least two silicon-bonded hydrogen atoms and being free of an alkenyl group, and silicon-bonded hydroxyl and alkoxy groups; (C) at least 0.05 parts by mass of an adhesion promoter; (D) 100 to 2000 parts by mass of a thermally conductive filler; and (E) a hydrosilylation-reaction catalyst. (B) is contained such that the silicon-bonded hydrogen atoms is in the range of 0.5 to 10 mol per 1 mol of the alkenyl groups of (A), and the sum of (B) and (C) is 0.5 to 10 mass % of the sum of (A), (B) and (C).