Patents by Inventor Hiroyuki Ichikawa

Hiroyuki Ichikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240119502
    Abstract: An information notification device includes a longitudinal-data storage unit that accumulates, for a plurality of samples, longitudinal data indicating a temporal change in foot size of one sample, a user-data storage unit that stores user data containing a gender, an age, and a past foot size of a prediction target person, a foot-size prediction unit that predicts, based on a current foot size of the prediction target person and the longitudinal data, a change in foot size of the prediction target person in a period from a current point in time to a future point in time, and a notification processing unit that displays, on a display unit, the prediction of the change in foot size of the prediction target person in the period from the current point in time to the future point in time.
    Type: Application
    Filed: February 16, 2022
    Publication date: April 11, 2024
    Applicant: ASICS CORPORATION
    Inventors: Ken KUSANO, Ippei SHIINA, Masaru ICHIKAWA, Hiroyuki KUSUMI, Toshiaki KAWASAKI
  • Patent number: 11952441
    Abstract: A method for producing polytetrafluoroethylene, which includes polymerizing tetrafluoroethylene in an aqueous medium in the presence of a nucleating agent and a hydrocarbon anionic surfactant to obtain polytetrafluoroethylene. A total amount of the nucleating agent and the hydrocarbon anionic surfactant at the initiation of polymerization is more than 50 ppm based on the aqueous medium.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: April 9, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Taketo Kato, Yohei Fujimoto, Kenji Ichikawa, Hiroyuki Sato, Yoshinori Nanba, Hirotoshi Yoshida, Kengo Ito, Chiaki Okui, Masamichi Sukegawa, Taku Yamanaka
  • Publication number: 20240094243
    Abstract: This socket includes: an accommodation part having a recess that can accommodate an electronic component; an opening/closing part that opens/closes an opening of the recess; and a rotational movement support part that supports the opening/closing part to be rotationally movable between open/closed positions. The opening/closing part includes: a cover that extends from a first end to a second end in a vertical direction perpendicular to a rotation axis direction of a rotational movement; a pressing member that is disposed between the first end and the second end and presses the electronic component in the recess when the opening/closing part is in the closed position; and a holding member that holds the pressing member so that the pressing member can be rotated and move together with the cover. The holding member extends in the vertical direction and is hung between the cover and the pressing member.
    Type: Application
    Filed: October 7, 2020
    Publication date: March 21, 2024
    Applicant: Enplas Corporation
    Inventor: Hiroyuki ICHIKAWA
  • Patent number: 11820431
    Abstract: A vehicle body damper brace including: a rod member having an elongated shape; a housing including a tubular part arranged externally about the rod member; an elastic connector including a first connection body comprising a viscoelastic material, the elastic connector elastically connecting the rod member and the housing to each other in an axis-perpendicular direction; and a regulator provided on at least one axial side of the first connection body and separately from the elastic connector, the regulator suppressing an amount of relative displacement between the rod member and the housing in a prizing direction.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: November 21, 2023
    Assignee: SUMITOMO RIKO COMPANY LIMITED
    Inventors: Munehiro Wada, Hiroyuki Ichikawa, Takashi Kume
  • Publication number: 20230251308
    Abstract: This socket is provided with: an accommodating section having a recess capable of accommodating an electronic component; an opening/closing section for opening/closing an opening of the recess and pressing the electronic component in the recess in a direction of pressing when the opening is in a closed position; and a support section for supporting the opening/closing section so as to be able to move between an open position and the closed position. The support section supports the opening/closing section, in a closing operation of the opening/closing section, so that the opening/closing section moves while changing the angle formed with the direction of pressing as the opening/closing section moves from the open position to a predetermined position ahead of the closed position, and so that the opening/closing section moves along the direction of pressing when the opening/closing section moves from the predetermined position to the closed position.
    Type: Application
    Filed: October 7, 2020
    Publication date: August 10, 2023
    Applicant: Enplas Corporation
    Inventor: Hiroyuki ICHIKAWA
  • Publication number: 20230018751
    Abstract: This socket comprises: an accommodation part that has a recess portion; an opening/closing part that opens/closes the recess portion; and a rotation support part that supports the opening/closing part to be rotationally movable between an opened state and a closed state. The opening/closing part has: a cover that is supported by the rotation support part; a pressing part that is provided on the first direction side of the first end and presses a electronic component in the recess portion in the closed state; a locking part that is provided on the first direction side of the pressing part and locks the cover to the accommodation part in the closed state; and a pressed part that has a pressed surface and is provided, at a position farther away from the rotation support part than the locking part, to be rotationally movable.
    Type: Application
    Filed: November 20, 2020
    Publication date: January 19, 2023
    Applicant: Enplas Corporation
    Inventor: Hiroyuki ICHIKAWA
  • Patent number: 11279418
    Abstract: A vehicle-use resin module including a strength member made of synthetic resin and including a mounting hole, and an attachment member attached to the mounting hole and configured to be subjected to an external force. The attachment member includes an outer fitting having a tubular part arranged in the mounting hole in an inserted state. The outer fitting includes an outer circumferential projection projecting to a radially outer side of the tubular part. The strength member is an insertion-molded component having a structure in which the outer circumferential projection of the outer fitting is embedded so as to be inserted inside a circumferential wall of the mounting hole. A surface of the tubular part of the outer fitting and a surface of the outer circumferential projection are each directly fixed to the strength member with an adhesive.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: March 22, 2022
    Assignee: SUMITOMO RIKO COMPANY LIMITED
    Inventors: Hiroyuki Ichikawa, Takashi Kume, Munehiro Wada
  • Publication number: 20220009553
    Abstract: A vehicle body damper brace including: a rod member having an elongated shape; a housing including a tubular part arranged externally about the rod member; an elastic connector including a first connection body comprising a viscoelastic material, the elastic connector elastically connecting the rod member and the housing to each other in an axis-perpendicular direction; and a regulator provided on at least one axial side of the first connection body and separately from the elastic connector, the regulator suppressing an amount of relative displacement between the rod member and the housing in a prizing direction.
    Type: Application
    Filed: September 22, 2021
    Publication date: January 13, 2022
    Inventors: Munehiro WADA, Hiroyuki ICHIKAWA, Takashi KUME
  • Publication number: 20210381577
    Abstract: A vibration isolating device is provided. An inner shaft member and an outer tube member are connected to each other with a main body rubber elastic body and plural fluid chambers filled with a fluid are provided to be separated from each other in a circumferential direction and communicates with each other through an orifice passage. The fluid is a magnetically functional fluid. The outer tube member is a non-magnetic material. A tubular cover member is disposed to be separated toward an outer circumferential side from the outer tube member. A magnetic field generating unit exerting a magnetic field on the magnetically functional fluid is assembled between the outer tube member and the tubular cover member. One side member and another side member to be connected to each other in a vibration isolating manner are configured to be attached to the inner shaft member and the tubular cover member.
    Type: Application
    Filed: August 22, 2021
    Publication date: December 9, 2021
    Applicant: Sumitomo Riko Company Limited
    Inventors: Hiroyuki ICHIKAWA, Takashi KUME
  • Patent number: 11167632
    Abstract: A vibration-damping device including: a first mounting member configured to be mounted to one of components of a vibration transmission system; a second mounting member configured to be mounted to an other of the components of the vibration transmission system; a main rubber elastic body connecting the first mounting member and the second mounting member elastically to each other; a bracket attached to the second mounting member, the bracket having a mounting part configured to be mounted to the other of the components of the vibration transmission system; a tubular outer member secured press-fit to the second mounting member; a mass member disposed within the tubular outer member; and a support rubber fixed at an outer peripheral part of the mass member, the support rubber elastically connecting the tubular outer member and the mass member to constitute a dynamic damper.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: November 9, 2021
    Assignees: SUMITOMO RIKO COMPANY LIMITED, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takayoshi Yasuda, Yoshinori Watanabe, Naoki Furumachi, Keishi Hatanaka, Hiroyuki Ichikawa, Yuji Matsubara, Kentaro Mori
  • Publication number: 20210094628
    Abstract: A vehicle-use resin module including a strength member made of synthetic resin and including a mounting hole, and an attachment member attached to the mounting hole and configured to be subjected to an external force. The attachment member includes an outer fitting having a tubular part arranged in the mounting hole in an inserted state. The outer fitting includes an outer circumferential projection projecting to a radially outer side of the tubular part. The strength member is an insertion-molded component having a structure in which the outer circumferential projection of the outer fitting is embedded so as to be inserted inside a circumferential wall of the mounting hole. A surface of the tubular part of the outer fitting and a surface of the outer circumferential projection are each directly fixed to the strength member with an adhesive.
    Type: Application
    Filed: June 23, 2020
    Publication date: April 1, 2021
    Applicant: SUMITOMO RIKO COMPANY LIMITED
    Inventors: Hiroyuki ICHIKAWA, Takashi KUME, Munehiro WADA
  • Patent number: 10794446
    Abstract: A vibration damping device including a main rubber elastic body elastically connecting first and second mounting members. An upper portion of the main rubber elastic body constitutes a small-diameter portion to which the first mounting member is bonded, while a lower portion thereof constitutes a large-diameter portion to which the second mounting member is bonded. The first mounting member includes an inner recess opening onto an outer circumferential surface thereof, and the small-diameter portion of the main rubber elastic body is bonded to the inner recess. The main rubber elastic body has an outside diameter dimension made larger at a portion bonded to the inner recess than an outside diameter dimension of the first mounting member at a lower side than the inner recess such that the small-diameter portion of the main rubber elastic body is thick-walled by being bonded to the inner recess.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: October 6, 2020
    Assignee: SUMITOMO RIKO COMPANY LIMITED
    Inventors: Naoki Furumachi, Takayoshi Yasuda, Hiroyuki Ichikawa
  • Patent number: 10529574
    Abstract: A process of forming a gate electrode in an electrode device is disclosed. The process includes steps of, depositing an insulating film on a nitride semiconductor layer; forming a photoresist with an opening corresponding to the gate electrode on the insulating film; forming a recess in the insulating film using the photoresist as an etching mask, the recess leaving a rest portion in the insulating film; exposing the photoresist in oxygen plasma; baking the photoresist to make an edge of the opening thereof dull; etching the rest portion of the insulating film using the dulled photoresist as an etching mask; and forming the gate electrode so as to be in contact with the semiconductor layer through the opening in the insulating film.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: January 7, 2020
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tomohiro Yoshida, Hiroyuki Ichikawa
  • Publication number: 20190277362
    Abstract: A vibration damping device including a main rubber elastic body elastically connecting first and second mounting members. An upper portion of the main rubber elastic body constitutes a small-diameter portion to which the first mounting member is bonded, while a lower portion thereof constitutes a large-diameter portion to which the second mounting member is bonded. The first mounting member includes an inner recess opening onto an outer circumferential surface thereof, and the small-diameter portion of the main rubber elastic body is bonded to the inner recess. The main rubber elastic body has an outside diameter dimension made larger at a portion bonded to the inner recess than an outside diameter dimension of the first mounting member at a lower side than the inner recess such that the small-diameter portion of the main rubber elastic body is thick-walled by being bonded to the inner recess.
    Type: Application
    Filed: October 24, 2018
    Publication date: September 12, 2019
    Applicant: SUMITOMO RIKO COMPANY LIMITED
    Inventors: Naoki FURUMACHI, Takayoshi YASUDA, Hiroyuki ICHIKAWA
  • Publication number: 20190193548
    Abstract: A vibration-damping device including: a first mounting member configured to be mounted to one of components of a vibration transmission system; a second mounting member configured to be mounted to an other of the components of the vibration transmission system; a main rubber elastic body connecting the first mounting member and the second mounting member elastically to each other; a bracket attached to the second mounting member, the bracket having a mounting part configured to be mounted to the other of the components of the vibration transmission system; a tubular outer member secured press-fit to the second mounting member; a mass member disposed within the tubular outer member; and a support rubber fixed at an outer peripheral part of the mass member, the support rubber elastically connecting the tubular outer member and the mass member to constitute a dynamic damper.
    Type: Application
    Filed: December 10, 2018
    Publication date: June 27, 2019
    Applicants: SUMITOMO RIKO COMPANY LIMITED, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takayoshi YASUDA, Yoshinori WATANABE, Naoki FURUMACHI, Keishi HATANAKA, Hiroyuki ICHIKAWA, Yuji MATSUBARA, Kentaro MORI
  • Publication number: 20190088483
    Abstract: A process of forming a gate electrode in an electrode device is disclosed. The process includes steps of, depositing an insulating film on a nitride semiconductor layer; forming a photoresist with an opening corresponding to the gate electrode on the insulating film; forming a recess in the insulating film using the photoresist as an etching mask, the recess leaving a rest portion in the insulating film; exposing the photoresist in oxygen plasma; baking the photoresist to make an edge of the opening thereof dull; etching the rest portion of the insulating film using the dulled photoresist as an etching mask; and forming the gate electrode so as to be in contact with the semiconductor layer through the opening in the insulating film.
    Type: Application
    Filed: September 20, 2018
    Publication date: March 21, 2019
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tomohiro YOSHIDA, Hiroyuki ICHIKAWA
  • Publication number: 20180277434
    Abstract: A process of forming an ohmic electrode containing aluminum (Al) on a nitride semiconductor material is disclosed. The process includes steps of: (a) depositing an ohmic metal on the semiconductor material; (b) forming an insulating film such that the insulating film covers a side of the ohmic metal but exposes a top of the ohmic metal; and (c) alloying the ohmic metal at a temperature higher than 500° C. for 30 to 60 seconds.
    Type: Application
    Filed: March 22, 2018
    Publication date: September 27, 2018
    Applicants: Sumitomo Electric Industries, Ltd., SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    Inventors: Hiroyuki Ichikawa, Masahiro Nishi
  • Publication number: 20180053648
    Abstract: A method of manufacturing a semiconductor device according to an embodiment of the present invention includes steps of forming an AlN layer on a SiC substrate under conditions of a growth temperature of 1100° C. or lower, growth pressure of 100 torr or less and a V/III ratio of source gasses of 500 or less, forming a channel layer made of a nitride semiconductor, forming an electron supply layer, and forming gate, source, and drain electrodes.
    Type: Application
    Filed: October 13, 2017
    Publication date: February 22, 2018
    Inventors: Ken Nakata, Keiichi Yui, Hiroyuki Ichikawa, Isao Makabe, Tsuyoshi Kouchi
  • Patent number: 9551396
    Abstract: Provided is a vibration damping device having a novel structure and that can have a greatly increased load strength resistance without a concomitant increase in the number of components or size at a stopper mechanism. The structure is such that first and second stopper portions having a hanging plate part and a dip part are provided to a pair of opposing sides of a stopper plate of a vibration damping device, whereas a pair of side plate portions extending between the first and second stopper portions are provided to the other pair of opposing sides of the stopper plate, and openings at both sides of the first and second stopper portions are closed by the pair of side plate portions.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: January 24, 2017
    Assignees: SUMITOMO RIKO COMPANY LIMITED, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Noriaki Yoshii, Hiroki Mizukawa, Yorishige Shimizu, Hiroyuki Ichikawa, Katsuhiko Katagiri, Shinji Komura
  • Patent number: 9394964
    Abstract: A fluid-filled vibration damping device including a second orifice passage and a third orifice passage tuned to a lower frequency than the second orifice passage, and an actuator including an output portion facing openings of the second and third orifice passages on a side of an equilibrium chamber via a flexible film. The flexible film obstructs the openings of the second and third orifice passages when the output portion comes into contact against a partition member so that the third orifice passage is blocked while the second orifice passage is substantially placed in communication owing to a center recess of the output portion permitting deformation of the flexible film. Meanwhile, the flexible film is separated from the openings of the second and third orifice passages when the output portion is separated from the partition member so that the two orifice passages are placed in communication.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: July 19, 2016
    Assignee: SUMITOMO RIKO COMPANY LIMITED
    Inventors: Takayoshi Yasuda, Hiroyuki Ichikawa, Akio Saiki