Patents by Inventor Hisanori Matsuo

Hisanori Matsuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6336850
    Abstract: A polisher includes a turntable with a polishing surface provided on the top surface of the turntable, an article carrier for holding an article to be polished in such a manner that the article is brought into contact with the polishing surface to polish the article, and a slurry dispenser for receiving and dispensing slurry to the polishing surface. The dispenser includes a slurry dispensing member for dispensing slurry to the polishing surface. The slurry dispensing member includes a contact surface facing and substantially contacting the polishing surface, and a slurry dispensing opening including at least one hole provided in the contact surface to dispense the slurry to the polishing surface therethrough. The opening is sized in such a manner that the opening covers substantially an area of the polishing surface which is to be brought into engagement with the article by relative movement between the article and the polishing surface.
    Type: Grant
    Filed: October 15, 1998
    Date of Patent: January 8, 2002
    Assignee: Ebara Corporation
    Inventors: Yutaka Wada, Hirokuni Hiyama, Kazuto Hirokawa, Hisanori Matsuo
  • Publication number: 20010029161
    Abstract: A polishing tool can produce a flat and mirror polish surface in an object by pressing and sliding against the surface of the object. The polishing tool has a base section, and a plurality of segments of grinding plate pieces fixed on the base section. The grinding plate pieces are separated by given distance. The grinding plate pieces are preferably bounded to a bounding surface of a base section using an adhesive agent.
    Type: Application
    Filed: June 5, 2001
    Publication date: October 11, 2001
    Inventors: Kazuto Hirokawa, Hirokuni Hiyama, Yutaka Wada, Hisanori Matsuo
  • Publication number: 20010009843
    Abstract: A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.
    Type: Application
    Filed: March 21, 2001
    Publication date: July 26, 2001
    Inventors: Kazuto Hirokawa, Hirokuni Hiyama, Yutaka Wada, Hisanori Matsuo
  • Patent number: 6261162
    Abstract: A grinding plate has abrasive particles dispersed uniformly. The grinding plate is made by applying ultrasonic vibration when dispersing the abrasive particles in an organic solvent containing a binder material. The grinding plate is fixed on a base section in a wetted state. The grinding plate is divided into a plurality of segments and is fixed to a flat surface of the base section, and the segments are separated by a given distance.
    Type: Grant
    Filed: March 25, 1999
    Date of Patent: July 17, 2001
    Assignee: Ebara Corporation
    Inventors: Kazuto Hirokawa, Hirokuni Hiyama, Yutaka Wada, Hisanori Matsuo
  • Publication number: 20010002359
    Abstract: A polishing apparatus polishes a workpiece to a planar mirror finish stably, which is prevented from being vibrated while polishing is carried out.
    Type: Application
    Filed: January 12, 2001
    Publication date: May 31, 2001
    Inventors: Hisanori Matsuo, Hirokuni Hiyama, Yutaka Wada, Kazuto Hirokawa
  • Patent number: 6220945
    Abstract: A polishing apparatus comprises a polishing member that has a wide stable polishing range to perform effective polishing, even if a rotation axis moves away from the edge of a workpiece. A polishing member holder holds the polishing member, and a workpiece holder holds the workpiece to be polished. A drive device produces a relative sliding motion between the polishing member and the workpiece. At least one holder of either the polishing member holder or the workpiece holder is rotatable about a rotation axis and is tiltable with respect to other holder. Such one holder is provided with a pressing mechanism to stabilize orientation or desired posture of the one holder by applying an adjusting pressure to the one holder at a location away from the rotation axis.
    Type: Grant
    Filed: April 22, 1999
    Date of Patent: April 24, 2001
    Assignee: Ebara Corporation
    Inventors: Kazuto Hirokawa, Hirokuni Hiyama, Yutaka Wada, Hisanori Matsuo
  • Patent number: 6217411
    Abstract: A polishing apparatus includes a rotatable polishing pad having a polishing surface, a carrier for carrying an article to be polished and a support for stationarily supporting the carrier in such a manner that the article carried by the carrier is engaged with the polishing surface. A universal joint is provided between the carrier and the support. A sensor device senses a friction force generated between the article and the polishing surface as the polishing pad is rotated and imposed on the carrier. A pressing device has a plurality of pushers arranged around the joint to apply pressures to the carrier towards the polishing pad.
    Type: Grant
    Filed: March 26, 1999
    Date of Patent: April 17, 2001
    Assignee: Ebara Corporation
    Inventors: Hirokuni Hiyama, Yutaka Wada, Kazuto Hirokawa, Hisanori Matsuo
  • Patent number: 6196904
    Abstract: A polishing apparatus polishes a workpiece to a planar mirror finish stably, and is prevented from being vibrated while polishing is carried out. The polishing apparatus has a rotatable holding member for holding the workpiece, and a bearing supporting an outer circumferential surface of the holding member, for suppressing vibrations transmitted to the holder while the workpiece is being polished.
    Type: Grant
    Filed: March 25, 1999
    Date of Patent: March 6, 2001
    Assignee: Ebara Corporation
    Inventors: Hisanori Matsuo, Hirokuni Hiyama, Yutaka Wada, Kazuto Hirokawa
  • Patent number: 6190243
    Abstract: A polishing apparatus comprises a table having a smooth surface, a polishing pad provided on the smooth surface and a carrier for carrying an article to be polished The carrier brings the article into engagement with the pad under a pressure. The carrier and the table with the polishing pad are repeatedly moved relative to each other in a predetermined direction to thereby polish the article. A pressing device is positioned at a position spaced from the carrier is and adapted to be engaged with the polishing surface of the polishing pad. The pressing device includes a plurality of pressing elements which are arranged across an area of the polishing surface which area is to be brought into engagement with the article carried by the carrier and are adapted to individually press successive corresponding portions in the area to arrange the configuration of the surface of the area under corresponding various pressures.
    Type: Grant
    Filed: May 7, 1999
    Date of Patent: February 20, 2001
    Assignee: Ebara Corporation
    Inventors: Yutaka Wada, Hirokuni Hiyama, Kazuto Hirokawa, Hisanori Matsuo