Patents by Inventor Hiroyuki Ashiya
Hiroyuki Ashiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7189081Abstract: The terminal mounting structure includes a board (21). The structure includes a terminal (26) mounted on the board. The terminal includes a first end (26a) removably connected to a connection component (16, 17, 18). The terminal includes a second end (26b) soldered to the board in a raised position. The terminal includes a bent portion (26d) at intermediate of the terminal and at respective angles relative to respective first and second ends. The structure includes a retaining member (30, 40) facing the board with a space therebetween, and retaining the bent portion.Type: GrantFiled: January 14, 2003Date of Patent: March 13, 2007Assignee: Yazaki CorporationInventors: Yoshiyuki Tanaka, Hiroyuki Ashiya, Yayoi Maki
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Patent number: 6989976Abstract: A resistance value variable element (18a) changes its resistance value in response to abnormal exothermic heat caused by an overcurrent of an external electrical equipment (3). A bias voltage outputted from a bias voltage output circuit (18) changes in accordance with the change of the resistance value. A relay (13) is controlled so as to be opened/closed in accordance with a switching control signal which is controlled in its supply by a second transistor element (17) based on the change of the bias voltage. According to such a control, power interruption and automatic restoring can be made possible. In the overcurrent protection circuit having such an automatic restoring function, the resistance value variable element is not connected in series with a coil (13a) unlike the conventional technique but contained in the bias voltage output circuit for supplying the switching control signal for exciting the coil.Type: GrantFiled: December 16, 2002Date of Patent: January 24, 2006Assignee: Yazaki CorporationInventor: Hiroyuki Ashiya
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Patent number: 6942499Abstract: In a structure for holding a terminal in which a soldering portion of the terminal is inserted into a connecting hole of a substrate, and a land portion on the substrate and the soldering portion of the terminal are held by soldering with the terminal set upright, a terminal plate for guiding the soldering portion of the terminal into the connecting hole of the substrate is disposed at a position opposing the substrate and spaced apart therefrom with a predetermined clearance, and a positioning hole for holding an intermediate portion of the terminal is provided in the terminal plate, while a retaining portion which is retained in the positioning hole of the terminal plate is provided in the intermediate portion of the terminal.Type: GrantFiled: March 6, 2002Date of Patent: September 13, 2005Assignee: Yazaki CorporationInventors: Yoshiyuki Tanaka, Hiroyuki Ashiya, Yayoi Maki
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Patent number: 6927549Abstract: An electric motor control unit mounted in an automotive vehicle having a motor that is variable in its rotational speed. A temperature sensing element is arranged to contact a busbar so that relays permit switching operation in response to detection of abnormal heat generation. This controls an electrical power supply to the motor to decrease the rotational speed of the motor without complete stopping of the motor. The rotational speed of the motor returns to a normal speed from the decreased speed by switching operation of the relays with diminishing of the abnormal heat generation.Type: GrantFiled: February 19, 2003Date of Patent: August 9, 2005Assignee: Yazaki CorporationInventors: Hiroyuki Ashiya, Makoto Nakayama, Hironori Saito
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Patent number: 6924964Abstract: Terminals (11, 13) for electrical connection respectively have front end portions (11b, 13b) to be joined to a wiring board (20) with solder and base end portions (11a, 13a) drawn outside from a cover (7) made of heat-expanding material. In order for the base end portions to absorb stress countering the external force received from the cover subjected to thermal expansion due to the heat generated by an electromagnetic coil (5) by the deflection deformation of the intermediate portions (11c, 13c) of the terminals positioned closer to the cover than the wiring board 20 with the relay device mounted on the wiring board, the terminals are formed with a predetermined length of L? in the extending direction of the terminals so that the length required for necessary flexibility is secured for the intermediate portions.Type: GrantFiled: December 11, 2002Date of Patent: August 2, 2005Assignee: Yazaki CorporationInventors: Hiroyuki Ashiya, Masataka Suzuki, Yoshiyuki Tanaka, Shingo Matsuura
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Patent number: 6671173Abstract: In a substrate-stacking structure, a substrate, having heat-generating parts mounted thereon, and a control substrate, having control parts mounted thereon, are held spaced a predetermined distance from each other. The substrate and the control substrate are held spaced the predetermined distance from each other through a holding plate, and a heat shielding plate is interposed between these substrates, and an air layer is formed between the heat shielding plate and the control substrate.Type: GrantFiled: March 11, 2002Date of Patent: December 30, 2003Assignee: Yazaki CorporationInventors: Hiroyuki Ashiya, Yoshiyuki Tanaka, Yayoi Maki
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Patent number: 6643134Abstract: In a holding and heat dissipation structure for a heat generation part for dissipating heat generated from the heat generation part having lead portions protruded from the main body thereof are soldered at a main substrate, a terminal plate is disposed at a position opposing to the main substrate with a predetermined distance therebetween, and a part housing portion for holding the part is provided at the terminal plate. The part housing portion is concavely formed. Insertion holes for inserting the lead portions protruded from the main body are formed at the part housing portion and the main substrate, respectively. The lead portions are inserted into these insertion holes, and the lead portions and the land portions of the main substrate are fixed to each other by the soldering in a state that the main body is separated from the bottom surface of the part housing portion.Type: GrantFiled: March 11, 2002Date of Patent: November 4, 2003Assignee: Yazaki CorporationInventors: Hiroyuki Ashiya, Yoshiyuki Tanaka, Yayoi Maki
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Publication number: 20030169007Abstract: An electric motor control unit mounted in an automotive vehicle has a motor (3) that is variable in its rotational speed. A temperature sensing element (18s) is arranged to contact a busbar so that relays (15b) and (15c) permit switching operation in response to detection of abnormal heat generation. This controls an electrical power supply to the motor to decrease the rotational speed of the motor without complete stopping of the motor. The rotational speed of the motor returns to a normal speed from the decreased speed by switching operation of the relays (15b) and (15c) with diminishing of the abnormal heat generation.Type: ApplicationFiled: February 19, 2003Publication date: September 11, 2003Inventors: Hiroyuki Ashiya, Makoto Nakayama, Hironori Saito
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Publication number: 20030134528Abstract: The terminal mounting structure includes a board (21). The structure includes a terminal (26) mounted on the board. The terminal includes a first end (26a) removably connected to a connection component (16, 17, 18). The terminal includes a second end (26b) soldered to the board in a raised position. The terminal includes a bent portion (26d) at intermediate of the terminal and at respective angles relative to respective first and second ends. The structure includes a retaining member (30, 40) facing the board with a space therebetween, and retaining the bent portion.Type: ApplicationFiled: January 14, 2003Publication date: July 17, 2003Applicant: YAZAKI CORPORATIONInventors: Yoshiyuki Tanaka, Hiroyuki Ashiya, Yayoi Maki
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Publication number: 20030123205Abstract: A resistance value variable element (18a) changes its resistance value in response to abnormal exothermic heat caused by an overcurrent of an external electrical equipment (3). A bias voltage outputted from a bias voltage output circuit (18) changes in accordance with the change of the resistance value. A relay (13) is controlled so as to be opened/closed in accordance with a switching control signal which is controlled in its supply by a second transistor element (17) based on the change of the bias voltage. According to such a control, power interruption and automatic restoring can be made possible. In the overcurrent protection circuit having such an automatic restoring function, the resistance value variable element is not connected in series with a coil (13a) unlike the conventional technique but contained in the bias voltage output circuit for supplying the switching control signal for exciting the coil.Type: ApplicationFiled: December 16, 2002Publication date: July 3, 2003Applicant: YAZAKI CORPORATIONInventor: Hiroyuki Ashiya
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Publication number: 20030109170Abstract: Terminals (11, 13) for electrical connection respectively have front end portions (11b, 13b) to be joined to a wiring board (20) with solder and base end portions (11a, 13a) drawn outside from a cover (7) made of heat-expanding material. In order for the base end portions to absorb stress countering the external force received from the cover subjected to thermal expansion due to the heat generated by an electromagnetic coil (5) by the deflection deformation of the intermediate portions (11c, 13c) of the terminals positioned closer to the cover than the wiring board 20 with the relay device mounted on the wiring board, the terminals are formed with a predetermined length of L′ in the extending direction of the terminals so that the length required for necessary flexibility is secured for the intermediate portions.Type: ApplicationFiled: December 11, 2002Publication date: June 12, 2003Applicant: YAZAKI CORPORATIONInventors: Hiroyuki Ashiya, Masataka Suzuki, Yoshiyuki Tanaka, Shingo Matsuura
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Patent number: 6493228Abstract: A heat radiation packaging structure without getting a board itself larger, but with an excellent heat radiation ability and a low cost is provided. A bus bar 12 is fixed onto a wiring board 11, a connecting lead 15A of a relay 15 etc. being joined onto the bus bar 12, and the wiring board 11, the bus bar 12 and the relay 15 etc. are sealed all together with a heat conduction resin 23. Additionally, the bus bar 12 comprises a thermal diffusion portion 17 which is bent via a bent portion 12B and is apart from the wiring board 11. By means of such a structure, a heat radiation ability is enhanced and the heat radiation packaging structure for an electric part is realized at low cost without getting a board itself larger.Type: GrantFiled: November 6, 2000Date of Patent: December 10, 2002Assignee: Yazaki CorporationInventors: Masataka Suzuki, Hirotoshi Oda, Hisafumi Maruo, Hiroyuki Ashiya, Yasutaka Nagaoka, Yayoi Maki
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Publication number: 20020163783Abstract: In a holding and heat dissipation structure for a heat generation part for dissipating heat generated from the heat generation part having lead portions protruded from the main body thereof are soldered at a main substrate, a terminal plate is disposed at a position opposing to the main substrate with a predetermined distance therebetween, and a part housing portion for holding the part is provided at the terminal plate. The part housing portion is concavely formed. Insertion holes for inserting the lead portions protruded from the main body are formed at the part housing portion and the main substrate, respectively. The lead portions are inserted into these insertion holes, and the lead portions and the land portions of the main substrate are fixed to each other by the soldering in a state that the main body is separated from the bottom surface of the part housing portion.Type: ApplicationFiled: March 11, 2002Publication date: November 7, 2002Applicant: YAZAKI CORPORATIONInventors: Hiroyuki Ashiya, Yoshiyuki Tanaka, Yayoi Maki
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Publication number: 20020131239Abstract: In a substrate-stacking structure, a substrate, having heat-generating parts mounted thereon, and a control substrate, having control parts mounted thereon, are held spaced a predetermined distance from each other. The substrate and the control substrate are held spaced the predetermined distance from each other through a holding plate, and a heat shielding plate is interposed between these substrates, and an air layer is formed between the heat shielding plate and the control substrate.Type: ApplicationFiled: March 11, 2002Publication date: September 19, 2002Applicant: YAZAKI CORPORATIONInventors: Hiroyuki Ashiya, Yoshiyuki Tanaka, Yayoi Maki
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Publication number: 20020124994Abstract: In a structure for holding a terminal in which a soldering portion of the terminal is inserted into a connecting hole of a substrate, and a land portion on the substrate and the soldering portion of the terminal are held by soldering with the terminal set upright, a terminal plate for guiding the soldering portion of the terminal into the connecting hole of the substrate is disposed at a position opposing the substrate and spaced apart therefrom with a predetermined clearance, and a positioning hole for holding an intermediate portion of the terminal is provided in the terminal plate, while a retaining portion which is retained in the positioning hole of the terminal plate is provided in the intermediate portion of the terminal.Type: ApplicationFiled: March 6, 2002Publication date: September 12, 2002Applicant: YAZAKI CORPORATIONInventors: Yoshiyuki Tanaka, Hiroyuki Ashiya, Yayoi Maki
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Patent number: 6372998Abstract: An electrical component connecting structure for an electrical component having a terminal is disclosed. The electrical component connecting structure comprises an insulating plate and a bus bar. The insulating plate comprises a first surface side for mounting the electrical component thereon and a second surface side. The insulating plate further comprises an opening portion formed at a predetermined position and defined by an inner wall extending from the first surface side to the second surface side. The bus bar comprises a pattern portion, an insertion plate portion, and a connecting plate portion. The insertion plate portion extends from the pattern portion to the second surface side of the insulating plate along at least part of the inner wall of the opening portion. The connection plate portion extends from the insertion plate portion so as to close the opening portion on the second surface side of the insulating plate.Type: GrantFiled: October 11, 2000Date of Patent: April 16, 2002Assignee: Yazaki CorporationInventors: Masataka Suzuki, Hiroyuki Ashiya, Yayoi Maki
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Patent number: 6294255Abstract: A method of fixing a flexible electrical conductor, in which a plurality of flat conductors in which their connecting ends to be connected to another circuit are exposed are integrally covered with a resin-made cladding member, to a fixing portion for connection to the other circuit, comprises the steps of: placing the cladding member on this side of the connecting ends on the fixing portion; and welding together the cladding member on this side of the connecting ends and the fixing portion so as to fix the flexible electrical conductor to the fixing portion. As a result, even if an external force is applied to the flexible electrical conductor, the force is not applied directly to a connecting portion for connecting the connecting ends to connecting ends of the other circuit, thereby improving the electrical reliability in the connection.Type: GrantFiled: October 13, 2000Date of Patent: September 25, 2001Assignee: Yazaki CorporationInventors: Masataka Suzuki, Hiroyuki Ashiya, Koji Koike, Shinobu Mochiduki
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Patent number: 6156138Abstract: A method of fixing a flexible electrical conductor, in which a plurality of flat conductors in which their connecting ends to be connected to another circuit are exposed are integrally covered with a resin-made cladding member, to a fixing portion for connection to the other circuit, comprises the steps of: placing the cladding member on this side of the connecting ends on the fixing portion; and welding together the cladding member on this side of the connecting ends and the fixing portion so as to fix the flexible electrical conductor to the fixing portion. As a result, even if an external force is applied to the flexible electrical conductor, the force is not applied directly to a connecting portion for connecting the connecting ends to connecting ends of the other circuit, thereby improving the electrical reliability in the connection.Type: GrantFiled: June 29, 1998Date of Patent: December 5, 2000Assignee: Yazaki CorporationInventors: Masataka Suzuki, Hiroyuki Ashiya, Koji Koike, Shinobu Mochiduki
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Patent number: 6089438Abstract: In order to achieve reliable welding, by reducing welding scars, of a flat conductor to another bonding member by an ultrasonic welding machine, a curved beveled portion facing a bonding member, a plurality of indented grooves running at a right angle to the direction of vibration of the horn tip and flat surfaces, which come in contact with a bonding member, are formed at either one of or both of the horn tip and the anvil, wherein the curved beveled portions, the indented grooves and the flat surfaces are formed facing opposite a low strength conductive member, and the indented grooves are formed at a width that is smaller than that of the flat surfaces provided between the individual indented grooves and curved beveled portions are formed at the edges where the indented grooves meet the flat surfaces.Type: GrantFiled: August 12, 1996Date of Patent: July 18, 2000Assignee: Yazaki CorporationInventors: Masataka Suzuki, Hiroyuki Ashiya, Yoshiyuki Tanaka, Shinobu Mochizuki, Kouji Koike
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Patent number: 6078012Abstract: In order to standardize the conductors of a flat cable by changing an electrical resistance value of resistors provided in a bonding area where the flat cable is connected to lead wires and setting a specific value for the electrical resistance value of the entire signal transmission apparatus such as an air bag, the air bag circuit is provided with a flat cable, having a specific electrical resistance value and lead wires. The electrical resistance value of the entire circuit is set at a specific value by selecting the electrical resistance value of the resistors provided the a bonding area between the flat cable and the lead wires.Type: GrantFiled: June 19, 1996Date of Patent: June 20, 2000Assignee: Yazaki CorporationInventors: Masataka Suzuki, Hiroyuki Ashiya, Yoshiyuki Tanaka