Patents by Inventor Hiroyuki Shinozaki

Hiroyuki Shinozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090067977
    Abstract: The present invention provides a seal device comprising a sealing passage which allows communication between a first space and a second space, and evacuation lines individually connected to the first space and the sealing passage. A gas feed line for feeding dry gas is connected to the sealing passage.
    Type: Application
    Filed: October 7, 2008
    Publication date: March 12, 2009
    Applicant: EBARA CORPORATION
    Inventor: Hiroyuki Shinozaki
  • Publication number: 20080220621
    Abstract: A substrate treatment apparatus that treats a substrate under treatment has an interface section, a substrate loading/unloading section, a reduced pressure atmosphere conveyance chamber, and an exposure treatment chamber. The interface section has a conveyance mechanism that can freely load and unload the substrate under treatment from another device into the apparatus or vice versa. The substrate under treatment can be loaded and unloaded into and from the substrate loading/unloading section in one direction by the conveyance mechanism of the interface section. The reduced pressure atmosphere conveyance chamber is disposed adjacent to and perpendicular to the direction of the substrate loading/unloading section and has a conveyance mechanism that conveys the substrate under treatment under a reduced pressure atmosphere.
    Type: Application
    Filed: May 5, 2008
    Publication date: September 11, 2008
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Hiroyuki Shinozaki, Yasushi Kojima, Shunichi Aiyoshizawa, Kiwamu Tsukamoto
  • Publication number: 20070140815
    Abstract: The present invention provides a seal device comprising a sealing passage which allows communication between a first space and a second space, and evacuation lines individually connected to the first space and the sealing passage. A gas feed line for feeding dry gas is connected to the sealing passage.
    Type: Application
    Filed: January 26, 2007
    Publication date: June 21, 2007
    Applicant: EBARA CORPORATION
    Inventor: Hiroyuki Shinozaki
  • Patent number: 7232286
    Abstract: The present invention provides a seal device comprising a sealing passage which allows communication between a first space and a second space, and evacuation lines individually connected to the first space and the sealing passage. A gas feed line for feeding dry gas is connected to the sealing passage.
    Type: Grant
    Filed: April 2, 2003
    Date of Patent: June 19, 2007
    Assignee: Ebara Corporation
    Inventor: Hiroyuki Shinozaki
  • Publication number: 20070128364
    Abstract: A substrate treatment apparatus is disclosed. The substrate treatment apparatus has an electrostatic chuck mechanism, a grounding mechanism, and an electron beam radiating mechanism. The electrostatic chuck mechanism electrostatically sucks and holds a substrate under treatment. The grounding mechanism freely contacts a predetermined film of a plurality of films formed on a treatment surface of the substrate under treatment sucked and held by the electrostatic chuck mechanism. The electron beam radiating mechanism radiates a resist film formed on the treatment surface side of the substrate under treatment with an electron beam.
    Type: Application
    Filed: December 22, 2006
    Publication date: June 7, 2007
    Applicant: e-Beam Corporation
    Inventors: Hiroyuki Shinozaki, Norihiro Yamaguchi, Katsuhide Watanabe
  • Publication number: 20070107656
    Abstract: A substrate treatment apparatus is disclosed. The substrate treatment apparatus has an electrostatic chuck mechanism, a grounding mechanism, and an electron beam radiating mechanism. The electrostatic chuck mechanism electrostatically sucks and holds a substrate under treatment. The grounding mechanism freely contacts a predetermined film of a plurality of films formed on a treatment surface of the substrate under treatment sucked and held by the electrostatic chuck mechanism. The electron beam radiating mechanism radiates a resist film formed on the treatment surface side of the substrate under treatment with an electron beam.
    Type: Application
    Filed: December 22, 2006
    Publication date: May 17, 2007
    Applicant: e-Beam Corporation
    Inventors: Hiroyuki SHINOZAKI, Norihiro Yamaguchi, Katsuhide Watanabe
  • Publication number: 20070111536
    Abstract: A substrate treatment apparatus is disclosed. The substrate treatment apparatus has an electrostatic chuck mechanism, a grounding mechanism, and an electron beam radiating mechanism. The electrostatic chuck mechanism electrostatically sucks and holds a substrate under treatment. The grounding mechanism freely contacts a predetermined film of a plurality of films formed on a treatment surface of the substrate under treatment sucked and held by the electrostatic chuck mechanism. The electron beam radiating mechanism radiates a resist film formed on the treatment surface side of the substrate under treatment with an electron beam.
    Type: Application
    Filed: November 15, 2006
    Publication date: May 17, 2007
    Applicant: e-BEAM Corporation
    Inventors: Hiroyuki Shinozaki, Norihiro Yamaguchi, Katsuhide Watanabe
  • Publication number: 20070111542
    Abstract: A substrate treatment apparatus is disclosed. The substrate treatment apparatus has an electrostatic chuck mechanism, a grounding mechanism, and an electron beam radiating mechanism. The electrostatic chuck mechanism electrostatically sucks and holds a substrate under treatment. The grounding mechanism freely contacts a predetermined film of a plurality of films formed on a treatment surface of the substrate under treatment sucked and held by the electrostatic chuck mechanism. The electron beam radiating mechanism radiates a resist film formed on the treatment surface side of the substrate under treatment with an electron beam.
    Type: Application
    Filed: December 22, 2006
    Publication date: May 17, 2007
    Applicant: e-Beam Corporation
    Inventors: Hiroyuki Shinozaki, Norihiro Yamaguchi, Katsuhide Watanabe
  • Publication number: 20070095791
    Abstract: A substrate treatment apparatus that treats a substrate under treatment has an interface section, a substrate loading/unloading section, a reduced pressure atmosphere conveyance chamber, and an exposure treatment chamber. The interface section has a conveyance mechanism that can freely load and unload the substrate under treatment from another device into the apparatus or vice versa. The substrate under treatment can be loaded and unloaded into and from the substrate loading/unloading section in one direction by the conveyance mechanism of the interface section. The reduced pressure atmosphere conveyance chamber is disposed adjacent to and perpendicular to the direction of the substrate loading/unloading section and has a conveyance mechanism that conveys the substrate under treatment under a reduced pressure atmosphere.
    Type: Application
    Filed: December 21, 2006
    Publication date: May 3, 2007
    Applicant: e-Beam Corporation
    Inventors: Hiroyuki Shinozaki, Yasushi Kojima, Shunichi Aiyoshizawa, Kiwamu Tsukamoto
  • Publication number: 20070092651
    Abstract: A substrate treatment apparatus that treats a substrate under treatment has an interface section, a substrate loading/unloading section, a reduced pressure atmosphere conveyance chamber, and an exposure treatment chamber. The interface section has a conveyance mechanism that can freely load and unload the substrate under treatment from another device into the apparatus or vice versa. The substrate under treatment can be loaded and unloaded into and from the substrate loading/unloading section in one direction by the conveyance mechanism of the interface section. The reduced pressure atmosphere conveyance chamber is disposed adjacent to and perpendicular to the direction of the substrate loading/unloading section and has a conveyance mechanism that conveys the substrate under treatment under a reduced pressure atmosphere.
    Type: Application
    Filed: December 21, 2006
    Publication date: April 26, 2007
    Applicant: e-Beam Corporation
    Inventors: Hiroyuki Shinozaki, Yasushi Kojima, Shunichi Aiyoshizawa, Kiwamu Tsukamoto
  • Publication number: 20070092646
    Abstract: A substrate treatment apparatus that treats a substrate under treatment has an interface section, a substrate loading/unloading section, a reduced pressure atmosphere conveyance chamber, and an exposure treatment chamber. The interface section has a conveyance mechanism that can freely load and unload the substrate under treatment from another device into the apparatus or vice versa. The substrate under treatment can be loaded and unloaded into and from the substrate loading/unloading section in one direction by the conveyance mechanism of the interface section. The reduced pressure atmosphere conveyance chamber is disposed adjacent to and perpendicular to the direction of the substrate loading/unloading section and has a conveyance mechanism that conveys the substrate under treatment under a reduced pressure atmosphere.
    Type: Application
    Filed: December 21, 2006
    Publication date: April 26, 2007
    Applicant: e-Beam Corporation
    Inventors: Hiroyuki SHINOZAKI, Yasushi KOJIMA, Shunichi AIYOSHIZAWA, Kiwamu TSUKAMOTO
  • Patent number: 7134668
    Abstract: A differential pumping seal apparatus includes a differential pumping seal for sealing a first space and a second space from each other in a non-contact manner, and a back up seal mechanism for sealing the first space and the second space from each other in a contact manner. The back up seal mechanism is operated to seal the first space and the second space from each other only when the differential pumping seal is stopped or while operation of said differential pumping seal is stopped.
    Type: Grant
    Filed: October 23, 2002
    Date of Patent: November 14, 2006
    Assignee: Ebara Corporation
    Inventor: Hiroyuki Shinozaki
  • Publication number: 20060169208
    Abstract: A substrate treatment apparatus that treats a substrate under treatment has an interface section, a substrate loading/unloading section, a reduced pressure atmosphere conveyance chamber, and an exposure treatment chamber. The interface section has a conveyance mechanism that can freely load and unload the substrate under treatment from another device into the apparatus or vice versa. The substrate under treatment can be loaded and unloaded into and from the substrate loading/unloading section in one direction by the conveyance mechanism of the interface section. The reduced pressure atmosphere conveyance chamber is disposed adjacent to and perpendicular to the direction of the substrate loading/unloading section and has a conveyance mechanism that conveys the substrate under treatment under a reduced pressure atmosphere.
    Type: Application
    Filed: January 3, 2006
    Publication date: August 3, 2006
    Inventors: Hiroyuki Shinozaki, Yasushi Kojima, Shunichi Aiyoshizawa, Kiwamu Tsukamoto
  • Patent number: 7025005
    Abstract: The present disclosure provides a stage device applicable to a semiconductor manufacturing apparatus. A stage device 10 comprises a Y-axis stage 20 and an X-axis stage 40, the Y-axis stage 20 including a fixed component 21 and a movable component 26 movable along the Y-axis, the X-axis stage 40 including a fixed component 41 and a movable component 43 movable along the X-axis, wherein the fixed component 41 of the X-axis stage 40 is disposed on the movable component 26 of the Y-axis stage 20, the Y-axis is designed as a scanning axis, while the X-axis is designed as a stepping axis, and a non-contact sealing device is arranged between the fixed component 21 and the movable component 26 of the Y-axis stage 20.
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: April 11, 2006
    Assignee: Ebara Corporation
    Inventors: Hiroyuki Shinozaki, Hirosi Sobukawa, Shoji Yoshikawa
  • Patent number: 6809448
    Abstract: An excimer laser apparatus in which deterioration of the laser gas in the laser container can be suppressed, and damage to the magnetic bearings caused by the laser gas can be suppressed, and which can be reduced in size and operated efficiently, and has low power consumption. Each electromagnet (stator) (7-1) of a magnetic bearing (7) for supporting a rotary shaft (4) of a circulation fan 3 includes excitation coils. Each of the coils is arranged as one unit by embedding a coil body in a ceramic or glass type hardened material which is non-magnetic and has corrosion resistance against a laser gas. The excitation coils are attached to magnetic poles. Alternatively, coil wires (108b) of a radial magnetic bearing (108) can be isolated from a corrosive atmosphere by means of a separation wall (124) while projecting portions of cores (108b) extend through the separation wall (124) and are exposed toward a magnetic bearing rotor (108f).
    Type: Grant
    Filed: October 25, 2002
    Date of Patent: October 26, 2004
    Assignees: Ebara Corporation, Komatsu Ltd.
    Inventors: Natsushi Suzuki, Hisashi Nara, Shunsuke Yoshioka, Toshimitsu Barada, Atsushi Ooyama, Toshiharu Nakazawa, Shinichi Sekiguchi, Hiroyuki Shinozaki
  • Patent number: 6809449
    Abstract: A controlled magnetic bearing apparatus which generates a control signal based on a sensor signal from a displacement sensor for detecting a radial displacement of a rotor to suppress whirling of the rotor due to an external force synchronized with a rotational movement, and can hence support the rotor stably in a levitated state.
    Type: Grant
    Filed: December 11, 2002
    Date of Patent: October 26, 2004
    Assignee: Ebara Corporation
    Inventor: Hiroyuki Shinozaki
  • Patent number: 6785314
    Abstract: There is provided an electric discharge gas laser comprising a housing, a rotating fan, a bearing device and a control. The housing contains a laser gas. The rotating fan is provided in the housing to circulate the gas in the housing. The bearing device magnetically supports a rotating shaft. The bearing device is provided with a sensor device comprising a sensor and a signal processor. The sensor senses the position of the rotating shaft to generate signals indicating the position of the rotating shaft. The signal processor receives and processes the signals delivered from the sensor to output processed signals. The control is separated from the bearing device and is functionally associated with the bearing device to receive the processed signal from the sensor device for controlling the bearing device on the basis of the processed signals.
    Type: Grant
    Filed: June 8, 2001
    Date of Patent: August 31, 2004
    Assignee: Ebara Corporation
    Inventors: Atushi Ooyama, Shinichi Sekiguchi, Hiroyuki Shinozaki, Toshimitsu Barada, Toshiharu Nakazawa
  • Patent number: 6657345
    Abstract: It is an object of the present invention to provide magnetic bearing controller which is able to levitate the controlled object stably by using controlled magnetic forces. In the magnetic bearing controller which supplies a controlled current to an electromagnet for levitating a rotating body at a predetermined position, the controller is provided with an eliminator unit for eliminating frequency components of frequency area which is used by the status detector unit. The eliminator unit is inserted between signal amplifier unit and power amplifier unit for generating controlled current.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: December 2, 2003
    Assignee: Ebara Corporation
    Inventor: Hiroyuki Shinozaki
  • Publication number: 20030201606
    Abstract: The present invention provides a seal device comprising a sealing passage which allows communication between a first space and a second space, and evacuation lines individually connected to the first space and the sealing passage. A gas feed line for feeding dry gas is connected to the sealing passage.
    Type: Application
    Filed: April 2, 2003
    Publication date: October 30, 2003
    Applicant: EBARA CORPORATION
    Inventor: Hiroyuki Shinozaki
  • Patent number: 6603787
    Abstract: A discharge-pumped excimer laser device has a casing, a pair main discharge electrodes, a cross-flow fan for producing a high-speed laser gas flow between the main discharge electrodes, the cross-flow fan having a rotatable shaft projecting from opposite ends thereof, magnetic bearings, the rotatable shaft being rotatably supported by the bearings, protective bearings for supporting the rotatable shaft when the magnetic bearings are not in operation, and a motor for actuating the cross-flow fan. The magnetic bearings include radial magnetic bearings disposed on the opposite ends of the rotatable shaft. One of the radial magnetic bearings which is disposed closely to the motor has a bearing rigidity greater than the bearing rigidity of the magnetic bearing that is disposed remotely from the motor.
    Type: Grant
    Filed: May 23, 2000
    Date of Patent: August 5, 2003
    Assignee: Ebara Corporation
    Inventors: Shinichi Sekiguchi, Hiroyuki Shinozaki, Toshimitsu Barada, Toshiharu Nakazawa