Patents by Inventor Hiroyuki Murakoshi

Hiroyuki Murakoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11639141
    Abstract: A wire harness includes an electric wire bundle and an exterior member for electric wire. The exterior member for electric wire includes a tubular exterior body for protecting the electric wire bundle, a slit formed in the exterior body along an exterior axis of the exterior body, and an inner portion continuous with a circumferential end portion of the exterior body. The inner portion is disposed on an outer side of the exterior body before the electric wire bundle is accommodated. Further, the inner portion is formed with an electric wire pressed portion against which the electric wire bundle is pressed. Further, the inner portion is pushed into the exterior body through the slit while being deformed so as to be inverted when the electric wire bundle is pressed against the electric wire pressed portion, and is accommodated in the exterior body together with the electric wire bundle.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: May 2, 2023
    Assignee: YAZAKI CORPORATION
    Inventors: Masafumi Watanabe, Hiroyuki Murakoshi
  • Publication number: 20220169191
    Abstract: A wire harness includes an electric wire bundle and an exterior member for electric wire. The exterior member for electric wire includes a tubular exterior body for protecting the electric wire bundle, a slit formed in the exterior body along an exterior axis of the exterior body, and an inner portion continuous with a circumferential end portion of the exterior body. The inner portion is disposed on an outer side of the exterior body before the electric wire bundle is accommodated. Further, the inner portion is formed with an electric wire pressed portion against which the electric wire bundle is pressed. Further, the inner portion is pushed into the exterior body through the slit while being deformed so as to be inverted when the electric wire bundle is pressed against the electric wire pressed portion, and is accommodated in the exterior body together with the electric wire bundle.
    Type: Application
    Filed: November 29, 2021
    Publication date: June 2, 2022
    Inventors: Masafumi Watanabe, Hiroyuki Murakoshi
  • Patent number: 9166387
    Abstract: An object is to mount a harness protector on a circular-sectional-shaped reinforcing member stably in a space-saving manner. A protector into which a wiring harness is inserted is arranged on a top portion of a circular-sectional-shaped horizontal reinforcing member at a vehicle side along a longitudinal direction of the reinforcing member. A curved bottom surface formed on a bottom of the protector is engaged with a curved top surface of the reinforcing member. A locking clamp projected from the bottom is engaged with a hole of the reinforcing member. A notch portion communicated with the curved bottom surface and a bracket positioned at an upper side of the notch portion are provided on a sidewall of the protector. A receiving bracket of the reinforcing member is engaged with the notch portion, and the bracket is screwed and fixed to the receiving bracket.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: October 20, 2015
    Assignee: Yazaki Corporation
    Inventors: Hiroyuki Murakoshi, Takahiro Abe
  • Publication number: 20140285275
    Abstract: An oscillator that can suppress a solder crack caused by a temperature change by a simple structure at low cost and improve heat cycle resistance performance is provided. The oscillator includes an epoxy resin board and an electronic component mounted on the board. Two-terminal electrode patterns are formed on the board, and connected to terminal electrodes of the electronic component by solder. A projection is formed on each of the electrode patterns at a part connected to a corresponding terminal electrode to create a space between the terminal electrode and the electrode pattern, and the solder forms a fillet in the space. This contributes to enhanced adhesion strength of the solder.
    Type: Application
    Filed: March 5, 2014
    Publication date: September 25, 2014
    Applicant: NIHON DEMPA KOGYO CO., LTD
    Inventors: Daisuke NISHIYAMA, Kenji KASAHARA, Hiroyuki MURAKOSHI
  • Patent number: 8680932
    Abstract: An oscillator that can suppress a solder crack caused by a temperature change by a simple structure at low cost and improve heat cycle resistance performance is provided. The oscillator includes an epoxy resin board and an electronic component mounted on the board. Two-terminal electrode patterns are formed on the board, and connected to terminal electrodes of the electronic component by solder. A projection is formed on each of the electrode patterns at a part connected to a corresponding terminal electrode to create a space between the terminal electrode and the electrode pattern, and the solder forms a fillet in the space. This contributes to enhanced adhesion strength of the solder.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: March 25, 2014
    Assignee: Nihon Dempa Kogyo Co., Ltd
    Inventors: Daisuke Nishiyama, Kenji Kasahara, Hiroyuki Murakoshi
  • Patent number: 8547182
    Abstract: Provided is an oven controlled crystal oscillator which can reduce an occurrence of cracks in an applied solder of a large-sized circuit component and improve reliability. It is an oven controlled crystal oscillator in which a slit is formed in a periphery or below a lower surface of a large-sized circuit component provided on the substrate, further, a plurality of small-sized circuit components, which are smaller than the large-sized circuit component, are disposed around the large-sized circuit component, as necessary, and for the plurality of small-sized circuit components, an electronic component, which is electrically connected, and a dummy electronic component, which is not electrically connected, are used.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: October 1, 2013
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventors: Hiroyuki Murakoshi, Kenji Kasahara, Daisuke Nishiyama
  • Patent number: 8514030
    Abstract: Provided are an oven controlled crystal oscillator in which in a case where a metal lead is soldered to a substrate, even if cracks occur in the solder, its reliability is not reduced, and a production method. That is, an oven controlled crystal oscillator in which pre-tinning solders are formed around openings on a front surface and a rear surface of a substrate in which of a through hole for passing a metal lead therethrough is formed; and in a state where a metal lead including a solder layer (a pre-tinning solder) formed on its surface is inserted into the through hole of the substrate, the metal lead extending from the openings is soldered to the openings on the front surface and the rear surface of the substrate, so as to form a main solder, and a production method of the oven controlled crystal oscillator are provided.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: August 20, 2013
    Assignee: Nihon Dempa Kogyo Co., Ltd
    Inventors: Daisuke Nishiyama, Hiroyuki Murakoshi, Kenji Kasahara
  • Publication number: 20130206928
    Abstract: An object is to mount a harness protector on a circular-sectional-shaped reinforcing member stably in a space-saving manner. A protector into which a wiring harness is inserted is arranged on a top portion of a circular-sectional-shaped horizontal reinforcing member at a vehicle side along a longitudinal direction of the reinforcing member. A curved bottom surface formed on a bottom of the protector is engaged with a curved top surface of the reinforcing member. A locking clamp projected from the bottom is engaged with a hole of the reinforcing member. A notch portion communicated with the curved bottom surface and a bracket positioned at an upper side of the notch portion are provided on a sidewall of the protector. A receiving bracket of the reinforcing member is engaged with the notch portion, and the bracket is screwed and fixed to the receiving bracket.
    Type: Application
    Filed: July 28, 2011
    Publication date: August 15, 2013
    Applicant: YAZAKI CORPORATION
    Inventors: Hiroyuki Murakoshi, Takahiro Aba
  • Patent number: 8466753
    Abstract: A metal base having plural protrusions at its bottom is engaged with and placed on standing metal pins in plural through holes provided in a base board, and a circuit board is fitted to an upper end of the metal pins. A crystal resonator is arranged on the circuit board via a heater element, and the metal base is covered with a metal cover, thereby obtaining a sealed structure of the crystal resonator. A two-stage counterbored portion including a first-stage and a second-stage counterbored portions is formed in the bottom of the base board, and a solder or conductive resin is filled in a gap between the first-stage counterbored portion formed around the metal pin inserted into the through hole, and the through hole and the metal pin to fix the metal pin in the though hole. Slits penetrating through the base board are formed around the metal pin.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: June 18, 2013
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventors: Hiroyuki Mitome, Daisuke Nishiyama, Masakazu Nishiwaki, Hiroyuki Murakoshi
  • Publication number: 20120235761
    Abstract: A metal base having plural protrusions at its bottom is engaged with and placed on standing metal pins in plural through holes provided in a base board, and a circuit board is fitted to an upper end of the metal pins. A crystal resonator is arranged on the circuit board via a heater element, and the metal base is covered with a metal cover, thereby obtaining a sealed structure of the crystal resonator. A two-stage counterbored portion including a first-stage and a second-stage counterbored portions is formed in the bottom of the base board, and a solder or conductive resin is filled in a gap between the first-stage counterbored portion formed around the metal pin inserted into the through hole, and the through hole and the metal pin to fix the metal pin in the though hole. Slits penetrating through the base board are formed around the metal pin.
    Type: Application
    Filed: September 13, 2011
    Publication date: September 20, 2012
    Applicant: NIHON DEMPA KOGYO CO., LTD.
    Inventors: HIROYUKI MITOME, DAISUKE NISHIYAMA, MASAKAZU NISHIWAKI, HIROYUKI MURAKOSHI
  • Publication number: 20120200366
    Abstract: An oscillator that can suppress a solder crack caused by a temperature change by a simple structure at low cost and improve heat cycle resistance performance is provided. The oscillator includes an epoxy resin board and an electronic component mounted on the board. Two-terminal electrode patterns are formed on the board, and connected to terminal electrodes of the electronic component by solder. A projection is formed on each of the electrode patterns at a part connected to a corresponding terminal electrode to create a space between the terminal electrode and the electrode pattern, and the solder forms a fillet in the space. This contributes to enhanced adhesion strength of the solder.
    Type: Application
    Filed: January 26, 2012
    Publication date: August 9, 2012
    Applicant: Nihon Dempa Kogyo Co., Ltd.
    Inventors: Daisuke NISHIYAMA, Kenji Kasahara, Hiroyuki Murakoshi
  • Publication number: 20120098610
    Abstract: Provided are an oven controlled crystal oscillator in which in a case where a metal lead is soldered to a substrate, even if cracks occur in the solder, its reliability is not reduced, and a production method. That is, an oven controlled crystal oscillator in which pre-tinning solders are formed around openings on a front surface and a rear surface of a substrate in which of a through hole for passing a metal lead therethrough is formed; and in a state where a metal lead including a solder layer (a pre-tinning solder) formed on its surface is inserted into the through hole of the substrate, the metal lead extending from the openings is soldered to the openings on the front surface and the rear surface of the substrate, so as to form a main solder, and a production method of the oven controlled crystal oscillator are provided.
    Type: Application
    Filed: October 5, 2011
    Publication date: April 26, 2012
    Inventors: Daisuke NISHIYAMA, Hiroyuki Murakoshi, Kenji Kasahara
  • Publication number: 20120086516
    Abstract: Provided is an oven controlled crystal oscillator which can reduce an occurrence of cracks in an applied solder of a large-sized circuit component and improve reliability. It is an oven controlled crystal oscillator in which a slit is formed in a periphery or below a lower surface of a large-sized circuit component provided on the substrate, further, a plurality of small-sized circuit components, which are smaller than the large-sized circuit component, are disposed around the large-sized circuit component, as necessary, and for the plurality of small-sized circuit components, an electronic component, which is electrically connected, and a dummy electronic component, which is not electrically connected, are used.
    Type: Application
    Filed: October 5, 2011
    Publication date: April 12, 2012
    Inventors: Hiroyuki MURAKOSHI, Kenji KASAHARA, Daisuke NISHIYAMA
  • Publication number: 20090102315
    Abstract: A quartz crystal device includes: a container; a crystal blank hermetically encapsulated in the container; and at least two outside terminals provided on an outer bottom surface of the container and used to surface-mount the quartz crystal device on a wiring board. Each outside terminal has a two-layer structure with a first layer provided on the outer bottom surface and a second layer provided on the first layer and having a flat surface. The second layer has a smaller plane shape than the first layer and is formed on a central part of the first layer at a distance from the perimeter of the first layer.
    Type: Application
    Filed: October 15, 2008
    Publication date: April 23, 2009
    Applicant: NIHON DEMPA KOGYO CO., LTD.
    Inventors: Kenichi KOMADA, Takumi ARIJI, Hiroyuki MURAKOSHI
  • Publication number: 20060189181
    Abstract: Having a wiring board 1 having a plurality of pressure-welding terminals 3 and an insulating substrate 4 supporting the pressure-welding terminals 3, wires 2, 2? are welded under pressure to the pressure-welding terminal 3 on the wiring board 1, for electrical connection. By wiring the plural wires 2 on the wiring board 1 straight in a horizontal direction of the wire board 1; wiring the plural wires 2? in a vertical direction crossing the above wiring direction; and electrically conducting necessary ones of intersections defined by the wires 2 in the horizontal direction and the wires 2? wired in the vertical direction, a desired circuit can be established on the board.
    Type: Application
    Filed: April 14, 2006
    Publication date: August 24, 2006
    Inventor: Hiroyuki Murakoshi
  • Patent number: 6832930
    Abstract: There are provided a circuit member-overlapping step of overlapping a plurality of flexible flat circuit members 20A and 20B in intersecting relation to each other (each of the flat circuit members comprising a plurality of conductors 21 which are juxtaposed at predetermined intervals, and are covered with a covering member 22 in an insulating manner), an internal equipment portion-assembling step of connecting electric parts 30, such as a connector block 31, a fuse block 32 and an electronic board 33, respectively to arbitrary portions of the overlapped flat circuit members 20A and 20B, and an internal equipment portion-inserting step of curling the flat circuit members 20A and 20B and inserting them into a casing 13 while positioning the electric parts 30 relative to the casing 13.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: December 21, 2004
    Assignee: Yazaki Corporation
    Inventors: Katuhiro Kubota, Hiroyuki Murakoshi
  • Publication number: 20040077191
    Abstract: Having a wiring board 1 having a plurality of pressure-welding terminals 3 and an insulating substrate 4 supporting the pressure-welding terminals 3, wires 2, 2′ are welded under pressure to the pressure-welding terminal 3 on the wiring board 1, for electrical connection. By wiring the plural wires 2 on the wiring board 1 straight in a horizontal direction of the wire board 1; wiring the plural wires 2′ in a vertical direction crossing the above wiring direction; and electrically conducting necessary ones of intersections defined by the wires 2 in the horizontal direction and the wires 2′ wired in the vertical direction, a desired circuit can be established on the board.
    Type: Application
    Filed: October 31, 2003
    Publication date: April 22, 2004
    Inventor: Hiroyuki Murakoshi
  • Patent number: 6619967
    Abstract: A connecting structure (23) of an electrical component to an electrical junction box, includes a plurality of long terminals (31) provided on the electrical component (29), and a flat plate-like bus bar (33) which is provided in the electrical junction box (27) to which the electrical component (29) is to be connected, the bus bar (33) being brought into conduction with the terminals (31) in a state in which the electrical component (29) is connected to the electrical junction box (27), a plurality of contact portions (35) formed by bending tip ends of the plurality of terminals (31) toward an outer periphery of the electrical component (29), the contact portions (35) being formed on front ends of the terminals (31) in a connecting direction of the electrical component (29) to the electrical junction box (27), the contact portions (35) being contacted with the bus bar (33) in the state in which the electrical component (29) is connected to the electrical junction box (27), and welding (37) for holding a conta
    Type: Grant
    Filed: December 6, 2001
    Date of Patent: September 16, 2003
    Assignee: Yazaki Corporation
    Inventor: Hiroyuki Murakoshi
  • Publication number: 20030124906
    Abstract: There are provided a circuit member-overlapping step of overlapping a plurality of flexible flat circuit members 20A and 20B in intersecting relation to each other (each of the flat circuit members comprising a plurality of conductors 21 which are juxtaposed at predetermined intervals, and are covered with a covering member 22 in an insulating manner), an internal equipment portion-assembling step of connecting electric parts 30, such as a connector block 31, a fuse block 32 and an electronic board 33, respectively to arbitrary portions of the overlapped flat circuit members 20A and 20B, and an internal equipment portion-inserting step of curling the flat circuit members 20A and 20B and inserting them into a casing 13 while positioning the electric parts 30 relative to the casing 13.
    Type: Application
    Filed: November 27, 2002
    Publication date: July 3, 2003
    Inventors: Katuhiro Kubota, Hiroyuki Murakoshi
  • Patent number: 6583353
    Abstract: An electrical junction box (10) is provided with a power supply (17) and a distribution portion (16). At least the power supply (17) is modularized, the power supply (17) and the distribution portion (16) are structurally independent from each other, and the independent power supply (17) and the distribution portion (16) are electrically connected to each other through a connecting portion (27).
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: June 24, 2003
    Assignee: Yazaki Corporation
    Inventors: Hiroyuki Murakoshi, Hiroyuki Sahara