Abstract: The wide usable interconnecting component of the present invention is capable of reducing number of components or electric elements and reducing number of interconnecting sections without limiting circuit design. The interconnecting component electrically interconnects electric components, and the interconnecting component acts as an electric element. Namely, the interconnecting component acts as a passive element or an active element.

Abstract: The wide usable interconnecting component of the present invention is capable of reducing number of components or electric elements and reducing number of interconnecting sections without limiting circuit design. The interconnecting component electrically interconnects electric components, and the interconnecting component acts as an electric element. Namely, the interconnecting component acts as a passive element or an active element.

Abstract: The circuit board of the present invention makes the length of the conductor patterns shorter and improves the electric performance for the high speed signal processing. The circuit board of the present invention, which comprises a substrate, is characterized in that the substrate includes: a first face on which conductor patterns, which will be connected to a semiconductor chip, are formed; a second face on which a plurality of pads, on which terminals are formed, are matrically formed; and plated through holes whose one end are respectively opened in the conductor patterns and whose the other ends are respectively opened in the pads, wherein inner faces of the plated through holes are coated with plating layers so as to respectively electrically connect the conductor patterns with the pad.