Patents by Inventor Hiroyuki Ushiba
Hiroyuki Ushiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10558127Abstract: The purpose of the present invention is to provide an exposure condition evaluation device that appropriately evaluates a wafer exposure condition or calculates an appropriate exposure condition, on the basis of information obtained from an FEM wafer, without relying on the formation state of the FEM wafer. In order to achieve the foregoing, the present invention proposes an exposure condition evaluation device which evaluates an exposure condition of a reduction projection exposure device, on the basis of the information of patterns exposed on a sample by the reduction projection exposure device, and which uses a second feature amount of a plurality of patterns formed by making exposure conditions uniform to correct a first feature amount of a plurality of patterns formed by a plurality of different exposure condition settings.Type: GrantFiled: December 18, 2015Date of Patent: February 11, 2020Assignee: Hitachi High-Technologies CorporationInventors: Shinichi Shinoda, Yasutaka Toyoda, Hiroyuki Ushiba, Hitoshi Sugahara
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Patent number: 10223784Abstract: A pattern evaluation device of the present invention includes a model estimation unit that estimates a model caused by a manufacturing method on the basis of an inspection image, a deformation amount estimation unit that estimates a deformation amount of the inspection image by using the estimated model, a reference data deformation unit that deforms reference data by using the estimated deformation amount, and an evaluation unit that performs an evaluation process by comparing the reference data which is deformed by the reference data deformation unit with the inspection image.Type: GrantFiled: January 27, 2014Date of Patent: March 5, 2019Assignee: Hitachi High-Technologies CorporationInventors: Hiroyuki Ushiba, Tsuyoshi Minakawa
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Patent number: 10190875Abstract: The purpose of the present invention is to provide a pattern measurement condition setting device which appropriately sets a measurement condition for finding out an appropriate exposure condition.Type: GrantFiled: June 17, 2015Date of Patent: January 29, 2019Assignee: Hitachi High-Technologies CorporationInventors: Shinichi Shinoda, Yasutaka Toyoda, Hiroyuki Ushiba, Hitoshi Sugahara
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Patent number: 10176720Abstract: An auto driving control system includes: a situation determining unit which recognizes a situation around the vehicle and determines whether automatic traveling is possible; a drive control unit which performs traveling control when the automatic traveling is possible; a state determining unit which determines whether an occupant is able to drive; and an estimation drive control unit configured such that when the automatic traveling is difficult and it is difficult for the occupant to take over the driving, and when it is determined that execution of a function of the automatic traveling is difficult due to a first sensor, the estimation drive control unit executes the function by using information of a second sensor, and performs traveling control of the vehicle, wherein the automatic traveling is continued based on a control instruction of the estimation drive control unit until the occupant becomes able to take over the driving.Type: GrantFiled: February 27, 2017Date of Patent: January 8, 2019Assignee: HITACHI, LTD.Inventors: Hiroyuki Ushiba, Mariko Okude, Takehisa Nishida
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Publication number: 20170336717Abstract: The purpose of the present invention is to provide an exposure condition evaluation device that appropriately evaluates a wafer exposure condition or calculates an appropriate exposure condition, on the basis of information obtained from an FEM wafer, without relying on the formation state of the FEM wafer. In order to achieve the foregoing, the present invention proposes an exposure condition evaluation device which evaluates an exposure condition of a reduction projection exposure device, on the basis of the information of patterns exposed on a sample by the reduction projection exposure device, and which uses a second feature amount of a plurality of patterns formed by making exposure conditions uniform to correct a first feature amount of a plurality of patterns formed by a plurality of different exposure condition settings.Type: ApplicationFiled: December 18, 2015Publication date: November 23, 2017Applicant: Hitachi High-Technologies CorporationInventors: Shinichi SHINODA, Yasutaka TOYODA, Hiroyuki USHIBA, Hitoshi SUGAHARA
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Publication number: 20170270798Abstract: An auto driving control system includes: a situation determining unit which recognizes a situation around the vehicle and determines whether automatic traveling is possible; a drive control unit which performs traveling control when the automatic traveling is possible; a state determining unit which determines whether an occupant is able to drive; and an estimation drive control unit configured such that when the automatic traveling is difficult and it is difficult for the occupant to take over the driving, and when it is determined that execution of a function of the automatic traveling is difficult due to a first sensor, the estimation drive control unit executes the function by using information of a second sensor, and performs traveling control of the vehicle, wherein the automatic traveling is continued based on a control instruction of the estimation drive control unit until the occupant becomes able to take over the driving.Type: ApplicationFiled: February 27, 2017Publication date: September 21, 2017Applicant: HITACHI, LTD.Inventors: Hiroyuki USHIBA, Mariko OKUDE, Takehisa NISHIDA
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Publication number: 20170160082Abstract: The purpose of the present invention is to provide a pattern measurement condition setting device which appropriately sets a measurement condition for finding out an appropriate exposure condition.Type: ApplicationFiled: June 17, 2015Publication date: June 8, 2017Inventors: Shinichi SHINODA, Yasutaka TOYODA, Hiroyuki USHIBA, Hitoshi SUGAHARA
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Patent number: 9619727Abstract: An inspection device that performs pattern matching on a searched image performs matching between a template image of an inspection object and the searched image by using: a feature region extraction process unit that extracts a feature quantity from the template image acquired for learning; a feature quantity extraction process unit that extracts a feature quantity from the searched image acquired for learning; a mutual feature quantity calculation process unit that calculates a mutual feature quantity of the template image and the searched image from the feature quantity extracted from the template image and the feature quantity extracted from the searched image; a learning process unit that calculates, using a plurality of the mutual feature quantities, a discrimination boundary surface that determines matching success or failure; a process unit that calculates a plurality of the mutual feature quantities from an image acquired from the inspection object; and the plurality of mutual feature quantities andType: GrantFiled: July 16, 2013Date of Patent: April 11, 2017Assignee: Hitachi High-Technologies CorporationInventors: Wataru Nagatomo, Yuichi Abe, Hiroyuki Ushiba
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Publication number: 20160063690Abstract: A pattern evaluation device of the present invention includes a model estimation unit that estimates a model caused by a manufacturing method on the basis of an inspection image, a deformation amount estimation unit that estimates a deformation amount of the inspection image by using the estimated model, a reference data deformation unit that deforms reference data by using the estimated deformation amount, and an evaluation unit that performs an evaluation process by comparing the reference data which is deformed by the reference data deformation unit with the inspection image.Type: ApplicationFiled: January 27, 2014Publication date: March 3, 2016Inventors: Hiroyuki USHIBA, Tsuyoshi MINAKAWA
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Patent number: 9141879Abstract: In order to provide a computer program, an image processing device, and a pattern matching method that perform pattern matching at a high level of accuracy without relying on edge deformation, contrast fluctuations, etc., in one embodiment, the disclosed pattern matching method and device perform pattern matching over an image using a template produced on the basis of the below mentioned design data. The pattern matching method and device determine the characteristic quantities of the image for an inner region and/or an outer region that are divided by a line that defines the contour of a pattern, and determine positions at which said characteristic quantities satisfy predetermined conditions to be matching positions, matching position candidates, or erroneous matching positions.Type: GrantFiled: May 30, 2011Date of Patent: September 22, 2015Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Hiroyuki Ushiba, Yasutaka Toyoda, Yuichi Abe, Mitsuji Ikeda
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Publication number: 20150199583Abstract: An inspection device that performs pattern matching on a searched image performs matching between a template image of an inspection object and the searched image by using: a feature region extraction process unit that extracts a feature quantity from the template image acquired for learning; a feature quantity extraction process unit that extracts a feature quantity from the searched image acquired for learning; a mutual feature quantity calculation process unit that calculates a mutual feature quantity of the template image and the searched image from the feature quantity extracted from the template image and the feature quantity extracted from the searched image; a learning process unit that calculates, using a plurality of the mutual feature quantities, a discrimination boundary surface that determines matching success or failure; a process unit that calculates a plurality of the mutual feature quantities from an image acquired from the inspection object; and the plurality of mutual feature quantities andType: ApplicationFiled: July 16, 2013Publication date: July 16, 2015Applicant: Hitachi High-Technologies CorporationInventors: Wataru Nagatomo, Yuichi Abe, Hiroyuki Ushiba
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Publication number: 20130216141Abstract: In order to provide a computer program, an image processing device, and a pattern matching method that perform pattern matching at a high level of accuracy without relying on edge deformation, contrast fluctuations, etc., in one embodiment, the disclosed pattern matching method and device perform pattern matching over an image using a template produced on the basis of the below mentioned design data. The pattern matching method and device determine the characteristic quantities of the image for an inner region and/or an outer region that are divided by a line that defines the contour of a pattern, and determine positions at which said characteristic quantities satisfy predetermined conditions to be matching positions, matching position candidates, or erroneous matching positions.Type: ApplicationFiled: May 30, 2011Publication date: August 22, 2013Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Hiroyuki Ushiba, Yasutaka Toyoda, Yuichi Abe, Mitsuji Ikeda
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Publication number: 20130170757Abstract: Disclosed is a method for creating a template for the purpose of performing pattern matching on the basis of a template image having high contrast. Also disclosed is an image processing apparatus. In the method for creating the template, design data is partially extracted, and on the basis of the extracted partial region, the template for template matching is created. In the image processing apparatus, such method is performed. In the method and the apparatus, a density of edges that belong to a predetermined region in the design data equivalent to the region to be searched for in the template matching is obtained.Type: ApplicationFiled: May 13, 2011Publication date: July 4, 2013Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Shinichi Shinoda, Yasutaka Toyoda, Yuichi Abe, Mitsuji Ikeda, Hiroyuki Ushiba