Patents by Inventor Hiroyoshi Kunieda

Hiroyoshi Kunieda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11974398
    Abstract: An electronic device includes an upper package including an upper chip, a lower package including a lower chip, a printed circuit board above which the upper package and the lower package are laminated, solder balls connecting the upper package and the lower package, solder balls connecting the lower package and the printed circuit board. The lower package has a thermal expansion coefficient set between a thermal expansion coefficient of the upper package and a thermal expansion coefficient of the printed circuit board.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: April 30, 2024
    Assignee: DENSO CORPORATION
    Inventors: Hiroyoshi Kunieda, Hiroki Hayashi
  • Publication number: 20240037999
    Abstract: A vehicle system includes: a vehicle device; and an external device that is operable alone and communicably connected to the vehicle device. The external device receives data from the vehicle device and enables an access from an external terminal that changes the received data. According to the vehicle system, it is possible to access data obtained from the vehicle device without a person boarding a vehicle, without starting the vehicle device, and with remote operation.
    Type: Application
    Filed: October 11, 2023
    Publication date: February 1, 2024
    Inventors: Hiroyoshi KUNIEDA, Hiroki HAYASHI, Akira TANIMOTO
  • Publication number: 20240038000
    Abstract: A vehicle system of an embodiment includes a vehicular device and an external device solely operable and is communicably connected to the vehicular device. The external device is accessible from an external terminal device, and reflects a result of an access therefrom on the vehicular device.
    Type: Application
    Filed: October 11, 2023
    Publication date: February 1, 2024
    Inventors: Hiroyoshi KUNIEDA, Hiroki HAYASHI, Akira TANIMOTO
  • Publication number: 20240036856
    Abstract: A vehicle system includes: a vehicle device having a first function that is commonly implemented regardless of a type of the vehicle system; and an external device that operates alone and independently from the vehicle device, has a second function that is selectively implemented in accordance with the type, and is connected to the vehicle device via a communication line. The vehicle device is configured to execute the second function via the external device. The external device is configured to execute the first function via the vehicle device.
    Type: Application
    Filed: October 11, 2023
    Publication date: February 1, 2024
    Inventors: Akira TANIMOTO, Hiroyoshi KUNIEDA
  • Publication number: 20230154904
    Abstract: An electronic device includes a circuit board, a lower IC package in which a lower IC chip is sealed on a lower package substrate by a lower resin portion being mounted on the substrate via a lower solder connection portion, and an upper IC package in which an upper IC chip is sealed on an upper package substrate by an upper resin portion being mounted on the lower IC package via an upper solder connection portion. The upper IC package is provided with a rigid body having a smaller linear expansion coefficient in a plane direction than that of the upper resin portion. The rigid body is arranged directly above a boundary between the lower IC chip and the lower resin portion.
    Type: Application
    Filed: June 14, 2022
    Publication date: May 18, 2023
    Inventor: Hiroyoshi KUNIEDA
  • Publication number: 20220310571
    Abstract: An electronic device includes a circuit board, a lower IC package in which a lower IC chip is sealed on a lower package substrate by a lower resin portion being mounted on the substrate via a lower solder connection portion, and an upper IC package in which an upper IC chip is sealed on an upper package substrate by an upper resin portion being mounted on the lower IC package via an upper solder connection portion. The upper IC package is provided with a rigid body having a smaller linear expansion coefficient in a plane direction than that of the upper resin portion. The rigid body is arranged directly above a boundary between the lower IC chip and the lower resin portion.
    Type: Application
    Filed: June 14, 2022
    Publication date: September 29, 2022
    Inventor: Hiroyoshi KUNIEDA
  • Publication number: 20220013428
    Abstract: An electronic device includes an upper package, a lower package and a printed circuit board. The upper package includes an upper chip. The lower package includes a lower chip. The upper package and the lower package are stacked on the printed circuit board. The thermal diffusion layer is disposed in a vicinity of the lower chip at the lower package.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 13, 2022
    Inventors: Hiroyoshi KUNIEDA, Hiroki HAYASHI
  • Publication number: 20220007510
    Abstract: An electronic device includes an upper package including an upper chip, a lower package including a lower chip, a printed circuit board above which the upper package and the lower package are laminated, solder balls connecting the upper package and the lower package, solder balls connecting the lower package and the printed circuit board. The lower package has a thermal expansion coefficient set between a thermal expansion coefficient of the upper package and a thermal expansion coefficient of the printed circuit board.
    Type: Application
    Filed: September 22, 2021
    Publication date: January 6, 2022
    Inventors: Hiroyoshi KUNIEDA, Hiroki HAYASHI
  • Publication number: 20110180938
    Abstract: In an electronic device, a silicone adhesive bonding first and second members is made from a composition comprising: (A) 100 parts by mass of an organopolysiloxane containing in one molecule at least two alkenyl groups and being free of silicon-bonded hydroxyl and alkoxy groups wherein the content of cyclic siloxanes having 4 to 20 siloxane units is at most 0.1 mass %; (B) an organopolysiloxane containing in one molecule at least two silicon-bonded hydrogen atoms and being free of an alkenyl group, and silicon-bonded hydroxyl and alkoxy groups; (C) at least 0.05 parts by mass of an adhesion promoter; (D) 100 to 2000 parts by mass of a thermally conductive filler; and (E) a hydrosilylation-reaction catalyst. (B) is contained such that the silicon-bonded hydrogen atoms is in the range of 0.5 to 10 mol per 1 mol of the alkenyl groups of (A), and the sum of (B) and (C) is 0.5 to 10 mass % of the sum of (A), (B) and (C).
    Type: Application
    Filed: January 13, 2011
    Publication date: July 28, 2011
    Applicants: DENSO CORPORATION, Dow Corning Toray Co., Ltd.
    Inventors: Kazuya HIRASAWA, Yuuji Ootani, Akiyoshi Asai, Hirokazu Imai, Hiroyoshi Kunieda, Harumi Kodama, Masayuki Onishi, Ryo Sakaguchi, Kazumi Nakayoshi