Patents by Inventor Hiroyoshi Ueno

Hiroyoshi Ueno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050118910
    Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
    Type: Application
    Filed: January 10, 2005
    Publication date: June 2, 2005
    Applicants: OJI PAPER CO., LTD., SHIN-KOBE ELECTRIC MACHINERY CO., LTD.
    Inventors: Hiroyoshi Ueno, Yoshihisa Kato, Isao Ichioka, Takekazu Adachi, Mamoru Murata, Hirokazu Hiraoka, Manabu Ochida, Masayuki Noda
  • Patent number: 6731331
    Abstract: A shooting instruction device 1 selects one of preset shooting patterns 101 according to the type and scale of the disaster to cope with, then inputs shooting conditions 112 corresponding to the selected shooting pattern, and sends a shooting instruction 103. A video camera apparatus 2 loaded on a helicopter 3 makes a flight plan 106 based on the received shooting instruction 103, then shoots the position of a shooting target, then adds a still picture mark to a video signal 111, and sends it together with associated data 114. An information display device 4 extracts a still picture from a video signal 113 with the still picture mark, and displays the still picture together with the associated data 114.
    Type: Grant
    Filed: July 5, 2000
    Date of Patent: May 4, 2004
    Assignees: Mitsubishi Denki Kabushiki Kaisha, NTT Data Corporation
    Inventors: Shigehiko Watabe, Tetsuji Naoi, Ushio Inoue, Kouji Miyajima, Hatsuo Kimura, Toshitsugu Katsumata, Satoshi Nishiyama, Yukio Tanaka, Akinori Kosako, Yoshikazu Osamemoto, Hiroyoshi Ueno, Akio Komiya
  • Publication number: 20030157858
    Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
    Type: Application
    Filed: March 5, 2003
    Publication date: August 21, 2003
    Applicant: OJI PAPER CO., LTD.
    Inventors: Hiroyoshi Ueno, Yoshihisa Koto, Isao Ichioka, Takekazu Adachi, Mamoru Murata, Hirokazu Hiraoka, Manabu Ochida, Masayuki Noda
  • Patent number: 6566288
    Abstract: A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4′-diphenylether-terephthalamide fibers and (b) poly-p-phenylene-terephthalamide fibers and having a blend ratio by weight of (a)/(b)=10/90˜90/10 and preferably (a)/(b)=30/70˜70/30.
    Type: Grant
    Filed: February 6, 2001
    Date of Patent: May 20, 2003
    Assignees: Shin-Kobe Electric Machinery Co., Ltd., Oji Paper Co., Ltd.
    Inventors: Shigeru Kurumatani, Hirokazu Hiraoka, Masayuki Noda, Tomoyuki Terao, Setsuo Toyoshima, Yoshihisa Kato, Hiroyoshi Ueno
  • Patent number: 6558512
    Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
    Type: Grant
    Filed: November 17, 1999
    Date of Patent: May 6, 2003
    Assignees: Oji Paper Co., Ltd., Shin-Kobe Electric Machinery Co., Ltd
    Inventors: Hiroyoshi Ueno, Yoshihisa Kato, Isao Ichioka, Takekazu Adachi, Mamoru Murata, Hirokazu Hiraoka, Manabu Ochida, Masayuki Noda
  • Publication number: 20020197466
    Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
    Type: Application
    Filed: November 17, 1999
    Publication date: December 26, 2002
    Inventors: HIROYOSHI UENO, YOSHIHISA KATO, ISAO ICHIOKA, TAKEKAZU ADACHI, MAMORU MURATA, HIROKAZU HIRAOKA, MANABU OCHIDA, MASAYUKI NODA
  • Patent number: 6426310
    Abstract: A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4′-diphenylether-terephthalamide fibers and (b) poly-p-phenylene-terephthalamide fibers and having a blend ratio by weight of (a)/(b)=10/90˜90/10 and preferably (a)/(b)=30/70˜70/30.
    Type: Grant
    Filed: September 24, 1999
    Date of Patent: July 30, 2002
    Assignees: Shin-Kobe Electric Machinery Co., Ltd., Oji Paper Co., Ltd.
    Inventors: Shigeru Kurumatani, Hirokazu Hiraoka, Masayuki Noda, Tomoyuki Terao, Setsuo Toyoshima, Yoshihisa Kato, Hiroyoshi Ueno
  • Publication number: 20010006868
    Abstract: A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4′-diphenylether-terephthalamide fibers and (b) poly-p-phenylene-terephthalamide fibers and having a blend ratio by weight of (a)/(b)=10/90˜90/10 and preferably (a)/(b)=30/70˜70/30.
    Type: Application
    Filed: February 6, 2001
    Publication date: July 5, 2001
    Inventors: Shigeru Kurumatani, Hirokazu Hiraoka, Masayuki Noda, Tomoyuki Terao, Setsuo Toyoshima, Yoshihisa Kato, Hiroyoshi Ueno