Patents by Inventor Hiroyoshi Yajima
Hiroyoshi Yajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110164249Abstract: Optical spectrum of a light irradiated on the object, a spontaneous light emitted from within the object or a surface thereof, a scattered light, a transmitted light, a reflected light or a refracted light from within the object or a surface thereof generated by irradiating light on the object is resolved by amplifying said lights in a bandwidth narrower than the bandwidth of the optical spectrum of said lights. Thus, a method for detecting optical spectrum is provided in which signal intensity is amplified while deterioration of spectral data is suppressed.Type: ApplicationFiled: November 4, 2010Publication date: July 7, 2011Applicant: OLYMPUS CORPORATIONInventors: Takeharu INNAMI, Kenji TAIRA, Hiroyoshi YAJIMA, Hiroya FUKUYAMA, Mitsuru NAMIKI, Makoto IGARASHI, Shunji TAKEI
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Publication number: 20110049337Abstract: There are provided a photodetection device and a photodetection method and a microscope and an endoscope capable of heterodyne-detecting desired light to be detected with high sensitivity and high S/N ratio. A photodetection device, comprising a local light generation means 10 generating local light having a plurality of optical frequency components in an optical frequency band of light to be detected within a given period of time; a light combining means 20 combining the local light generated from the local light generation means 10 and the light to be detected; and a photoelectric conversion means 30 photoelectrically-converting light output from the light combining means 20 and generating a beat signal of the local light and the light to be detected, wherein the light to be detected is heterodyne-detected based on an output of the photoelectric conversion means 30.Type: ApplicationFiled: March 5, 2009Publication date: March 3, 2011Applicant: OLYMPUS CORPORATIONInventors: Kenji Taira, Hiroyoshi Yajima
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Publication number: 20100224794Abstract: A multiphoton-excited measuring device measuring a sample with the use of a multiphoton absorption phenomenon by optical pulses having high intensity, comprising a short pulse light source 2 emitting optical pulses; an irradiation optical system 17, 18, 19 irradiating a sample 20 with optical pulses emitted from the short pulse light source 2; a detector 24 detecting signal light generated, in association with multiphoton excitation, from the sample 20 by the irradiation with optical pulses; and an optical pulse compression means 4, 13 compressing a pulse width, with the use of intensity-dependent nonlinear effects of the optical fiber 4, so that a pulse width of optical pulses with which the sample 20 is to be irradiated is shorten to equal to or narrower than that of optical pulses emitted from the short pulse light source 2 and so that a spectral width of optical pulses with which the sample 20 is to be irradiated is wider than that of optical pulses emitted from the short pulse light source 2, which makesType: ApplicationFiled: March 24, 2009Publication date: September 9, 2010Applicant: OLYMPUS CORPORATIONInventors: Hiroyoshi Yajima, Kenji Taira
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Publication number: 20100210952Abstract: An optical inspection device 1, comprising a light generation means 2, a light irradiation means 3 irradiating an object to be inspected 4 with light generated from the light generation means 2 and a photodetection means 6 photoelectrically converting signal light obtained from the object to be inspected 4 through irradiation of light by the light irradiation means 3, and inspecting the object to be inspected 4 based on output from the photodetection means 6, wherein a light amplification means 5 amplifying signal light obtained from the object to be inspected 4 is provided. There is thus provided an optical inspection device capable of photoelectrically converting signal light from the object to be inspected with high sensitivity and promptly with its inexpensive configuration without increasing the intensity of light with which the object to be inspected is irradiated and without using an expensive low-noise and high-sensitivity photodetector.Type: ApplicationFiled: March 23, 2009Publication date: August 19, 2010Applicant: OLYMPUS CORPORATIONInventors: Kenji Taira, Hiroyoshi Yajima, Shinichi Takimoto
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Publication number: 20100195193Abstract: An optical pulse source device comprising an optical pulse source (10) emitting an optical pulse train, optical amplifying means (20, 40) amplifying the optical pulse train and a saturable absorber device (30) removing noise floor in the optical pulse train. There is provided an optical pulse source device for multiphoton imaging system being of small size and high stability and capable of improving the SNR by its relatively simple configuration without using a synchronous circuit or an active time gate.Type: ApplicationFiled: March 24, 2009Publication date: August 5, 2010Applicant: OLYMPUS CORPORATIONInventors: Kenji Taira, Hiroyoshi Yajima
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Patent number: 7653099Abstract: A semiconductor laser device according to the present invention includes: a semiconductor laser chip 1 for emitting laser light; a stem 3, 4 for supporting the semiconductor laser chip; a plurality of terminal electrodes, inserted in throughholes provided in the stem 3, 4, for supplying power to the semiconductor laser chip; and a cap 5 having an optical window 6 which transmits laser light and being affixed to the stem 3, 4 so as to cover the semiconductor laser chip 1. Between the stem 3, 4 and the terminal electrodes 7, this device includes insulation glass 8, which does not release silicon fluoride gas when heated to a temperature of no less than 700° C. and no more than 850° C.Type: GrantFiled: June 2, 2005Date of Patent: January 26, 2010Assignee: Panasonic CorporationInventors: Yoshiaki Hasegawa, Toshiya Yokogawa, Hiroyoshi Yajima
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Patent number: 7564884Abstract: A laminated composite includes: a 1st-conductive-type cladding layer laid on a substrate; an active layer laid on the 1st-conductive-type cladding layer; and a ridge-stripe 2nd-conductive-type cladding layer laid on the active layer. A pair of films is disposed at the end faces of the laminated composite so as to oppose each other along the lamination direction. The paired films are formed to have different spectral reflectances from each other. The resonator structure is formed with the laminated composite and the paired films. When, in the length direction of the resonator, a side with one of the paired films which has a smaller spectral reflectance is the forward side and a side with the other film having a larger spectral reflectance is the backward side, the laminated composite is structured so that the optical confinement factor becomes smaller on the forward side than on the backward side.Type: GrantFiled: September 21, 2006Date of Patent: July 21, 2009Assignee: Panasonic CorporationInventors: Keiji Ito, Isao Kidoguchi, Hiroyoshi Yajima
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Publication number: 20090105563Abstract: An object of the invention is to provide a component concentration measuring apparatus by blood sampling by laser perforating, capable of preventing leak of an abnormal odor generated during laser perforating, and improving user's convenience. In a component concentration measuring apparatus of the invention, a slide sheet 6 in which a film is provided on the optical axis of a laser beam, and an insertion holder 7 the inside of which is hollow are inserted into a main body 2 equipped with a laser device, a focusing lens, an analyzing device that analyzes components of a body fluid by an enzyme reaction of a specimen reagent, a laser operation button 5, a display 3, a display switching button 4, a chargeable battery, and an electric circuit on which a memory that stores the operation of the laser device, analysis of component concentration by the output of the analyzing device, and analysis results is mounted.Type: ApplicationFiled: March 22, 2007Publication date: April 23, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Hiroyoshi Yajima, Fumiaki Emoto, Toshiaki Miyaji, Toshihiko Yoshioka, Yuki Kawase, Naoki Matsubara
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Publication number: 20090041307Abstract: A biometric information transfer system is provided, allowing the urgency, etc., of a biometric information measurement result contained in e-mail to be directly and instantaneously noticed. When the biometric information measurement result is converted into e-mail format, attention-drawing information is assigned to the e-mail in accordance with the biometric information measurement result.Type: ApplicationFiled: April 27, 2006Publication date: February 12, 2009Inventors: Kenji Iwano, Hiroyoshi Yajima, Naoki Matsubara
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Publication number: 20080315231Abstract: A light source of the present invention includes: a semiconductor light emitting device which has a light emitting face and emits light from part of the light emitting face; a container which has a light transmitting window for transmitting the light and accommodates the semiconductor light emitting device; and a gettering portion for performing gettering of a material containing at least one of carbon and silicon. The gettering portion is positioned, in the container, in a region other than the part of the light emitting face of the semiconductor light emitting device.Type: ApplicationFiled: June 12, 2008Publication date: December 25, 2008Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO. LTD.Inventors: Isao Kidoguchi, Yasuo Kitaoka, Hiroyoshi Yajima, Keiji Ito, Akihiko Ishibashi, Yoshiaki Hasegawa, Kiminori Mizuuchi
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Patent number: 7407421Abstract: A light source of the present invention includes: a semiconductor light emitting device which has a light emitting face and emits light from part of the light emitting face; a container which has a light transmitting window for transmitting the light and accommodates the semiconductor light emitting device; and a gettering portion for performing gettering of a material containing at least one of carbon and silicon. The gettering portion is positioned, in the container, in a region other than the part of the light emitting face of the semiconductor light emitting device.Type: GrantFiled: November 19, 2004Date of Patent: August 5, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Isao Kidoguchi, Yasuo Kitaoka, Hiroyoshi Yajima, Keiji Ito, Akihiko Ishibashi, Yoshiaki Hasegawa, Kiminori Mizuuchi
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Publication number: 20080049800Abstract: A semiconductor laser device according to the present invention includes: a semiconductor laser chip 1 for emitting laser light; a stem 3, 4 for supporting the semiconductor laser chip; a plurality of terminal electrodes, inserted in throughholes provided in the stem 3, 4, for supplying power to the semiconductor laser chip; and a cap 5 having an optical window 6 which transmits laser light and being affixed to the stem 3, 4 so as to cover the semiconductor laser chip 1. Between the stem 3, 4 and the terminal electrodes 7, this device includes insulation glass 8, which does not release silicon fluoride gas when heated to a temperature of no less than 700° C. and no more than 850° C.Type: ApplicationFiled: June 2, 2005Publication date: February 28, 2008Inventors: Yoshiaki Hasegawa, Toshiya Yokogawa, Hiroyoshi Yajima
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Publication number: 20050116614Abstract: A light source of the present invention includes: a semiconductor light emitting device which has a light emitting face and emits light from part of the light emitting face; a container which has a light transmitting window for transmitting the light and accommodates the semiconductor light emitting device; and a gettering portion for performing gettering of a material containing at least one of carbon and silicon. The gettering portion is positioned, in the container, in a region other than the part of the light emitting face of the semiconductor light emitting device.Type: ApplicationFiled: November 19, 2004Publication date: June 2, 2005Inventors: Isao Kidoguch, Yasuo Kitaoka, Hiroyoshi Yajima, Keiji Ito, Akihiko Ishibashi, Yoshiaki Hasegawa, Kiminori Mizuuchi
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Patent number: 6819472Abstract: An optical modulator includes an optical waveguide, a modulating electrode, a conductive layer, an electric signal input section, and connector members. At least a portion of the optical waveguide is made of an electro-optic material. The modulating electrode includes a first conductor line and a second conductor line, which are coupled together electromagnetically, and applies a modulating electric field to a portion of the optical waveguide. The conductive layer forms a first microstrip line with the first conductor line and a second microstrip line with the second conductor line, respectively. Through the electric signal input section, an RF modulating signal is supplied to the modulating electrode. The connector members connect the first and second conductor lines together at both ends. In this optical modulator, the first and second conductor lines function as an odd-mode resonator for the RF modulating signal.Type: GrantFiled: June 2, 2003Date of Patent: November 16, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Akira Enokihara, Masahiro Kosaki, Hiroyoshi Yajima
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Publication number: 20040200067Abstract: A method of machining a glass substrate using a laser, in which a low-permittivity, low-dielectric-loss glass substrate, capable of coping with mass production, is made applicable as the substrate of a high-frequency circuit intended in particular for microwave and millimeter-wave bands. For that purpose, a glass substrate is provided in which the amount of air bubbles in glass is arbitrarily controlled to improve the workability of the substrate. Then, the glass substrate is machined by being irradiated with a pulsed laser a plurality of times, thereby improving the machining shape of the glass substrate. Since glass substrates which are typically difficult to machine can be easily applied to the fabrication of high-frequency circuits, it becomes possible to supply high-performance circuits and apparatuses widely to the public.Type: ApplicationFiled: May 4, 2004Publication date: October 14, 2004Applicant: Masushita Electric Industrial Co., Ltd.Inventors: Hiroshi Ogura, Yuji Hashidate, Hiroyoshi Yajima, Yoshikazu Yoshida
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Patent number: 6772514Abstract: A method of machining a glass substrate by using a laser, in which a low-permittivity, low-dielectric-loss glass substrate capable of coping with mass production processes is made applicable as the substrate of a high-frequency circuit intended for microwave and millimeter-wave bands in particular. For that purpose, a glass substrate is provided in which the amount of air bubbles in glass is arbitrarily controlled to improve the workability of the substrate itself. Then, the glass substrate is machined while being irradiated with a pulsed laser for a plurality of times, thereby improving the machining shape of the glass substrate. Since glass substrates which are typically difficult to machine can be easily applied to the fabrication of high-frequency circuits, it becomes possible to supply high-performance circuits and apparatuses widely to the public.Type: GrantFiled: June 12, 2001Date of Patent: August 10, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroshi Ogura, Yuji Hashidate, Hiroyoshi Yajima, Yoshikazu Yoshida
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Publication number: 20040104846Abstract: A method of machining a glass substrate by using a laser, in which a low-permittivity, low-dielectric-loss glass substrate capable of coping with mass production processes is made applicable as the substrate of a high-frequency circuit intended for microwave and millimeter-wave bands in particular. For that purpose, a glass substrate is provided in which the amount of air bubbles in glass is arbitrarily controlled to improve the workability of the substrate itself. Then, the glass substrate is machined while being irradiated with a pulsed laser for a plurality of times, thereby improving the machining shape of the glass substrate. Since glass substrates which are typically difficult to machine can be easily applied to the fabrication of high-frequency circuits, it becomes possible to supply high-performance circuits and apparatuses widely to the public.Type: ApplicationFiled: November 17, 2003Publication date: June 3, 2004Applicant: MATSUSHITA ELECTRICAL INDUSTRIAL CO., LTD.Inventors: Hiroshi Ogura, Yuji Hashidate, Hiroyoshi Yajima, Yoshikazu Yoshida
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Publication number: 20030223669Abstract: An optical modulator includes an optical waveguide, a modulating electrode, a conductive layer, an electric signal input section, and connector members. At least a portion of the optical waveguide is made of an electro-optic material. The modulating electrode includes a first conductor line and a second conductor line, which are coupled together electromagnetically, and applies a modulating electric field to a portion of the optical waveguide. The conductive layer forms a first microstrip line with the first conductor line and a second microstrip line with the second conductor line, respectively. Through the electric signal input section, an RF modulating signal is supplied to the modulating electrode. The connector members connect the first and second conductor lines together at both ends. In this optical modulator, the first and second conductor lines function as an odd-mode resonator for the RF modulating signal.Type: ApplicationFiled: June 2, 2003Publication date: December 4, 2003Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Akira Enokihara, Masahiro Kosaki, Hiroyoshi Yajima
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Publication number: 20020158947Abstract: A piezoelectric film and a second electrode and vibration plate are formed on one surface of a deposition substrate that transmits ultraviolet rays therethrough. A transfer substrate is attached to the second electrode and vibration plate. The other surface of the deposition substrate is irradiated with ultraviolet rays. The deposition substrate and the piezoelectric film are separated from each other by the energy of the ultraviolet rays, thus transferring the piezoelectric film and the second electrode and vibration plate onto the transfer substrate.Type: ApplicationFiled: April 22, 2002Publication date: October 31, 2002Inventors: Isaku Kanno, Keiichiro Yamanaka, Takeshi Kamada, Hiroyoshi Yajima, Shintaro Hara
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Publication number: 20020005805Abstract: A method of machining a glass substrate by using a laser, in which a low-permittivity, low-dielectric-loss glass substrate capable of coping with mass production processes is made applicable as the substrate of a high-frequency circuit intended for microwave and millimeter-wave bands in particular. For that purpose, a glass substrate is provided in which the amount of air bubbles in glass is arbitrary controlled to improve the workability of the substrate itself. Then, the glass substrate is machined while being irradiated with a pulsed laser for a plurality of times, thereby improving the machining shape to the glass substrate. Since glass substrates which are typically difficult to machine can be easily applied to the fabrication of high-frequency circuits, it becomes possible to supply high-performance circuits and apparatuses widely to the public.Type: ApplicationFiled: June 12, 2001Publication date: January 17, 2002Inventors: Hiroshi Ogura, Yuji Hashidate, Hiroyoshi Yajima, Yoshikazu Yoshida