Patents by Inventor Hiroyuki Yagyu

Hiroyuki Yagyu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6399947
    Abstract: An infrared ray receiving element includes a substrate made of a pyroelectric material and having at least one cantilever portion surrounded by a slit, in which at least a part of the cantilever portion in the substrate is uniformly polarized in the same direction and the remainder in the substrate includes a portion polarized at random. At least a pair of electrodes are respectively provided on a top surface and a bottom surface of the cantilever portion.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: June 4, 2002
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Hiroyuki Yagyu, Tomoaki Matsushima, Motoo Ikari, Yuji Takada, Ryo Taniguchi, Makoto Nishimura, Nobuyuki Miyagawa, Masato Kawashima
  • Publication number: 20010020681
    Abstract: An infrared ray receiving element includes a substrate made of a pyroelectric material and having at least one cantilever portion surrounded by a slit, in which at least a part of the cantilever portion in the substrate is uniformly polarized in the same direction and the remainder in the substrate includes a portion polarized at random. At least a pair of electrodes are respectively provided on a top surface and a bottom surface of the cantilever portion.
    Type: Application
    Filed: December 11, 2000
    Publication date: September 13, 2001
    Applicant: MATSUSHITA ELECTRIC WORKS, LTD.
    Inventors: Hiroyuki Yagyu, Tomoaki Matsushima, Motoo Ikari, Yuji Takada, Ryo Taniguchi, Makoto Nishimura, Nobuyuki Miyagawa, Masato Kawashima
  • Patent number: 6121614
    Abstract: A pyroelectric-type IR receiving element comprises a pyroelectric substrate which is fixed to a supporting body at its support ends and at least one rectangular patch formed in the substrate. The patch is formed on its opposite surfaces with first and second electrodes which are overlapped to each other. The substrate has a U-shaped slit composed of a pair of side slits and a base slit connecting the side slits. The U-shaped slit surrounds continuously three sides of the patch, so that the patch is supported by the substrate in a cantilever fashion at a cantilever end which is opposed to one of the support ends of the substrate. Since a thermal stress applied to the substrate when the substrate is exposed to a temperature change is absorbed by the U-shaped slit, a stress concentration to be considered is not developed in the patch. As a result, it is possible to reduce the occurrence of popcorn noise, while maintaining good IR sensitivity.
    Type: Grant
    Filed: April 14, 1997
    Date of Patent: September 19, 2000
    Assignees: Matsushita Electricworks, Ltd., Yamaju Ceramics Co., Ltd.
    Inventors: Ryo Taniguchi, Motoo Ikari, Tomoaki Matsushima, Hiroyuki Yagyu, Yoshihiro Matsumura, Kyosuke Iribe, Toshiyuki Suzuki, Sadayuki Sumi, Kazuhiro Horiuchi, Hideki Ohashi