Abstract: A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating on the inner wall of the via formation hole.

Abstract: A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating on the inner wall of the via formation hole.

Abstract: A remote control apparatus includes a moving apparatus that has a control unit that stores map information and a target position and controls a tracking move to the target position along a moving path, and a remote control unit that transmits the target position input by a manipulating unit to the moving apparatus, and the control unit detects an input value of the manipulating unit as an amount of change, and autonomously moves the moving apparatus in a tracking manner while changing the target position in accordance with the amount of change.

Abstract: A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating an the inner wall of the via formation hole.

Abstract: Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil 20 composed of a primer resin layer 21 and a metal layer 22 is placed on a surface of a double-face CCL 10, which is prepared by applying metal layers 12 and 13 onto the surfaces of a support base 11, and the primer-coated metal foil 20 and the double-face CCL 10 are bonded and the primer resin layer 21 is cured. A via Vb is thereafter formed from the metal layer 22 side, and a metal-plate layer 30 is formed on the resulting metal layer 22. After that, the etched down metal-plate layer 30 and the metal layer 22 are patterned, and using the patterned layers as a mask, the primer resin layer 21 is patterned.

Abstract: The present invention provides a printed wiring board which can prevent a plating failure in a connection hole such as a via to be formed in the printed wiring board, thereby can enhance the connection reliability and a manufacturing method therefor. The printed wiring board 100 includes a thermosetting resin sheet 16 (insulation layer) having a via hole 20 (through hole) constituted by inner wall parts having different taper angles from each other, a copper foil 17 (conductor layer) provided on the thermosetting resin sheet 16, and a wiring pattern 13 (wiring layer) which is provided so as to be exposed from the via hole 20 and is electrically connected with the copper foil 17 through the via hole 20.

Abstract: A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating an the inner wall of the via formation hole.

Abstract: A multi-layer wiring board includes a substrate; a land including a first conductive member arranged on the substrate; a second conductive member that is deposited on a surface of the first conductive member, which is a surface distant from the substrate; and a stress relaxation layer arranged between the first conductive member and the second conductive member; and a connection portion that makes contact with the land and that is electrically connected to the land.

Abstract: Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil 20 composed of a primer resin layer 21 and a metal layer 22 is placed on a surface of a double-face CCL 10, which is prepared by applying metal layers 12 and 13 onto the surfaces of a support base 11, and the primer-coated metal foil 20 and the double-face CCL 10 are bonded and the primer resin layer 21 is cured. A via Vb is thereafter formed from the metal layer 22 side, and a metal-plate layer 30 is formed on the resulting metal layer 22. After that, the etched down metal-plate layer 30 and the metal layer 22 are patterned, and using the patterned layers as a mask, the primer resin layer 21 is patterned.

Abstract: To provide a method for manufacturing a printed wiring board which can easily and surely form a fine wiring pattern having a small layer thickness while enhancing the productivity by simplifying a process, when forming a wiring structure having a filled via. The method for manufacturing a printed wiring board according to the present invention includes: bonding a metal foil 20 provided with a carrier foil having a carrier foil layer 22 and a metal foil layer 21 onto a resin substrate 11 (insulator) so that the metal foil layer 21 can contact one surface of the resin substrate 11; subsequently forming a via hole V (connection hole); filling the via with a film 32 formed by plating; then peeling the carrier foil layer 22 of the metal foil 20 provided with the carrier foil from the metal foil layer 21; and patterning the metal foil layer 21 which remains on the resin substrate 11 in a bonded state to form a wiring pattern 23.

Abstract: In a method for manufacturing a composite wiring board, a through hole is formed in a sheet having a shrinkage-suppressing effect, and the through hole is filled with conductive paste to obtain a sheet for formation of a conductor. The sheet for formation of the conductor and a green sheet for a substrate in their laminated state are fired to obtain a ceramic substrate having a surface provided with a sintered metal conductor. A fired product of the sheet having the shrinkage-suppressing effect is removed from the surface of the ceramic substrate. Finally, a resin layer is formed on the surface of the ceramic substrate.

Abstract: The present invention provides a printed wiring board which can prevent a plating failure in a connection hole such as a via to be formed in the printed wiring board, thereby can enhance the connection reliability and a manufacturing method therefor. The printed wiring board 100 includes a thermosetting resin sheet 16 (insulation layer) having a via hole 20 (through hole) constituted by inner wall parts having different taper angles from each other, a copper foil 17 (conductor layer) provided on the thermosetting resin sheet 16, and a wiring pattern 13 (wiring layer) which is provided so as to be exposed from the via hole 20 and is electrically connected with the copper foil 17 through the via hole 20.

Abstract: A data erasing device that erases data recorded on a magnetic disk, by a magnetic field generated in a horizontal direction by magnets, in order to prevent leakage of the data recorded on the magnetic disk of a magnetic disk device to be abandoned. The data erasing device includes a main body case having a path on which a tray is reciprocated, a demagnetizing circuit having plural permanent magnets adjacently disposed along the path in mutually adsorbing polarities, and a tray for accommodating the magnetic recording medium, and capable of reciprocating on the path. This tray includes a first accommodation groove and a second accommodation groove for accommodating the magnetic disk device. The first accommodation groove and the second accommodation groove cross each other to form an angle of 45 degrees or 90 degrees.

Abstract: A method for manufacturing magnetic metal powder is provided. In the method, a powdered magnetic metal oxide is supplied to a heat treatment furnace with a carrier gas composed of a reducing gas. The heat treatment furnace is maintained at temperatures above a reducing action starting temperature for the powdered magnetic metal oxide and above a melting point of the magnetic metal in the powder. The powdered magnetic metal oxide is subject to a reducing process, and then magnetic metal particles, the resultant reduced product, is melted to form a melt. The melt is re-crystallized in a succeeding cooling step, to obtain single crystal magnetic metal power in substantially spherical form.

Abstract: In a portable data erasing device, to prevent data leaks from magnetic disk devices to be disposed, data is erased by a simple operation. The data erasing device using a magnetic field generated by permanent magnets to erase data comprises a sliding tray, a main body and a swinging tray. The sliding tray is movable into and out from the main body, two permanent magnets, adjacently arranged so that the north and south poles thereof have mutually attracting polarities, are attached to the front end of the sliding tray. One end of the swinging tray is fixed to the upper surface of the main body by a shaft, so that a magnetic disk device can be mounted and swung on top of the main body. While the sliding tray is extracted stepwise from the main body, the magnetic disk device can be swung, and data on the magnetic disks erased.

Abstract: A composite wiring board includes a ceramic substrate, a resin layer in contact with at least one surface of the ceramic substrate and a sintered metal conductor piercing through the resin layer. The composite wiring board is manufactured by a method including the steps of forming a through hole in a sheet having a shrinkage-suppressing effect and filling the through hole with conductive paste to obtain a sheet for formation of a conductor, firing the conductor formation sheet and a green sheet for a substrate in their laminated state to obtain a ceramic substrate having a surface provided with a sintered metal conductor, removing from the surface of the ceramic substrate a fired product of the sheet having the shrinkage-suppressing effect and forming a resin layer on the surface of the ceramic substrate.