Patents by Inventor Hisanobu Takahama

Hisanobu Takahama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin sealing apparatus for use in manufacturing a resin-sealed semiconductor device
    Patent number: 5052907
    Abstract: A resin sealing apparatus that has separable molds having a pot in which resin is injected. The pot communicates with cavities, in which semiconductor chips are set, by runners. The runners lead the resin injected in the pot to the cavities. A recess is provided at the distal end of each runner to hold the resin and air pressed out from the runner.
    Type: Grant
    Filed: July 3, 1990
    Date of Patent: October 1, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshihiko Matumoto, Hisanobu Takahama