Abstract: An antifogging window plate has a transparent film and a base both made of thermoplastic resins. Conductive lines and electrodes are printed using a conductive paste on one side of the film, which is then bonded to the base. One portion of each electrode is exposed as a terminal portion to be connected to an electric contact member. The window plate is made by injection molding with the surface of the film opposite from the printed surface being in contact with the cavity wall of the mold, so that the integration of the film with the base is effected simultaneously with the forming of base. Each contact member is subsequently fitted in an injection-molded void facing the terminal portion, or is secured in place at the same time as the injection molding.

Abstract: A panel is composed of synthetic resins and coated with an antifogging layer, the panel having a plastics substrate formed as a board or film or molded into any desired shape. The panel further has a heat generating pattern as the antifogging layer formed on the substrate and composed of a conductive paste, and a hard coat covering the layer and mainly composed of a silicone resin. The conductive paste is composed of a resinous binder, a conductive agent and a solvent, and the binder is selected from a group consisting of (i) a saturated polyester, (ii) a mixture of the polyester and a polyvinyl chloride, (iii) a mixture of the polyester and a copolymer of vinyl chloride and vinyl acetate, and (iv) a mixture of the polyester, the polyvinyl chloride and the copolymer. The heat generating pattern layer protects the resin panel from fogging, and the hard coat enhances scratch resistance and weather resistance to the panel.

Abstract: A forming sheet for forming an article such as a housing for an electronic device having a shieldability against electromagnetic interference. It is made by laminating a conductive laminated sheet to a thermoplastic synthetic resin sheet through a hot melt adhesive layer. The conductive laminated sheet is formed by subjecting to heat shrinkage a substrate comprising a metallic film and a heat-shrinkable synthetic resin film laminated together through a discontinuous bonding layer. The conductive layer is less liable to crack due to stress applied during forming.