Patents by Inventor Hiroyuki Nakaji

Hiroyuki Nakaji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10627929
    Abstract: An input terminal that includes a casing defining an opening; a holding member; a piezoelectric sensor; and an adhesive material adhering an outer peripheral edge portion of the holding member to an end edge portion of an opening of the casing. The adhesive material includes a first portion and a second portion. The first portion and the second portion differ from each other in at least one of modulus of elasticity, thickness or width.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: April 21, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hidekazu Kano, Kenichi Mori, Masamichi Ando, Hiroyuki Nakaji
  • Patent number: 10588522
    Abstract: A biological sensor capable of improving the signal to noise ratio of a detection signal obtained by a light-receiving element and amplified by an amplifier is provided. The biological sensor includes a microcontroller that generates a driving signal, a light-emitting element that emits light in accordance with the driving signal, a light-receiving element that outputs a current detection signal based on an intensity of received light, and an amplifying circuit that converts the current detection signal into a voltage detection signal, amplifies an alternating current component of the voltage detection signal, and outputs an amplified detection signal. Furthermore, the microcontroller generates an offset signal that is applied to an offset circuit to offset the direct current component of the voltage detection signal and to obtain biological information by processing the amplified detection signal.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: March 17, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hirofumi Tsuchimoto, Takanori Hayashi, Kengo Saito, Hiroyuki Nakaji
  • Patent number: 10197460
    Abstract: A piezoelectric sensor that includes a piezoelectric film, first and second adhesive layers, first and second plate electrodes and a glass plate. The piezoelectric film includes first and second principal surfaces. The first adhesive layer attaches the first plate electrode to the first principal surface. The second adhesive layer attaches the second plate electrode to the second principal surface. The second plate electrode is attached to the glass plate such that the second adhesive layer and the second plate electrode are interposed between the piezoelectric film and the glass plate. The glass plate is distorted by being pushed. The second adhesive layer is thicker than the first adhesive layer.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: February 5, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideki Kawamura, Hiroyuki Nakaji, Yoshihiro Yamaguchi, Jun Endo, Masato Saito
  • Patent number: 10028681
    Abstract: A biological sensor capable of improving the signal-to-noise ratio of a detection signal obtained by a light-receiving element and amplified by an amplifier is provided. The biological sensor includes a driving signal generating unit that generates a pulse-form driving signal, a light-emitting element that emits light in response to the generated driving signal, a light-receiving element that outputs a detection signal based on an intensity of received light, an amplifying unit including first and second operational amplifiers that amplify the outputted detection signal, an offset signal generating unit and a voltage dividing resistor group that generate a pulse-form offset voltage for offsetting a reference potential of the first operational amplifier when amplifying the detection signal and apply the offset voltage to the first operational amplifier, and a computation unit that obtains biological information by processing the detection signal amplified by the amplifying unit.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: July 24, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hirofumi Tsuchimoto, Hiroyuki Nakaji
  • Patent number: 9946388
    Abstract: A pressure sensor includes a piezoelectric detection electrode, an insulating substrate, a piezoelectric base film, a piezoelectric detection electrode and an insulating substrate. The insulating substrate includes a top face and a bottom face on which the piezoelectric detection electrode is formed. The insulating substrate includes a top face and a bottom face on which the piezoelectric detection electrode is formed. The pressure sensor includes the piezoelectric film whose opposite principal surfaces are provided with respective piezoelectric detection electrodes. When viewed from a direction orthogonal to the principal surfaces, an opening is provided in a center region of one of the piezoelectric detection electrodes provided on at least one of the principal surfaces.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: April 17, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kenichi Mori, Hiroyuki Nakaji, Hidekazu Kano
  • Publication number: 20170192550
    Abstract: An input terminal that includes a casing defining an opening; a holding member; a piezoelectric sensor; and an adhesive material adhering an outer peripheral edge portion of the holding member to an end edge portion of an opening of the casing. The adhesive material includes a first portion and a second portion. The first portion and the second portion differ from each other in at least one of modulus of elasticity, thickness or width.
    Type: Application
    Filed: February 14, 2017
    Publication date: July 6, 2017
    Inventors: HIDEKAZU KANO, Kenichi Mori, Masamichi Ando, Hiroyuki Nakaji
  • Publication number: 20160320893
    Abstract: A pressure sensor includes a piezoelectric detection electrode, an insulating substrate, a piezoelectric base film, a piezoelectric detection electrode and an insulating substrate. The insulating substrate includes a top face and a bottom face on which the piezoelectric detection electrode is formed. The insulating substrate includes a top face and a bottom face on which the piezoelectric detection electrode is formed. The pressure sensor includes the piezoelectric film whose opposite principal surfaces are provided with respective piezoelectric detection electrodes. When viewed from a direction orthogonal to the principal surfaces, an opening is provided in a center region of one of the piezoelectric detection electrodes provided on at least one of the principal surfaces.
    Type: Application
    Filed: July 12, 2016
    Publication date: November 3, 2016
    Inventors: KENICHI MORI, Hiroyuki Nakaji, Hidekazu Kano
  • Publication number: 20160305832
    Abstract: A piezoelectric sensor that includes a piezoelectric film, first and second adhesive layers, first and second plate electrodes and a glass plate. The piezoelectric film includes first and second principal surfaces. The first adhesive layer attaches the first plate electrode to the first principal surface. The second adhesive layer attaches the second plate electrode to the second principal surface. The second plate electrode is attached to the glass plate such that the second adhesive layer and the second plate electrode are interposed between the piezoelectric film and the glass plate. The glass plate is distorted by being pushed. The second adhesive layer is thicker than the first adhesive layer.
    Type: Application
    Filed: June 29, 2016
    Publication date: October 20, 2016
    Inventors: HIDEKI KAWAMURA, Hiroyuki Nakaji, Yoshihiro Yamaguchi, Jun Endo, Masato Saito
  • Publication number: 20160143549
    Abstract: A biological sensor capable of improving the signal to noise ratio of a detection signal obtained by a light-receiving element and amplified by an amplifier is provided. The biological sensor includes a microcontroller that generates a driving signal, a light-emitting element that emits light in accordance with the driving signal, a light-receiving element that outputs a current detection signal based on an intensity of received light, and an amplifying circuit that converts the current detection signal into a voltage detection signal, amplifies an alternating current component of the voltage detection signal, and outputs an amplified detection signal. Furthermore, the microcontroller generates an offset signal that is applied to an offset circuit to offset the direct current component of the voltage detection signal and to obtain biological information by processing the amplified detection signal.
    Type: Application
    Filed: February 2, 2016
    Publication date: May 26, 2016
    Inventors: Hirofumi Tsuchimoto, Takanori Hayashi, Kengo Saito, Hiroyuki Nakaji
  • Publication number: 20150141840
    Abstract: A biological sensor capable of improving the signal-to-noise ratio of a detection signal obtained by a light-receiving element and amplified by an amplifier is provided. The biological sensor includes a driving signal generating unit that generates a pulse-form driving signal, a light-emitting element that emits light in response to the generated driving signal, a light-receiving element that outputs a detection signal based on an intensity of received light, an amplifying unit including first and second operational amplifiers that amplify the outputted detection signal, an offset signal generating unit and a voltage dividing resistor group that generate a pulse-form offset voltage for offsetting a reference potential of the first operational amplifier when amplifying the detection signal and apply the offset voltage to the first operational amplifier, and a computation unit that obtains biological information by processing the detection signal amplified by the amplifying unit.
    Type: Application
    Filed: January 20, 2015
    Publication date: May 21, 2015
    Inventors: Hirofumi Tsuchimoto, Hiroyuki Nakaji
  • Patent number: 6571469
    Abstract: A blanking plate is attached to the bottom surfaces of a split board and a remaining board, which are separated from one bare board. After depositing solder paste on a back electrode of the split board, a solder ball is attached on the solder paste. The split board is then heated to melt the solder ball. The molten solder flows along the back electrode and an edge electrode into a through-hole. A portion of the molten solder swells out of the bottom surface of the bare board, and solidifies and bonds to the back electrode and the edge electrode.
    Type: Grant
    Filed: April 26, 2001
    Date of Patent: June 3, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masanobu Okada, Kazuyoshi Nakaya, Hiroyuki Nakaji, Hirofumi Doi, Iku Nagai, Junichi Nakasone
  • Patent number: 6534726
    Abstract: End-face through holes each comprising a concave-curved end-face opening groove and an end-face electrode covering the inner wall of the groove are formed in the end-faces of a substrate. Furthermore, a solder having a semi-circular shape is attached to the end-face electrode. The solder comprises an electrode facing portion facing the end-face electrode in the end-face groove, and a protuberant portion elongated from the electrode facing portion to protrude on the back-surface side of the substrate. Thereby, even if the substrate or the like is warped, a gap between the end-face electrode and the electrode pad of a mother board can be filled with the protuberant portion of the solder to connect the end-face electrode and the electrode pad to each other.
    Type: Grant
    Filed: October 25, 2000
    Date of Patent: March 18, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masanobu Okada, Tomoyuki Koide, Kazuyoshi Nakaya, Hiroyuki Nakaji
  • Publication number: 20020029905
    Abstract: A blanking plate is attached to the bottom surfaces of a split board and a remaining board, which are separated from one bare board. After depositing solder paste on a back electrode of the split board, a solder ball is attached on the solder paste. The split board is then heated to melt the solder ball. The molten solder flows along the back electrode and an edge electrode into a through-hole. A portion of the molten solder swells out of the bottom surface of the bare board, and solidifies and bonds to the back electrode and the edge electrode.
    Type: Application
    Filed: April 26, 2001
    Publication date: March 14, 2002
    Inventors: Masanobu Okada, Kazuyoshi Nakaya, Hiroyuki Nakaji, Hirofumi Doi, Iku Nagai, Junichi Nakasone
  • Patent number: D691904
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: October 22, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Toru Shimuta, Eiji Takahashi, Kazuhiro Yamaji, Hiroyuki Nakaji