Patents by Inventor Hiroyuki Sakama

Hiroyuki Sakama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6615590
    Abstract: An object of the present invention is to provide a heat exchanger for a temperature control which can take a large area for transferring the heat to the fluid while it is compact, has a good efficiency for exchanging the heat, can increase and decrease the heat transferring area in conformity to the user's needs and the manufacturing cost thereof is low. The heat exchanging boards 2, 3 with a plate constitution and plural thermo modules are superposed alternately so that they have a laminate constitution. The heat exchanging board has a construction such that a flowing path defining board 5, in which a flowing path with a labyrinth construction is formed, is folded by a thin shell 7. The shell has an inflow hole into which the fluid flows and an outflow hole from which a fluid flows out passing through said flowing path with the labyrinth construction. A peltier element is used as the thermo module.
    Type: Grant
    Filed: November 16, 2000
    Date of Patent: September 9, 2003
    Assignee: SMC Corporation
    Inventors: Shigesuke Yaegashi, Hiroyuki Sakama
  • Patent number: 6298669
    Abstract: A Peltier element 4 is fixedly brought in close contact with a surface of a heat exchange block 3 with a large heat capacity which performs heat exchange with an end portion 2a of a heat pipe 2, heat transferring means 5 is disposed on a side of the Peltier element 4 which is opposed to the heat exchange block 3, the heat pipe 2 has at least one heat conduction extending portion 2b projecting from the heat exchange block 3, and heating medium about the heat conduction extending portion 2b is temperature-controlled by the operation control of the Peltier element 4 via the heat exchange block 3 and the heat conduction extending portion 2b of the heat pipe 2.
    Type: Grant
    Filed: October 16, 2000
    Date of Patent: October 9, 2001
    Assignee: SMC Corporation
    Inventors: Hidetoshi Maruyama, Hiroyuki Sakama
  • Patent number: 6111513
    Abstract: The present invention provides open-circuit detection for detecting an open circuit in parallel-connected thermo modules. Plural rows 10a of plural series-connected thermo modules 11a, . . . 11n are connected in parallel. A detection circuit 12 is provided for each row 10a of modules to detect a change in voltage between a power terminal 17a and an intermediate terminal 18 caused by an open circuit. Switching circuits 20 in the detection circuits 12 are connected in series to an alarm circuit 14, so that if any detection circuit 12 detects an open circuit to preclude the corresponding switching element 20 from conducting, the alarm circuit 14 is activated to cause an alarm 32 to issue an alarm.
    Type: Grant
    Filed: December 2, 1998
    Date of Patent: August 29, 2000
    Assignee: SMC Corporation
    Inventors: Hiroyasu Goto, Hiroyuki Sakama