Abstract: A curable resin composition, comprising 100 parts by mass of a (meth)acrylic polymer (A) having, at a terminal thereof, at least one crosslinkable silyl group; 0.1 to 100 parts by mass of a diamine compound (B) having a monovalent or bivalent aliphatic or alicyclic hydrocarbon group that has 8 or more carbon atoms and may be branched and having at least one primary amino group; and 0.1 to 100 parts by mass of a diamine compound (C) having a monovalent aliphatic or alicyclic hydrocarbon group that has 8 or more carbon atoms and may be branched, and having a crosslinkable silyl group and/or a (meth)acryloyl group.

Abstract: Provided is a fluidized bed furnace for heating waste to extract a combustible gas from the waste, including: a plurality of wind boxes arranged on a lower side of a bottom wall of a furnace body to blow a fluidizing gas into the fluidized bed; a plurality of temperature detection sections disposed at respective positions allowing detection of temperatures of an upper position and a lower position vertically spaced in a first region, and allowing detection of temperatures of upper and lower positions vertically spaced in a second region; and a control section operable, based on the temperatures detected by the temperature detection sections, to adjust an air ratio of the fluidizing gas to be fed to each of the wind boxes, so that the temperature of the fluidized bed is raised in a direction from the first region toward the second region.

Abstract: A waste treatment technique includes: blowing a fluidizing gas from around a mixture discharge port to form a first fluidization region having a degree of fluidization of the fluidizable particles which is set to an extent allowing waste to be accumulated on fluidizable particles, while blowing a fluidizing gas between the first fluidization region and an opposite-side wall at a higher flow velocity to form a second fluid region having a degree of fluidization of fluidizable particles greater than that in the first fluidization region, whereby the fluidizable particles are mixed with the waste to gasify the waste; and supplying waste from a supply-side sidewall portion onto the fluidized bed to cause the waste to be accumulated on the first fluidization region while causing the accumulated waste to be moved into the second fluidization region step-by-step.

Abstract: A waste treatment technique includes: blowing a fluidizing gas from around a non-combustible substance discharge port toward fluidizable particles to form a first fluidization region, while blowing a fluidizing gas between the first fluidization region and a front wall at a flow velocity less than that in the first fluidization region to form a second fluid region having a relatively low degree of fluidization of fluidizable particles; returning fluidizable particles discharged from the non-combustible substance discharge port to a fluidized bed from the side of the front wall to form, in the fluidized bed, a flow of fluidizable particles directed from the front wall to the non-combustible substance discharge port; supplying waste from the front wall onto the fluidized bed to cause the waste to be accumulated on the second fluidization region while causing the accumulated waste to be moved into the first fluidization region step-by-step and gasified.

Abstract: A curable resin composition, comprising 100 parts by mass of a (meth)acrylic polymer (A) having, at a terminal thereof, at least one crosslinkable silyl group; 0.1 to 100 parts by mass of a diamine compound (B) having a monovalent or bivalent aliphatic or alicyclic hydrocarbon group that has 8 or more carbon atoms and may be branched and having at least one primary amino group; and 0.1 to 100 parts by mass of a diamine compound (C) having a monovalent aliphatic or alicyclic hydrocarbon group that has 8 or more carbon atoms and may be branched, and having a crosslinkable silyl group and/or a (meth)acryloyl group.

Abstract: An electroconductive composition including (A) silver oxide; and (B) a secondary aliphatic acid silver salt produced by using a secondary aliphatic acid having a boiling point of not higher than 200° C. will be capable of forming an excellent electroconductive film in a short time on a substrate having a low heat resistance. An electroconductive composition including (A) silver oxide; (B?) a secondary aliphatic acid silver salt whose secondary aliphatic acid contains up to 7 carbon atoms; (C1) a aliphatic acid containing at least 8 carbon atoms and/or (C2) a aliphatic acid silver salt whose aliphatic acid contains at least 8 carbon atoms; and (D) a solvent and/or a plasticizer has an excellent thixotropy and can be formed into an electroconductive film having a low electric resistance even after having been heated for a short time.

Abstract: An electroconductive composition including (A) silver oxide; and (B) a secondary aliphatic acid silver salt produced by using a secondary aliphatic acid having a boiling point of not higher than 200° C. will be capable of forming an excellent electroconductive film in a short time on a substrate having a low heat resistance. An electroconductive composition including (A) silver oxide; (B?) a secondary aliphatic acid silver salt whose secondary aliphatic acid contains up to 7 carbon atoms; (C1) a aliphatic acid containing at least 8 carbon atoms and/or (C2) a aliphatic acid silver salt whose aliphatic acid contains at least 8 carbon atoms; and (D) a solvent and/or a plasticizer has an excellent thixotropy and can be formed into an electroconductive film having a low electric resistance even after having been heated for a short time.

Abstract: The moisture-curable resin composition according to the present invention contains: an epoxy resin; and a ketimine compound having a ketimine (C?N) bond which is derived from a ketone represented by formula (1) below, [where R1 represents an alkyl group which has 1 to 5 carbon atoms and may have a substituent; R represents an alkyl group having 1 to 4 carbon atoms; and R3 and R4 each independently represent an alkyl group having 1 to 3 carbon atoms, and either of them may represent a hydrogen atom], and an amine.

Abstract: To provide a two-pack type curable resin composition capable of securing a sufficient working life and having excellent curing property, in particular, deep curing property. The two-pack type curable resin composition includes: a first liquid containing a silyl group-denatured urethane prepolymer having an isocyanate group and an alkoxysilyl group in one molecule thereof and a weight average molecular weight of 500 or more; and a second liquid containing a curing agent.

Abstract: An amine curing component which can be used with various types of prepolymers including a urethane prepolymer having a reactive functional group of highly reactivity is provided. Also provided is a curable resin composition containing such curing component. This curable resin composition exhibits good surface and depth curability in the curing, and adjustment of pot life is also easy. The curing component contains an amino group-containing compound (A), a ketone compound (B), a ketimine compound (C), and water (D), and the curable resin composition contains this curing component.

Abstract: A curable resin composition includes a silane compound (a) having an epoxy group, and at least one selected from a silane compound (b) having an amino group, a silane compound (c) having a mercapto group, and a silane compound (d) having an acid anhydride group. At least a part of at least one selected from the silane compounds (a) to (d) includes a condensate. This composition has excellent heat resistance with a small change in storage modulus due to temperatures.

Abstract: A moisture curable polyurethane composition comprising (A) a urethane prepolymer having two or more isocyanate groups in the molecule, (B) an inorganic filler as a storage stabilizer, (C) an N-silylamide compound represented by the formula (1), (D) an epoxy resin, and/or (E) a moisture latent curing agent, and a moisture curable epoxy resin composition comprising (D) an epoxy resin, (C) an N-silylamide compound, and (E) a moisture latent curing agent. (R1—CONH)4-n—Si—R2n  (1) wherein R1 is a hydrocarbon group having 5 to 21 carbon atoms optionally containing a heteroatom, provided that when n is 0, 1 or 2, R1s may be the same or different; and R2 is an alkyl or alkoxy group having 1 to 3 carbon atoms; and n is 0, 1, 2 or 3. The moisture curable compositions are excellent in storage stability and thixotropic properties, have high curing rates at the time of working, and can give rise to cured products having excellent mechanical properties such as tensile strength.

Abstract: To provide a two-pack type curable resin composition capable of securing a sufficient working life and having excellent curing property, in particular, deep curing property. The two-pack type curable resin composition includes: a first liquid containing a silyl group-denatured urethane prepolymer having an isocyanate group and an alkoxysilyl group in one molecule thereof and a weight average molecular weight of 500 or more; and a second liquid containing a curing agent.

Abstract: An amine curing component which can be used with various types of prepolymers including a urethane prepolymer having a reactive functional group of highly reactivity is provided. Also provided is a curable resin composition containing such curing component. This curable resin composition exhibits good surface and depth curability in the curing, and adjustment of pot life is also easy. The curing component contains an amino group-containing compound (A), a ketone compound (B), a ketimine compound (C), and water (D), and the curable resin composition contains this curing component.

Abstract: A moisture curable polyurethane composition comprising (A) a urethane prepolymer having two or more isocyanate groups in the molecule, (B) an inorganic filler as a storage stabilizer, (C) an N-silylamide compound represented by the formula (1), (D) an epoxy resin, and/or (E) a moisture latent curing agent, and a moisture curable epoxy resin composition comprising (D) an epoxy resin, (C) an N-silylamide compound, and (E) a moisture latent curing agent.

Abstract: An adhesive compostion comprises a room temperature curing resin, a plastic microballoon surface-coated with a finely divided particulate inorganic material, a filler and a plasticizer. It is useful as adhesives, coatings and sealants.

Abstract: In a bumper side supporting structure of the present invention, an outer panel of a wheel house is extended toward the outside of a body beyond an outer panel of a side body, and a bumper side is fastened to the extended portion via a supporting bracket.

Abstract: A room temperature curing polyurethane composition comprises a polyisocyanate compound or polyurethane prepolymer (A), an oxazolidine compound (B) having at least one oxazolidine ring, a compound (C) for accelerating the opening of the oxazolidine ring, and optionally a modified carbodiimide (D). The inventive polyurethane composition excels in storage stability and freedom of foaming when curing.