Abstract: An infra-red absorption glass for a reed switch is suitable for encasement of a reed switch using magnetic wire members made of Fe—Ni based alloy (52 alloy). In the infra-red absorption glass, an infra-red transmittance at a wavelength of 1050 nm is not greater than 10% for a thickness of 0.5 mm and the content of Cl in the glass is not greater than 150 ppm. In the glass, a coefficient of thermal expansion in a temperature range between 30 and 380° C. is preferably 85-100×10?7/° C. In addition, the infra-red absorption glass preferably has a composition consisting essentially of, by weight percent, 60-75% of SiO2, 1-10% of Al2O3, 0-10% of B2O3, 3.5-10% of RO (R being one or more selected from Ca, Mg, Ba, Sr, and Zn), 0.5-5% of Li2O, 8-17% of Na2O+K2O, 2-10% of Fe3O4.

Abstract: A tungsten sealing glass for use in a fluorescent lamp, said glass having a composition of, by mass percent, 65-76% SiO2, 10-25% B2O3, 2-6% Al2O3, 0.5-5.8% MgO+CaO+SrO+BaO+ZnO, 3-8% Li2O+Na2O+K2O, 0.01-4% Fe2O3+CeO2, 0.1-5% TiO2, 0.1-10% TiO2+Sb2O3+PbO, and 0-2% ZrO2, wherein Na2O/(Na2O+K2O)≦0.6.

Abstract: An infra-red absorption glass for a reed switch is suitable for encasement of a reed switch using magnetic wire members made of Fe—Ni based alloy (52 alloy). In the infra-red absorption glass, an infra-red transmittance at a wavelength of 1050 nm is not greater than 10% for a thickness of 0.5 mm and the content of Cl in the glass is not greater than 150 ppm. In the glass, a coefficient of thermal expansion in a temperature range between 30 and 380° C. is preferably 85-100×10−7/° C. In addition, the infra-red absorption glass preferably has a composition consisting essentially of, by weight percent, 60-75% of SiO2, 1-10% of Al2O3, 0-10% of B2O3, 3.5-10% of RO (R being one or more selected from Ca, Mg, Ba, Sr, and Zn), 0.5-5% of Li2O, 8-17% of Na2O+K2O, 2-10% of Fe3O4.

Abstract: An infra-red absorption glass for a reed switch is suitable for encasement of a reed switch using magnetic wire members made of Fe—Ni based alloy (52 alloy). In the infra-red absorption glass, an infra-red transmittance at a wavelength of 1050 nm is not greater than 10% for a thickness of 0.5 mm and the content of Cl in the glass is not greater than 150 ppm. In the glass, a coefficient of thermal expansion in a temperature range between 30 and 380° C. is preferably 85-100×10−7/° C. In addition, the infra-red absorption glass preferably has a composition consisting essentially of, by weight percent, 60-75% of SiO2, 1-10% of Al2O3, 0-10% of B2O3, 3.5-10% of RO (R being one or more selected from Ca, Mg, Ba, Sr, and Zn), 0.5-5% of Li2O, 8-17% of Na2O+K2O, 2-10% of Fe3O4.

Abstract: Glass, for encapsulating a semiconductor, which is substantially free of lead or other harmful ingredients, but which exhibits a sealing temperature of not higher than 710° C., and which stably seals with Dumet. Further, when the glass has a viscosity of 106 dPa·s, the temperature of said glass is not higher than 710° C., and includes two or more of Li2O, Na2O and K2O and B2O3. Also, the glass may comprise: SiO2, B2O3 and Al2O3 in an amount of from 40 to 70%, from 5 to 20% and from 0 to 15% by weight, respectively; MgO, CaO, SrO, BaO and ZnO in a total amount of from 0 to 45% by weight; and Li2O, Na2O and K2O in a total amount of from 5 to 25% by weight.

Abstract: A tungsten sealing glass for use in a fluorescent lamp, said glass having a composition of, by mass percent, 65-76% SiO2, 10-25% B2O3, 2-6% Al2O3, 0.5-5.8% MgO+CaO+SrO+BaO+ZnO, 3-8% Li2O+Na2O+K2O, 0.01-4% Fe2O3+CeO2, 0.1-5% TiO2, 0.1-10% TiO2+Sb2O3+PbO, and 0-2% ZrO2, wherein Na2O/(Na2O+K2O)≦0.6.

Abstract: A tungsten sealing glass for use in a fluorescent lamp has a composition of, by mass percent, 65-76% SiO2, 10-25% B2O3, 2-6% Al2O3, 0.5-5.8% MgO+CaO+SrO+BaO+ZnO, 3-8% Li2O+Na2O+K2O, 0.01-4% Fe2O3+CeO2, 0-10% TiO2+Sb2O3+PbO, and 0-2% ZrO2, where Na2O/(Na2O+K2O)≦0.6.

Abstract: Glass, for encapsulating a semiconductor, which is substantially free of lead or other harmful ingredients, but which exhibits a sealing temperature of not higher than 710° C., and which stably seals with Dumet. Further, when the glass has a viscosity of 106 dPa·s, the temperature of said glass is not higher than 710° C., and includes two or more of Li2O, Na2O and K2O and B2O3. Also, the glass may comprise: SiO2, B2O3 and Al2O3 in an amount of from 40 to 70%, from 5 to 20% and from 0 to 15% by weight, respectively; MgO, CaO, SrO, BaO and ZnO in a total amount of from 0 to 45% by weight; and Li2O, Na2O and K2O in a total amount of from 5 to 25% by weight.

Abstract: Glass, for encapsulating a semiconductor, which is substantially free of lead or other harmful ingredients, but which exhibits a sealing temperature of not higher than 710° C., and which stably seals with Dumet. Further, when the glass has a viscosity of 106 dPa·s, the temperature of said glass is not higher than 710° C., and includes two or more of Li2O, Na2O and K2O and B2O3. Also, the glass may comprise: SiO2, B2O3 and Al2O3 in an amount of from 40 to 70%, from 5 to 20% and from 0 to 15% by weight, respectively; MgO, CaO, SrO, BaO and ZnO in a total amount of from 0 to 45% by weight; and Li2O, Na2O and K2O in a total amount of from 5 to 25% by weight.

Abstract: Glass, for encapsulating a semiconductor, which is substantially free of lead or other harmful ingredients, but which exhibits a sealing temperature of not higher than 710° C., and which stably seals with Dumet. Further, when the glass has a viscosity of 106 dPa.s, the temperature of said glass is not higher than 710° C., and includes two or more of Li2O, Na2O and K2O and B2O3. Also, the glass may comprise: SiO2, B2O3 and Al2O3 in an amount of from 40 to 70%, from 5 to 20% and from 0 to 15% by weight, respectively; MgO, CaO, SrO, BaO and ZnO in a total amount of from 0 to 45% by weight; and Li2O, Na2O and K2O in a total amount of from 5 to 25% by weight.

Abstract: In order to provide a glass which can be sealed to tungsten and Kovar and has a solarization resistance against the ultraviolet ray, and which is adaptable for use in a fluorescent lamp of a reduced size used as a light source for a lighting device in a liquid crystal display (13). The glass for use in a fluorescent lamp which consists essentially, by weight, of SiO.sub.2 55-79%, B.sub.2 O.sub.3 12.5-25%, Al.sub.2 O.sub.3, 0.5-10% Li.sub.2 O+Na.sub.2 O+K.sub.2 O 1-16%, ZrO.sub.2 0.01-5%, TiO.sub.2 +PbO+Sb.sub.2 O.sub.3 0.05-11%.