Abstract: An optical semiconductor device has an optical semiconductor element (2) such as an LED or PD, and a light-permeable resin (4) encapsulating the optical semiconductor element. The light-permeable resin contains a base resin and filler. The light-permeable resin (4) has a characteristic that its transmittance increases with a temperature rise within an operating temperature range (e.g., ?40° C.?+85° C.

Abstract: An optical semiconductor element 2 is mounted on a lead frame 1, the optical semiconductor element 2 is encapsulated with a mold resin portion 14 of a first layer that has light permeability, and the mold resin portion 14 of the first layer is encapsulated with a mold resin portion 15 of a second layer that has light permeability. Then, a coefficient of linear expansion of the mold resin portion 14 of the first layer is made smaller than a coefficient of linear expansion of the mold resin portion 15 of the second layer.

Abstract: A photocoupler comprises a light emitting element and a light detecting element which are both mounted on lead frames. The light emitting element and the light detecting element are enclosed in a transparent resin 19, such that the transparent resin can serve as an optical path between the light emitting element and the light detecting element. A retention frame is disposed around the light emitting element and the light detecting element to hold a low-viscosity resin. Also an electronic device includes a photocoupler.

Abstract: A package includes: a substrate having a ridged peripheral portion and a center portion defined by and lower in level than the ridged peripheral portion. A semiconductor chip is mounted on the center portion. A plurality of lead is electrically coupled to the semiconductor chip and penetrates the substrate outwardly from the center portion. The package also includes a cap deeming a cavity space which accommodates the semiconductor chip. The cap has a cap bonding face bonded with a substrate bonding face of the ridged peripheral portion. The cap bonding face and the substrate bonding face are higher in level than the center portion.

Abstract: A semiconductor package comprises a semiconductor chip, an interposer substrate, a plurality of unfilled end face through holes arrayed at the periphery of the semiconductor package, a plurality of inner through holes, a plurality of end face through hole electrodes each formed inside the end face through holes so as to be exposed on a side face of the semiconductor package and a plurality of inner electrodes each formed around openings of the inner through holes on the other side of the interposer substrate, the semiconductor chip being mounted on one side of the interposer substrate, the electrodes being laid out in an array on the other side of the interposer substrate.

Abstract: A package includes: a substrate having a ridged peripheral portion and a center portion defined by and lower in level than the ridged peripheral portion. A semiconductor chip is mounted on the center portion. A plurality of lead is electrically coupled to the semiconductor chip and penetrates the substrate outwardly from the center portion. The package also includes a cap defining a cavity space which accommodates the semiconductor chip. The cap has a cap bonding face bonded with a substrate bonding face of the ridged peripheral portion. The cap bonding face and the substrate bonding face are higher in level than the center portion.

Abstract: A semiconductor device capable of achieving downsizing without reducing the power supply efficiency and capable of reducing switching noises and a memory card using the same are disclosed. The device comprises a plurality of stages of voltage booster circuits for potentially raising a power supply voltage up to a final output voltage, a voltage control unit for controlling an output voltage at a nearby location of the final stage, and one or more internal elements to which the final output voltage is supplied. A primary voltage booster circuit at the first stage includes an inductance element, a switching element, a diode and a driver circuit. At a metal core part of the inductance element, a metal wiring line is used, which was formed by use of a fabrication process of semiconductor integrated circuits, while employing for its core part an inter-wiring layer dielectric film that was formed using the fabrication process.

Abstract: In a manufacturing method of a lead frame for an optical coupling device, the method includes the steps of preparing an elongated lead frame on which a plurality of tie bars are placed between a pair of side rails that are mutually in parallel with each other so as to orthogonally cross the bars, with a plurality of lead terminals being placed in a staggered form in a manner so as to orthogonally cross the tie bars, and laterally cutting the elongated lead frame to prepare a plurality of strap-shaped lead frames. Herein, the elongated lead frame is cut in such a manner that the length of protrusion of a cut end of each of the side rails from each of the tie bars is made longer than the length of protrusion of a lead terminal from each of the tie bars.

Abstract: A photo-coupler semiconductor device includes first and second planar lead frames each having a main portion and a distal portion, a light emitting element and a light receiving element respectively mounted on upper surfaces of the distal portions of the first and second lead frames, a light-transmitting resin member which covers the light emitting element and the light receiving element, and supports the distal portions of the first and second lead frames in spaced opposed relation with the light emitting element and the light receiving element being mounted on the upper surfaces of the distal portions so that the main portions of the first and second lead frames are located in coplanar relation, and a opaque resin member which covers the light-transmitting resin member, and supports the main portions of the first and second lead frames. The light-transmitting resin member and the opaque resin member are each composed of an epoxy resin as a base resin.

Abstract: A device for turning on light allowing the brightness of an inverter-type illumination apparatus to be adjusted without having to install an additional oscillation circuit. The device comprises an active converter which generates a DC voltage from the commercial AC voltage and an inverter which switches the generated DC voltage, includes a capacitor connected in parallel with a discharge tube to be lighted, and supplies a high-frequency current to the discharge tube via a resonance circuit whose resonance frequency is determined according to the equivalent impedance of the discharge tube. The active converter has a triac adjusting the DC voltage, and switching elements of the inverter perform self-oscillation under control of the phase of the resonance current flowing through the resonance circuit.

Abstract: An illumination lighting apparatus has a resonance load circuit including a discharge tube, a power supply circuit for generating DC voltage from commercial AC voltage, and an inverter for converting the generated DC voltage into an AC voltage and supplying the AC voltage to the resonance load circuit. Further, a control circuit is provided which controls electric power supplied to the resonance load circuit in response to operating parameters of the discharge tube immediately after lighting of the discharge tube.

Abstract: A photocoupler comprises a light emitting element 15 and a light detecting element 16 which are both mounted on the same surface of lead frames 13, 14. The light emitting element 15 and the light detecting element 16 are enclosed in a transparent resin 19, such that the transparent resin 19 can serve as an optical path between the light emitting element 15 and the light detecting element 16. In order to hold a low-viscosity transparent resin 19, a retention frame 12 is disposed around the light emitting element 15 and the light detecting element 16.

Abstract: A package includes: a substrate having a ridged peripheral portion and a center portion defined by and lower in level than the ridged peripheral portion. A semiconductor chip is mounted on the center portion. A plurality of lead is electrically coupled to the semiconductor chip and penetrates the substrate outwardly from the center portion. The package also includes a cap deeming a cavity space which accommodates the semiconductor chip. The cap has a cap bonding face bonded with a substrate bonding face of the ridged peripheral portion. The cap bonding face and the substrate bonding face are higher in level than the center portion.

Abstract: A device for turning on light allowing the brightness of an inverter-type illumination apparatus to be adjusted without having to install an additional oscillation circuit. The device comprises an active converter which generates a DC voltage from the commercial AC voltage and an inverter which switches the generated DC voltage, includes a capacitor connected in parallel with a discharge tube to be lighted, and supplies a high-frequency current to the discharge tube via a resonance circuit whose resonance frequency is determined according to the equivalent impedance of the discharge tube. The active converter has a triac adjusting the DC voltage, and switching elements of the inverter perform self-oscillation under control of the phase of the resonance current flowing through the resonance circuit.

Abstract: A device for turning on light allowing the brightness of an inverter-type illumination apparatus to be adjusted without having to install an additional oscillation circuit. The device comprises an active converter which generates a DC voltage from the commercial AC voltage and an inverter which switches the generated DC voltage, includes a capacitor connected in parallel with a discharge tube to be lighted, and supplies a high-frequency current to the discharge tube via a resonance circuit whose resonance frequency is determined according to the equivalent impedance of the discharge tube. The active converter has a triac adjusting the DC voltage, and switching elements of the inverter perform self-oscillation under control of the phase of the resonance current flowing through the resonance circuit.

Abstract: An illumination lighting apparatus has a resonance load circuit including a discharge tube, a power supply circuit for generating DC voltage from commercial AC voltage, and an inverter for converting the generated DC voltage into an AC voltage and supplying the AC voltage to the resonance load circuit. Further, a control circuit is provided which controls electric power supplied to the resonance load circuit in response to operating parameters of the discharge tube immediately after lighting of the discharge tube.

Abstract: An object of the invention is to eliminate a marking process and shorten the time and decrease the cost required for changing contents of marking. An uneven mask is mounted, using a mask set jig, on a mark surface die of the molding die for forming a resin mold package of a semiconductor device. The mark surface die is formed with jig-fixing grooves for mounting the mask set jig. The uneven mask is formed with protrusions and recesses corresponding to the contents of marking to be attached to the surface of the resin mold package. The contents of marking can thus be attached simultaneously with the molding process, and therefore the marking process after molding can be omitted. In accordance with the contents of marking, the uneven mask can be replaced. The time and cost required for changing the contents of marking can thus be reduced.

Abstract: AC voltage is applied to a resonant unit provided with an inductor and a capacitor AC current is supplied to a discharged tube connected to one of the inductor and the capacitor according to the switching operation of the two power semiconductor elements connected in a bridge manner. The resonant unit and first and second voltage drop units are connected in series between I/O terminals of the bridge and the voltages of the first and the second voltage drop units are applied as signals of opposite phases to control terminals of the two power semiconductor elements.

Abstract: AC voltage is applied to a resonant unit provided with an inductor and a capacitor AC current is supplied to a discharge tube connected to one of the inductor and the capacitor according to the switching operation of the two power semiconductor elements connected in a bridge manner. The resonant unit and first and second voltage drop units are connected in series between I/O terminals of the bridge and the voltages of the first and the second voltage drop units are applied as signals of opposite phases to control terminals of the two power semiconductor elements.

Abstract: A resonance type power converter unit has, in an inverter circuit in which voltage driven type semiconductor devices each having the function not to prevent a backward current are connected in series, the respective voltage driven devices are associated with capacitors which are charged or discharged with currents flowing through the devices and voltage detectors for detecting voltages of the capacitors, and drive circuits for turning on and off the voltage driven devices in accordance with outputs of the voltage detectors. With the resonance type power converter unit, stable resonance operation synchronous with a high-frequency load current can be warranted.