Patents by Inventor Hiroyuki Tanabe

Hiroyuki Tanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200265542
    Abstract: A vehicle ride share assist system includes: user terminals possessed by users; and a host server connected to the user terminals and configured to acquire ride share application information entered to the respective user terminals, the ride share application information including available vehicle information indicating whether each of the users has an available vehicle that can be used for ride share, set a plurality of drivers from the users based on the ride share application information, create a plurality of ride share groups that include the drivers respectively, create a plurality of operation schedules for the ride share groups respectively, allocate an allocated vehicle to a user who is set as one of the drivers and does not have the available vehicle, create reservation results of the ride share based on the operation schedules and information about the allocated vehicle, and send the reservation results to the user terminals.
    Type: Application
    Filed: February 17, 2020
    Publication date: August 20, 2020
    Inventors: Kuniaki MATSUSHIMA, Hiroyuki TANABE, Ryusuke TAMANAHA, Yasuhiro SAWADA
  • Publication number: 20200260588
    Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.
    Type: Application
    Filed: April 28, 2020
    Publication date: August 13, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuu SUGIMOTO, Hiroyuki TANABE, Yoshito FUJIMURA
  • Patent number: 10687427
    Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: June 16, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuu Sugimoto, Hiroyuki Tanabe, Yoshito Fujimura
  • Publication number: 20200102948
    Abstract: A reciprocating pump includes: a pump head having an inner space; a diaphragm configured to partition the inner space of the pump head into a pump chamber into which a transfer fluid is to be introduced and a working chamber into which working air is to be introduced; a driving device including a reciprocating member coupled to the diaphragm, the driving device being capable of driving the reciprocating member with the working air at least in a direction that the diaphragm is retracted; and a working air switching device.
    Type: Application
    Filed: January 28, 2019
    Publication date: April 2, 2020
    Applicant: IWAKI CO., LTD.
    Inventors: Shigeyoshi MATSUO, Hiroyuki TANABE, Motohiro TANAKA
  • Patent number: 10558121
    Abstract: In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: February 11, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuu Sugimoto, Hiroyuki Tanabe, Yoshito Fujimura
  • Patent number: 10520817
    Abstract: In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: December 31, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuu Sugimoto, Hiroyuki Tanabe, Yoshito Fujimura
  • Patent number: 10524355
    Abstract: In a suspension board, a ground layer and a first insulating layer are formed on a support substrate. The ground layer has electric conductivity higher than that of the support substrate. A power wiring trace is formed on the first insulating layer. A second insulating layer is formed on the support substrate to cover the ground layer and the first insulating layer. A write wiring trace is formed on the second insulating layer to at least partially overlap with the ground layer. A distance between the ground layer and the write wiring trace in a stacking direction of the support substrate, the first insulating layer and the second insulating layer is set larger than a distance between the power wiring trace and the write wiring trace in the stacking direction.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: December 31, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Daisuke Yamauchi, Hiroyuki Tanabe
  • Patent number: 10524363
    Abstract: A method includes the following steps: S1, providing the insulating layer having an inclined face; S4, disposing a photomask so that in the photoresist, first and second exposure portions are exposed to light, and exposing the photoresist is to light through the photomask; S5, removing the first and the second exposure portions of the photoresist. On the assumption that in S4, light reflected at the metal thin film is focused between the first and the second exposure portions of the photoresist, the inclined face has a bending portion bending in one direction, the portion removed in S5 in the photoresist due to light focus being continuous with the first and the second exposure portions. The second exposure portion includes continuously an avoidance portion that avoids the bending portion and an overlapping portion that overlaps with at least a portion other than the bending portion in the inclined face.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: December 31, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuu Sugimoto, Hiroyuki Tanabe, Yoshito Fujimura
  • Publication number: 20190394882
    Abstract: The wired circuit board includes a metal supporting board, an insulating layer and a conductor layer disposed at one side in the thickness direction of the metal supporting board, a gold plate layer disposed at the other side in the thickness direction of the metal supporting board, and an adherence layer disposed between the metal supporting board and the gold plate layer. The material of the metal supporting board is a corrosion resistant alloy. In the adherence layer, gold and the metal contained in the corrosion resistant alloy are mixedly present.
    Type: Application
    Filed: January 22, 2018
    Publication date: December 26, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuu SUGIMOTO, Hiroyuki TANABE
  • Publication number: 20190346677
    Abstract: A display device includes a light source unit, a light deflector configured to deflect light from the light source unit, an optical element array configured to be two-dimensionally scanned in a main-scanning direction and in a sub-scanning direction with light via the light deflector 15, the optical element array having a plurality of optical elements, and a light projecting unit configured to project light received via the optical element array. In the display device, each of a beam spot diameter in the sub-scanning direction on the optical element array and an arrangement pitch of the optical elements in the sub-scanning direction on the optical element array is equal to or greater than a scanning line pitch on the optical element array.
    Type: Application
    Filed: March 14, 2018
    Publication date: November 14, 2019
    Applicant: Ricoh Company, Ltd.
    Inventors: Hiroyuki TANABE, Yumiko KISHI, Makoto INAMOTO
  • Patent number: 10475427
    Abstract: An operation state detecting apparatus includes the following. An electronic device includes an operation surface and can detect whether there is contact in a plurality of positions. A sheet material can be attached to and detached from the operation surface. The sheet material includes a projecting portion which deforms to change a contact state on the operation surface according to strength of external force. A processor of the electronic device detects whether there is contact in a plurality of positions in an individual detecting region on the operation surface on which a contact state changes by the projecting portion deforming in a state with the sheet material attached to the operation surface. The processor performs a specific process according to strength or speed of an operation applied to the projecting portion judged based on a detected result of whether contact is detected in the plurality of positions.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: November 12, 2019
    Assignee: CASIO COMPUTER CO., LTD.
    Inventors: Masahiko Kodama, Takashi Soda, Hiroyuki Tanabe
  • Patent number: 10437052
    Abstract: An image display device includes a light source to emit light, an image forming element to form an image with the light emitted from the light source, a micro-lens array to be irradiated with the light forming the image, the micro-lens array including a plurality of lens columns arranged in a second direction, each lens column including micro-lenses being arranged in a first direction, the first direction and the second direction being perpendicular with each other, and a projection optical system to project light passing through the micro-lens array toward a transmitting and reflecting member.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: October 8, 2019
    Assignee: RICOH COMPANY, LTD.
    Inventors: Kento Nakamura, Daisuke Ichii, Makoto Inamoto, Hiroyuki Tanabe
  • Patent number: 10373498
    Abstract: A communication device (202) for performing communication with other vehicle through a wireless communication network which performs communication by switching a communication state to a standby state or to a connecting state, and a state setting means (208) for selectively setting a state of the communication device to the standby state or to the connecting state are provided, wherein the state setting means judges whether or not at least one predetermined condition is met based on the information on an own vehicle and/or the information on other vehicle, sets the communication device to the connecting state when the condition is met, and sets the communication device to the standby state provided that the condition is not met.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: August 6, 2019
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Hiroyuki Tanabe
  • Publication number: 20190197999
    Abstract: An operation state detecting apparatus includes the following. An electronic device includes an operation surface and can detect whether there is contact in a plurality of positions. A sheet material can be attached to and detached from the operation surface. The sheet material includes a projecting portion which deforms to change a contact state on the operation surface according to strength of external force. A processor of the electronic device detects whether there is contact in a plurality of positions in an individual detecting region on the operation surface on which a contact state changes by the projecting portion deforming in a state with the sheet material attached to the operation surface. The processor performs a specific process according to strength or speed of an operation applied to the projecting portion judged based on a detected result of whether contact is detected in the plurality of positions.
    Type: Application
    Filed: December 21, 2018
    Publication date: June 27, 2019
    Inventors: Masahiko KODAMA, Takashi SODA, Hiroyuki TANABE
  • Patent number: 10327327
    Abstract: In a suspension board, a first insulating layer is formed on a support substrate. A ground layer and a power wiring trace are formed on the first insulating layer. The ground layer has electric conductivity higher than that of the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer and the power wiring trace. A write wiring trace is formed on the second insulating layer to overlap with the ground layer. In a stacking direction of the support substrate, the first insulating layer and the second insulating layer, a distance between the ground layer and the write wiring trace is larger than a distance between the power wiring trace and the write wiring trace.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: June 18, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Daisuke Yamauchi, Hiroyuki Tanabe
  • Publication number: 20190130516
    Abstract: A vehicle ride share assist system includes a plurality of user terminals (2), and a host server (4) connected to the user terminals via a network (3), wherein each of the user terminals includes an application input unit (15) configured to allow a corresponding user to enter a ride share application and to transmit the ride share application to the host server, and the host server includes an operation scheduling unit (24) configured to create an operation schedule based on the ride share applications and to select at least one driver in the operation schedule from the users who have transmitted the ride share applications.
    Type: Application
    Filed: October 18, 2018
    Publication date: May 2, 2019
    Inventors: Kuniaki MATSUSHIMA, Hiroyuki TANABE, Ryusuke TAMANAHA, Yasuhiro SAWADA
  • Publication number: 20190114732
    Abstract: A ride share assist system includes a host server including a user acknowledge receiving unit (42) configured to receive an intent confirmation message from each user terminal, and determine if the intent confirmation message is received before a prescribed deadline time defined for each user as a time point preceding the corresponding scheduled boarding time by a prescribed time period. If the intent confirmation message is not received from any one of the user terminals by the user acknowledge receiving unit (42) before the deadline time, the corresponding ride share application is canceled.
    Type: Application
    Filed: October 15, 2018
    Publication date: April 18, 2019
    Inventors: Hiroyuki TANABE, Yuji SAITO, Kuniaki MATSUSHIMA, Toru KIMURA
  • Patent number: 10262541
    Abstract: This convoy travel control apparatus includes: a communication portion; a travel control portion; and a joining control portion, wherein when an own vehicle is travelling in convoy, if the communication portion has received, from an independent vehicle not incorporated in group of convoy vehicles travelling in convoy, request information to incorporate the independent vehicle into the group of convoy vehicles, then the joining control portion determines a positional relationship between a position of the group of convoy vehicles and a position of the independent vehicle, and wherein according to the determined positional relationship, then the joining control portion exercises control, which is for incorporating the independent vehicle into the group of convoy vehicles, on the group of convoy vehicles via the communication portion.
    Type: Grant
    Filed: October 1, 2014
    Date of Patent: April 16, 2019
    Assignee: Honda Motor Co., Ltd.
    Inventors: Masako Miyazawa, Hiroyuki Tanabe, Michi Yamane, Naoto Sen, Junpei Yashima, Hideo Nakahama, Mahito Ishiyama, Takuji Hiroma
  • Patent number: 10257926
    Abstract: A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: April 9, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuu Sugimoto, Yoshito Fujimura, Hiroyuki Tanabe
  • Patent number: 10251263
    Abstract: A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: April 2, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuu Sugimoto, Yoshito Fujimura, Hiroyuki Tanabe