Abstract: The light generating module comprises a housing, a semiconductor light emitting device, a first mounting face, a second mounting face, and a lens. The housing comprises a base and an optical window. The base extends along a predetermined plane and is made from material exhibiting a first thermal conductivity. The semiconductor light emitting device is provided in the housing. The first mounting face is made from material exhibiting a thermal conductivity equal to or more than the first thermal conductivity. The second mounting face mounts the semiconductor light emitting device and is made from material exhibiting a thermal conductivity equal to or more than the first thermal conductivity. The lens is provided in the housing. The lens has an installation face mounted on the first mounting face. The lens is used to direct light from the semiconductor light emitting device toward the optical window.

Abstract: An optical transceiver 1 comprises a receiver optical sub-module 4, a transmitter optical sub-module 2, and a housing 6 to accommodate these modules. The receiver optical sub-module 4 has a light receiving element, and a receiver electronic circuit substrate 47. The transmitter optical sub-module 2 has a light emitting element, and a transmitter electronic circuit substrate 27. The housing 6 has a receptacle part 61 with which an optical connector is engaged. The receiver electronic circuit substrate 47 and the transmitter electronic circuit substrate 27 are disposed opposite to each other.

Abstract: An optical module comprises (1) an optical device assembly having an optical device for converting one of optical and electric signals into the other; (2) a circuit board for mounting an electronic device to electrically connect with the optical device; (3) a lead frame having a lead pin, a board mounting part for mounting the circuit board, and a support part which are provided on a reference surface; (4) a holding member having a holding part for grasping and holding the optical device assembly, and a grasping part for grasping the support part of the lead frame; and (5) a resin member for encapsulating the optical device assembly, the circuit board, the holding member, and the lead frame.

Abstract: Provided are a lead frame, an optical module, and a method of making the optical module. These can reduce the force applied to a ferrule from an encapsulating die even if the alignment accuracy required in the step of bonding an optical module principal portion mounted with the ferrule onto the lead frame is relaxed. The lead frame has an island portion for mounting the optical module principal portion such that the ferrule is aligned with a predetermined direction; and an island support portion, included within the plane including the lead frame, allowing the island to be displaced in a direction intersecting the predetermined direction.

Abstract: Provided are a lead frame, an optical module, and a method of making the optical module. These can reduce the force applied to a ferrule from an encapsulating die even if the alignment accuracy required in the step of bonding an optical module principal portion mounted with the ferrule onto the lead frame is relaxed. The lead frame has an island portion for mounting the optical module principal portion such that the ferrule is aligned with a predetermined direction; and an island support portion, included within the plane including the lead frame, allowing the island to be displaced in a direction intersecting the predetermined direction.

Abstract: In the method of making an optical module in accordance with the present invention, an optical module principal portion is molded by means of a molding die. The molding die has a ferrule accommodating portion f or accommodating a ferrule and a positioning portion which are located on its lead frame-mounting surface. The method of making an optical module comprises the steps of: preparing a lead frame having an alignment portion enabling the positioning with respect to the mold die; preparing the optical module principal portion; aligning the optical module principal portion with the lead frame and securing them to each other by means of a positioning jig so that the ferrule secured to the optical module principal portion meets the ferrule accommodating portion of the molding die; placing the lead frame with the optical module principal portion secured thereto on the molding die; and resin-molding the lead frame and the optical module principal portion by means of the molding die.

Abstract: An optical transceiver 1 comprises a receiver optical sub-module 4, a transmitter optical sub-module 2, and a housing 6 to accommodate these modules. The receiver optical sub-module 4 has a light receiving element, and a receiver electronic circuit substrate 47. The transmitter optical sub-module 2 has a light emitting element, and a transmitter electronic circuit substrate 27. The housing 6 has a receptacle part 61 with which an optical connector is engaged. The receiver electronic circuit substrate 47 and the transmitter electronic circuit substrate 27 are disposed opposite to each other.

Abstract: The optical module product comprises an optical module and a sealing cap. The optical module comprises a ferrule, an optical fiber, an optical device, and an optical module assembly. The ferrule covers the side face of the optical fiber and has first and second end portions. The optical device is optically coupled with the optical fiber. The package has a surface from which one end portion of the ferrule projects, and encapsulates the optical device. The sealing cap comprises a sealing portion provided with a ferrule insertion hole having a contacting portion on the inner wall face thereof. The contacting portion comes into close contact with the side face of the ferrule to seal the projected end portion of the ferrule. In the state where the contacting portion seals the part of the ferrule including the second end portion, the sealing cap accommodates the ferrule projected from the package in the ferrule insertion hole.

Abstract: An optical module which can reduce its size, and a method of making the same are provided. The optical module has a substrate, a carbon-coated optical fiber, a ferrule, and an optical device. The substrate has first, second, and third regions along an axis, and also has a ferrule support groove in the first region, an optical fiber support groove in the second region, and a device mount portion in the third region. The carbon-coated optical fiber is mounted in the optical fiber support groove. The ferrule covers the side face of the optical fiber and is secured to the ferrule support groove. The optical device is mounted at the device mount portion and is optically coupled to the carbon-coated optical fiber.

Abstract: An optical composite module includes a housing having two opposing side surfaces, a light separating unit disposed in the housing and adapted to separate pumping light and signal light, optical fibers respectively mounted on the opposing side surfaces of the housing to cause the signal light to pass through the light separating unit on a substantially straight line, and a pumping light source unit disposed in the housing and adapted to cause the pumping light to be incident on the light separating unit. This optical composite module can reduce a loss of light and improve the utilization efficiency of pumping light.

Abstract: The optical module manufacturing apparatus according to the present invention includes a pallet 205 on which the optically operating members and the lead frame are set to be kept in a positional relationship; a wire connection means 202 and 213 for connecting the wires to the members, the frame and the electronic circuits on the frame as the members and the frame remain kept in the positional relationship; conveyors 207, 208 and 209 for conveying the members and the frame to dies 204 after the connection as the members and the frame remain kept in the relationship; and a die-setting means 203 for setting the members and the frame in the dies through the suction of the members and the frame away from the pallet onto the setting means after the conveyance as the members and the frame remain kept in the relationship.

Abstract: The optical demultiplexing module of the present invention includes a square or rectangular housing body, a first collimator and a second collimator being provided normal to opposing sides of the housing body, respectively, a third collimator being provided normal to a side of the housing body at right angles to the opposing sides, a multiplexer, an optical isolator and a beam splitter being provided at the output end of the optical isolator, the multiplexer, the optical isolator and the beam splitter being provided in linear alignment, and a reflector mirror being provided on the optical axis of the pumping light to be admitted into the housing body from the third collimator. The second collimator is provided on the optical axis of the light passing through the beam splitter. The multiplexer is provided on the optical axis of the light to be reflected from the reflector mirror. The first collimator is provided on the optical axis of the light to be reflected from the multiplexer.

Abstract: An optical sub-module comprises at least one optical connector; at least one optical operation element fixed to the optical connector; electronic circuit parts constituting an electronic circuit portion connected to the optical operation element; a substrate for supporting said electronic circuit parts; lead pins composed of inner leads and outer leads, inner leads being connected to electronic circuit portion; and a molding resin member holding the optical connector, the optical operation element, the electronic circuit parts, the substrate, and the lead pins in a body except for the outer leads of the lead pins and an end of the optical connector.

Abstract: A sub-assembly containing an optical element and having a holder portion into which a ferrule that is attached to the end portion of an optical fiber can be inserted with sufficient gap, an electronic circuit electrically connected to the optical element, and a lead frame are molded with a transfer mold resin to produce a molded sub-assembly. The ferrule is inserted into the holder portion of the molded subassembly, and the optical coupling efficiency between the optical fiber and the optical element is adjusted while moving the ferrule in the ferrule insertion direction, a direction perpendicular thereto or by rotating the ferrule.

Abstract: The optical module manufacturing apparatus according to the present invention includes a pallet 205 on which the optically operating members and the lead frame are set to be kept in a positional relationship; a wire connection means 202 and 213 for connecting the wires to the members, the frame and the electronic circuits on the frame as the members and the frame remain kept in the positional relationship; conveyors 207, 208 and 209 for conveying the members and the frame to dies 204 after the connection as the members and the frame remain kept in the relationship; and a die-setting means 203 for setting the members and the frame in tile dies through the suction of the members and the frame away from the pallet onto the setting means after the conveyance as the members and the frame remain kept in the relationship.

Abstract: A lead frame, used for constructing a multi-core optical module or the like, includes a frame portion, a plurality of substrate portions on which electronic circuit elements are to be mounted, and a support portion for securing the plurality of substrate portions to the frame portion. The support portion has a plurality of separated end portions connected to the respective substrate portions at the position where a molded resin member is covered, and at least two of the plurality of end portions are combined into one body to be connected to the frame portion at the point where the molded resin member is not covered.

Abstract: A method of manufacture of an optical module using a mold die including cavity portions for holding an optical connector, electronic circuit parts, and lead pins which constitute component parts of the optical module, so as to form a package. The mold die has alignment portions in which rectangular channels for aligning the optical connector are formed. Partition plates are disposed vertically between the cavity portions and the alignment portions and adapted to prevent a resin from flowing out from the cavity portions during the resin molding. An optical connector, circuit parts, and lead pins are held in the die. Resin is injected into the cavity portion to form the optical module.

Abstract: An optical module comprises an optical connector, to one end of which one end of an optical fiber is connected; an optically operating element secured to the optical connector, the optically operating element being optically coupled to the optical fiber; electronic circuit elements forming an electronic circuit connected to the optically operating element; a substrate bearing the electronic circuit elements; lead pins consisting of inner and outer leads, the inner leads being connected to the electronic circuit; and a molded resin member holding as one unit the optical connector, the optically operating element, the electronic circuit elements, the substrate and the lead pins except the one end of the optical connector and the outer leads of the lead pins.