Patents by Inventor Hisafumi Maruo
Hisafumi Maruo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8171787Abstract: A liquid-level detecting apparatus is provided. The liquid-level detecting apparatus includes a resistance plate with an insulating substrate; conductive segments on the insulating substrate at substantially equal intervals; a resistor mounted on the conductive segments and through which the conductive segments are connected to each other; an conductive sliding arm including a contact part for selectively coming into sliding contact with a portion of the conductive segments; a conducting pattern which is formed between one or more pairs of two adjacent conductive segments to short-circuit the two adjacent conductive segments; and a measuring device which is connected to one of the conductive segments and measures a value based on a portion of the resistor connected between a first segment of the conductive segments contacted by the contact part and the one of the conductive segments connected to the measuring device, thereby detecting a level of the liquid surface.Type: GrantFiled: April 23, 2009Date of Patent: May 8, 2012Assignee: Yazaki CorporationInventors: Hisafumi Maruo, Takahiro Miyakawa
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Patent number: 7752912Abstract: A sliding fluid level-detecting device which is mounted in a fuel tank of a vehicle and detects a remaining amount of a liquid fuel in the tank by sliding, on a plurality of stripes of an electrode formed at an electrode part electrically connecting with a fuel meter, a contact point provided on a slider interlocking with displacement of a float floating on a fluid surface of the liquid fuel, wherein the electrode is formed out of a glass-incorporated silver-palladium alloy where glass is mixed in an amount of 30 to 50 parts by weight per 100 parts by weight of a silver-palladium alloy and the contact point is formed out of a conductive material having a Vickers hardness (Hv) of 190 to 250.Type: GrantFiled: January 16, 2007Date of Patent: July 13, 2010Assignee: Yazaki CorporationInventors: Syunsuke Nagakura, Hisafumi Maruo, Takahiro Miyakawa
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Publication number: 20090266157Abstract: A liquid-level detecting apparatus is provided. The liquid-level detecting apparatus includes a resistance plate with an insulating substrate; conductive segments on the insulating substrate at substantially equal intervals; a resistor mounted on the conductive segments and through which the conductive segments are connected to each other; an conductive sliding arm including a contact part for selectively coming into sliding contact with a portion of the conductive segments; a conducting pattern which is formed between one or more pairs of two adjacent conductive segments to short-circuit the two adjacent conductive segments; and a measuring device which is connected to one of the conductive segments and measures a value based on a portion of the resistor connected between a first segment of the conductive segments contacted by the contact part and the one of the conductive segments connected to the measuring device, thereby detecting a level of the liquid surface.Type: ApplicationFiled: April 23, 2009Publication date: October 29, 2009Inventors: Hisafumi MARUO, Takahiro Miyakawa
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Publication number: 20090180269Abstract: For providing a design apparatus for designing a small diode connector durable for overcurrent flow easily in low cost, and a design method for designing the diode connector, and a diode connector durable for overcurrent flow to be small in low cost, the design apparatus 1 having a plurality of lead frames, a diode chip and a bridge and solder brazing these components includes a determining unit determining one of the name of the brazing alloy to be used as a solder and a total volume of the lead frames and the bridge when the other of the name of the brazing alloy and the total volume of the lead frames and the bridge is inputted, based on the inputted other and a correlation data of the total volume and a heat temperature of the diode chip.Type: ApplicationFiled: January 8, 2009Publication date: July 16, 2009Inventors: Yasutaka Nagaoka, Nobuhiko Suzuki, Hisafumi Maruo, Masashi Nagao, Takahiro Miyakawa
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Patent number: 7343799Abstract: In an apparatus for detecting a liquid level, a sliding arm is supported on the resistance plate so as to pivot thereon in accordance with the liquid level. A plurality of first conductive segments is arranged on the resistance plate in a pivoting direction of the sliding arm. Adjacent ones of the first conductive segments are connected by resistive elements respectively. A plurality of second conductive segments are electrically connected to each other, and arranged on the resistance plate in the pivoting direction. A first contact part is provided on the sliding arm, and slides on the first conductive segments in accordance with a pivoting movement of the sliding arm. A second contact part is provided on the sliding arm, and slides on the second conductive segments in accordance with the pivoting movement of the sliding arm.Type: GrantFiled: August 27, 2002Date of Patent: March 18, 2008Assignee: Yazaki CorporationInventors: Shunsuke Nagakura, Hisafumi Maruo, Manabu Ooishi
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Publication number: 20070163341Abstract: A sliding fluid level-detecting device which is mounted in a fuel tank of a vehicle and detects a remaining amount of a liquid fuel in the tank by sliding, on a plurality of stripes of an electrode formed at an electrode part electrically connecting with a fuel meter, a contact point provided on a slider interlocking with displacement of a float floating on a fluid surface of the liquid fuel, wherein the electrode is formed out of a glass-incorporated silver-palladium alloy where glass is mixed in an amount of 30 to 50 parts by weight per 100 parts by weight of a silver-palladium alloy and the contact point is formed out of a conductive material having a Vickers hardness (Hv) of 190 to 250.Type: ApplicationFiled: January 16, 2007Publication date: July 19, 2007Applicant: YAZAKI CORPORATIONInventors: Syunsuke Nagakura, Hisafumi Maruo, Takahiro Miyakawa
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Patent number: 6994562Abstract: In an apparatus for multiplex communication, a bus line constitutes a bus type network for connecting a plurality of terminal communication equipments. A plug-shaped terminating resistance device is detachably provided at an end of the bus line to reduce reflection noise.Type: GrantFiled: October 25, 2002Date of Patent: February 7, 2006Assignee: Yazaki CorporationInventors: Norihito Suzuki, Hisafumi Maruo, Masashi Nagao, Masayuki Saito, Masayuki Sato, Takanori Watanabe
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Patent number: 6787700Abstract: A chip part (6) is mounted on bus bars (2, 3), and connection portions (6t) of the chip part (6) are soldered to the bus bars (2, 3), respectively. At this time, recesses (10, 11) are beforehand formed respectively in soldering lands of the two spaced-apart bus bars each corresponding to a predetermined solder wetting area. The chip part is soldered to the bus bars in such a manner that the connecting portions are spaced apart from inner edges of these recesses, respectively, thereby forming a solder fillet between at least part of each of the recesses and the corresponding connecting portion of the chip part.Type: GrantFiled: October 16, 2002Date of Patent: September 7, 2004Assignee: Yazaki CorporationInventors: Masashi Nagao, Hisafumi Maruo, Norihito Suzuki
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Patent number: 6751848Abstract: A method of adjusting a resistance value of a film resistor. The method includes defining, as a single resistive element, a portion of a resistive film formed over a first linear conductive film formed at a position at which a first resistance value is detected when an electric contact is slid thereto, and a second linear conductive film formed at a position at which a second resistance value is detected when the electric contact is slid thereto. The method also includes trimming a portion of the resistive element at opposite sides of the first linear conductive film in a longitudinal direction substantially perpendicular to the width direction to form first and second trimmed portions; and trimming a portion of the resistive element from an end of the second trimmed portion in the width direction toward the second linear conductive film to form a third trimmed portion.Type: GrantFiled: June 27, 2002Date of Patent: June 22, 2004Assignee: Yazaki CorporationInventors: Syunsuke Nagakura, Manabu Ooishi, Hisafumi Maruo
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Publication number: 20030095049Abstract: In an apparatus for multiplex communication, a bus line constitutes a bus type network for connecting a plurality of terminal communication equipments. A plug-shaped terminating resistance device is detachably provided at an end of the bus line to reduce reflection noise.Type: ApplicationFiled: October 25, 2002Publication date: May 22, 2003Applicant: YAZAKI CORPORATIONInventors: Norihito Suzuki, Hisafumi Maruo, Masashi Nagao, Masayuki Saito, Masayuki Sato, Takanori Watanabe
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Publication number: 20030073349Abstract: A chip part (6) is mounted on bus bars (2, 3), and connection portions (6t) of the chip part (6) are soldered to the bus bars (2, 3), respectively. At this time, recesses (10, 11) are beforehand formed respectively in soldering lands of the two spaced-apart bus bars each corresponding to a predetermined solder wetting area. The chip part is soldered to the bus bars in such a manner that the connecting portions are spaced apart from inner edges of these recesses, respectively, thereby forming a solder fillet between at least part of each of the recesses and the corresponding connecting portion of the chip part.Type: ApplicationFiled: October 16, 2002Publication date: April 17, 2003Applicant: YAZAKI CORPORATIONInventors: Masashi Nagao, Hisafumi Maruo, Norihito Suzuki
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Publication number: 20030037612Abstract: In an apparatus for detecting a liquid level, a sliding arm is supported on the resistance plate so as to pivot thereon in accordance with the liquid level. A plurality of first conductive segments is arranged on the resistance plate in a pivoting direction of the sliding arm. Adjacent ones of the first conductive segments are connected by resistive elements respectively. A plurality of second conductive segments are electrically connected to each other, and arranged on the resistance plate in the pivoting direction. A first contact part is provided on the sliding arm, and slides on the first conductive segments in accordance with a pivoting movement of the sliding arm. A second contact part is provided on the sliding arm, and slides on the second conductive segments in accordance with the pivoting movement of the sliding arm.Type: ApplicationFiled: August 27, 2002Publication date: February 27, 2003Applicant: YAZAKI CORPORATIONInventors: Shunsuke Nagakura, Hisafumi Maruo, Manabu Ooishi
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Publication number: 20030000071Abstract: A resistance value adjusting method for adjusting a resistance value of a film resistor which has a plurality of linear conductive films (1) formed in parallel on a substrate, and a resistive film (2) formed over portions of the plurality of linear conductive films in a width direction of the linear conductive films, wherein an electric contact is slid over the plurality of linear conductive films 1 to change a detected resistance value.Type: ApplicationFiled: June 27, 2002Publication date: January 2, 2003Applicant: YAZAKI CORPORATIONInventors: Syunsuke Nagakura, Manabu Ooishi, Hisafumi Maruo
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Patent number: 6493228Abstract: A heat radiation packaging structure without getting a board itself larger, but with an excellent heat radiation ability and a low cost is provided. A bus bar 12 is fixed onto a wiring board 11, a connecting lead 15A of a relay 15 etc. being joined onto the bus bar 12, and the wiring board 11, the bus bar 12 and the relay 15 etc. are sealed all together with a heat conduction resin 23. Additionally, the bus bar 12 comprises a thermal diffusion portion 17 which is bent via a bent portion 12B and is apart from the wiring board 11. By means of such a structure, a heat radiation ability is enhanced and the heat radiation packaging structure for an electric part is realized at low cost without getting a board itself larger.Type: GrantFiled: November 6, 2000Date of Patent: December 10, 2002Assignee: Yazaki CorporationInventors: Masataka Suzuki, Hirotoshi Oda, Hisafumi Maruo, Hiroyuki Ashiya, Yasutaka Nagaoka, Yayoi Maki
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Patent number: 6445277Abstract: A safety device of an electric circuit is provided, in which a thermal fuse securely prevents an accident from occurring when an overcurrent protector is extraordinarily overheated. The safety device includes: first protective means in an overcurrent protector for protecting the electric circuit from an overcurrent, which generates heat to increase its electrical resistance when an overcurrent flows in the electric circuit, whereby reducing or cutting off the overcurrent; and second protective means including a thermal fuse situated in the vicinity of the overcurrent protector containing: a first electrode having a first conductor pattern connected to the overcurrent protector; a second electrode having a second conductor pattern insulated from the first electrode by a gap; and solder connecting the first and second electrodes and melting by heat from the overcurrent protector so as to split into two parts toward the first and second electrodes.Type: GrantFiled: June 21, 2000Date of Patent: September 3, 2002Assignee: Yazaki CorporationInventors: Satoshi Ishikawa, Osamu Soda, Hisafumi Maruo