Patents by Inventor Hisao Igarashi

Hisao Igarashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8042257
    Abstract: There is provided a method for manufacturing a stator core for an axial air-gap electronic motor, in which core sheets are laminatedly fixed while being shifted with predetermined intervals. The method includes a step in which first side surfaces in the circumferential direction (first slot surfaces 25) of the first to nth (n is a positive integer) core sheets are blanked out of a mother sheet 60 by moving first blanking punches 360 with predetermined intervals via a first control means 700; and a second blanking step in which second side surfaces in the circumferential direction (second slot surfaces 26) of the first to nth (n is a positive integer) core sheets are blanked in succession by moving a second blanking punch 460 with predetermined intervals via a second control means 700.
    Type: Grant
    Filed: March 13, 2007
    Date of Patent: October 25, 2011
    Assignee: Fujitsu General Limited
    Inventors: Tomonori Kojima, Hisao Igarashi, Hitoshi Kurita, Norio Tosu
  • Patent number: 7737707
    Abstract: A sheet-like probe and a method of producing the probe. In the probe electrode structure bodies do not come out from an insulation film and achieve high durability, and in a burn-in test for a wafer having a large area and for a circuit device having to-be-inspected electrodes with small intervals, positional displacement, caused by temperature variation, between the electrode structure bodies and the to-be-inspected electrode can be reliably prevented for stable connection conditions. The sheet-like probe includes an insulation layer and a contact film provided with electrode structure bodies arranged on the insulation layer to be apart from each other in the surface direction of the insulation layer and penetratingly extend in the thickness direction of the insulation layer. The electrode structure bodies each are composed of a surface electrode section exposed to the front surface of the insulation layer.
    Type: Grant
    Filed: April 26, 2005
    Date of Patent: June 15, 2010
    Assignee: JSR Corporation
    Inventors: Katsumi Sato, Kazuo Inoue, Hitoshi Fujiyama, Mutsuhiko Yoshioka, Hisao Igarashi
  • Patent number: 7671609
    Abstract: A sheet-like probe has a porous film. In the sheet-like probe, a contact film is penetratingly supported at each position of through-holes formed in the porous film, and a peripheral edge of the contact film and the porous film are integrated such that a flexible resin insulation layer is included in a fine hole of the porous film. Electrode structure bodies are supported in a penetrating manner in the insulation layer.
    Type: Grant
    Filed: April 26, 2005
    Date of Patent: March 2, 2010
    Assignee: JSR Corporation
    Inventors: Katsumi Sato, Kazuo Inoue, Hitoshi Fujiyama, Mutsuhiko Yoshioka, Hisao Igarashi
  • Patent number: 7656176
    Abstract: A probe member for wafer inspection having a sheet-like probe, the probe including a frame plate in which openings are formed, and contact films arranged on a front surface of the frame plate so as to close the openings, each of the contact films obtained by arranging, in an insulating film formed of a flexible resin, a plurality of electrode structures, and an anisotropically conductive connector, which is composed of a frame plate, in which a plurality of openings have been formed corresponding to the electrode regions, and a plurality of elastic anisotropically conductive films arranged on and supported by the frame plate so as to close the respective openings, wherein each of the openings of the frame plate in the sheet-like probe have a size for receiving the external shape in a plane direction in the elastic anisotropically conductive film of the anisotropically conductive connector.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: February 2, 2010
    Assignee: JSR Corporation
    Inventors: Mutsuhiko Yoshioka, Hitoshi Fujiyama, Hisao Igarashi
  • Publication number: 20090140756
    Abstract: Disclosed herein are a probe member for wafer inspection, a probe card for wafer inspection and a wafer inspection apparatus, by which a good electrically connected state can be surely achieved, positional deviation by temperature change can be prevented, and the good electrically connected state can be stably retained even when a wafer has a diameter of 8 inches or greater, and the pitch of electrodes to be inspected is extremely small.
    Type: Application
    Filed: October 27, 2005
    Publication date: June 4, 2009
    Applicant: JSR Corporation
    Inventors: Mutsuhiko Yoshioka, Hitoshi Fujiyama, Hisao Igarashi
  • Patent number: 7446544
    Abstract: A probe device including a circuit board for inspection having a great number of inspection electrodes, a probe card having a circuit board for connection having a great number of terminal electrodes and a contact member, an anisotropically conductive connector arranged between the circuit board for inspection and the circuit board for connection and electrically connecting the respective inspection electrodes to the respective terminal electrodes, and a parallelism adjusting mechanism for adjusting a parallelism of the circuit board for inspection and the circuit board for connection to the wafer. The parallelism adjusting mechanism includes a location-varying mechanism, which relatively displaces the circuit board for inspection or the circuit board for connection in the thickness-wise direction of the anisotropically conductive connector. A wafer inspection apparatus can include the probe device.
    Type: Grant
    Filed: March 30, 2005
    Date of Patent: November 4, 2008
    Assignee: JSR Corporation
    Inventors: Hisao Igarashi, Katsumi Sato, Kazuo Inoue
  • Patent number: 7384279
    Abstract: An anisotropically conductive connector suitable for use in a wafer inspection apparatus, and a wafer inspection apparatus comprising the anisotropically conductive connector, which anisotropically conductive connector comprises an elastic anisotropically conductive film composed of a plurality of conductive parts for connection and an insulating part formed among these conductive parts for connection, and a frame plate for supporting this film, which plate is formed of a metallic material having a coefficient of linear thermal expansion of 3×10?6 to 2×10?5K?1, the conductive parts for connection are obtained by filling conductive particles having a number average particle diameter of 20 to 80 ?m and exhibiting magnetism in an elastic polymeric substance at a high density, the conductive particles have, on a surface of which, a coating layer composed of a noble metal and having a thickness of at least 20 nm, each of the conductive parts for connection has a durometer hardness of 10 to 35, and an electric resi
    Type: Grant
    Filed: June 1, 2004
    Date of Patent: June 10, 2008
    Assignee: JSR Corporation
    Inventors: Hisao Igarashi, Katsumi Sato, Kazuo Inoue
  • Patent number: 7311531
    Abstract: An anisotropically conductive connector, and applications thereof, by which good conductivity is retained over a long period of time even when it is used in electrical inspection of a plurality of integrated circuits formed on a wafer repeatedly over a great number of times, and thus high durability and long service life are achieved. The anisotropically conductive connector includes elastic anisotropically conductive films, in each of which a plurality of conductive parts for connection containing conductive particles and extending in a thickness-wise direction of the film are formed. The conductive particles contained in the conductive parts for connection in the anisotropically conductive connector are obtained by laminating surfaces of core particles exhibiting magnetism with a coating layer formed of a high-conductive metal, and the coating layer is a coating layer having a high hardness.
    Type: Grant
    Filed: March 23, 2004
    Date of Patent: December 25, 2007
    Assignee: JSR Corporation
    Inventors: Hisao Igarashi, Katsumi Sato, Kazuo Inoue
  • Publication number: 20070268032
    Abstract: Provided are a probe member, a probe card and a wafer inspection apparatus, by which a good electrically connected state can be surely achieved, positional deviation by temperature change can be prevented, and the good electrically connected state can be stably retained even when a wafer has a diameter of 8 inches or greater, and the pitch of electrodes to be inspected is extremely small.
    Type: Application
    Filed: November 10, 2005
    Publication date: November 22, 2007
    Applicant: JSR CORPORATION
    Inventors: Mutsuhiko Yoshioka, Hitoshi Fujiyama, Hisao Igarashi
  • Publication number: 20070214632
    Abstract: There is provided a method for manufacturing a stator core for an axial air-gap electronic motor, in which core sheets are laminatedly fixed while being shifted with predetermined intervals. The method includes a step in which first side surfaces in the circumferential direction (first slot surfaces 25) of the first to nth (n is a positive integer) core sheets are blanked out of a mother sheet 60 by moving first blanking punches 360 with predetermined intervals via a first control means 700; and a second blanking step in which second side surfaces in the circumferential direction (second slot surfaces 26) of the first to nth (n is a positive integer) core sheets are blanked in succession by moving a second blanking punch 460 with predetermined intervals via a second control means 700.
    Type: Application
    Filed: March 13, 2007
    Publication date: September 20, 2007
    Applicant: FUJITSU GENERAL LIMITED
    Inventors: Tomonori Kojima, Hisao Igarashi, Hitoshi Kurita, Norio Tosu
  • Publication number: 20070205783
    Abstract: A sheet-like probe and a method of producing the probe. In the probe electrode structure bodies do not come out from an insulation film and achieve high durability, and in a burn-in test for a wafer having a large area and for a circuit device having to-be-inspected electrodes with small intervals, positional displacement, caused by temperature variation, between the electrode structure bodies and the to-be-inspected electrode can be reliably prevented for stable connection conditions. The sheet-like probe includes an insulation layer and a contact film provided with electrode structure bodies arranged on the insulation layer to be apart from each other in the surface direction of the insulation layer and penetratingly extend in the thickness direction of the insulation layer. The electrode structure bodies each are composed of a surface electrode section exposed to the front surface of the insulation layer.
    Type: Application
    Filed: April 26, 2005
    Publication date: September 6, 2007
    Applicant: JSR CORPORATION
    Inventors: Katsumi Sato, Kazuo Inoue, Hitoshi Fujiyama, Mutsuhiko Yoshioka, Hisao Igarashi
  • Publication number: 20070178727
    Abstract: A probe device including a circuit board for inspection having a great number of inspection electrodes, a probe card having a circuit board for connection having a great number of terminal electrodes and a contact member, an anisotropically conductive connector arranged between the circuit board for inspection and the circuit board for connection and electrically connecting the respective inspection electrodes to the respective terminal electrodes, and a parallelism adjusting mechanism for adjusting a parallelism of the circuit board for inspection and the circuit board for connection to the wafer. The parallelism adjusting mechanism includes a location-varying mechanism, which relatively displaces the circuit board for inspection or the circuit board for connection in the thickness-wise direction of the anisotropically conductive connector. A wafer inspection apparatus can include the probe device.
    Type: Application
    Filed: March 30, 2005
    Publication date: August 2, 2007
    Applicant: JSR CORPORATION
    Inventors: Hisao Igarashi, Katsumi Sato, Kazuo Inoue
  • Patent number: 7221073
    Abstract: An axial gap electronic motor includes a stator and a rotor disposed opposingly with a predetermined gap. In order to provide an easy assembling operation of the stator, the stator includes a plurality of pole members annularly connectable. The annular stator core is obtained by connecting each of the pole members to which coil winding is previously applied.
    Type: Grant
    Filed: February 23, 2004
    Date of Patent: May 22, 2007
    Assignee: Fujitsu General Limited
    Inventors: Shinichi Yamada, Hisao Igarashi, Tomonori Kojima, Takayuki Shinohara, Hidetaka Terakubo, Tomohiro Kashiwagi, Takushi Fujioka, Yoichi Tanabe, Masaki Yamada
  • Patent number: 7135800
    Abstract: An axial gap electronic motor includes a stator having a plurality of poles, and a rotor. Each pole is formed of a stator iron core made of a magnet body and a coil wound therearound. The rotor has a plurality of poles formed of permanent magnet and arranged along a rotation axis direction of said rotor with a predetermined gap provided therebetween. The stator has a magnetic force generating section in which a plurality of the stator iron cores is arranged in a ring shape on a concentric circle with the rotation axis line of the rotor being a center axis. Each of teeth of the stator iron core is provided with a skew.
    Type: Grant
    Filed: December 14, 2004
    Date of Patent: November 14, 2006
    Assignee: Fujitsu General Limited
    Inventors: Masaki Yamada, Hisao Igarashi, Kenji Narita, Takushi Fujioka, Tomonori Kojima, Shinichiro Katagiri, Shinichi Yamada, Yoichi Tanabe, Hidetaka Terakubo, Takayuki Shinohara
  • Publication number: 20060211280
    Abstract: Disclosed herein are an anisotropically conductive connector, by which good conductivity is retained over a long period of time even when it is used in electrical inspection of a plurality of integrated circuits formed on a wafer repeatedly over a great number of times, and thus high durability and long service life are achieved, and applications thereof. The anisotropically conductive connector of the invention comprises elastic anisotropically conductive films, in each of which a plurality of conductive parts for connection containing conductive particles and extending in a thickness-wise direction of the film have been formed. The conductive particles contained in the conductive parts for connection in the anisotropically conductive connector are obtained by laminating surfaces of core particles exhibiting magnetism with a coating layer formed of a high-conductive metal, and the coating layer is a coating layer having a high hardness.
    Type: Application
    Filed: March 23, 2004
    Publication date: September 21, 2006
    Applicant: JSR Corporation
    Inventors: Hisao Igarashi, Katsumi Sato, Kazuo Inoue
  • Publication number: 20060154500
    Abstract: Disclosed herein are a wafer inspection apparatus, which is small in size, is prevented from shortening the service life of its circuit board for inspection, capable of collectively performing inspection as to a great number of electrodes to be inspected, has good electrical properties and capable of performing electrical inspection of high functional integrated circuits, and an anisotropically conductive connector suitable for use in this wafer inspection apparatus. The anisotropically conductive connector of the invention comprises an elastic anisotropically conductive film composed of a plurality of conductive parts for connection each extending in a thickness-wise direction of the film and arranged in a state separated from each other and an insulating part formed among these conductive parts for connection, and a frame plate for supporting this film.
    Type: Application
    Filed: June 1, 2004
    Publication date: July 13, 2006
    Applicant: JSR CORPORATION
    Inventors: Hisao Igarashi, Katsumi Sato, Kazuo Inoue
  • Publication number: 20050140244
    Abstract: There is provided an axial gap electronic motor capable of decreasing cogging torque and thus decreasing vibrations and noise. A stator of the motor has a magnetic force generating section 21 in which a plurality of stator iron cores 24 are arranged in a ring shape, and teeth 25 of each of the stator iron cores 24 are provided with a skew 26 inclined through a predetermined angle with respect to the radial direction of the rotors 31, 32.
    Type: Application
    Filed: December 14, 2004
    Publication date: June 30, 2005
    Applicant: FUJITSU GENERAL LIMITED
    Inventors: Masaki Yamada, Hisao Igarashi, Kenji Narita, Takushi Fujioka, Tomonori Kojima, Shinichiro Katagiri, Shinichi Yamada, Yoichi Tanabe, Hidetaka Terakubo, Takayuki Shinohara
  • Publication number: 20050140233
    Abstract: There is provided, at a low cost, an air blower apparatus capable of increasing the air blowing capability without an increase in size of an electronic motor, and having a high assembling ability. An electronic motor 3 is an axial gap electronic motor in which a rotor 32 and a stator 31 of the electronic motor are arranged opposedly with a predetermined gap along the rotation axis direction of the rotor, and coaxially supports an air blowing fan 2 on an attaching surface of the rotor 32 opposite to the stator.
    Type: Application
    Filed: December 3, 2004
    Publication date: June 30, 2005
    Applicant: FUJITSU GENERAL LIMITED
    Inventors: Tomonori Kojima, Hisao Igarashi, Takushi Fujioka, Yoichi Tanabe, Hidetaka Terakubo, Takayuki Shinohara, Tomohiro Kashiwagi, Masaki Yamada
  • Patent number: 6870385
    Abstract: Disclosed herein are a wafer inspection apparatus which is small in size, prevented from shortening the service life of its circuit board for inspection, can collectively perform inspection as to a great number of electrodes to be inspected, has good electrical properties and can perform electrical inspection of high functional integrated circuits, and an anisotropically conductive sheet suitable for use in this wafer inspection apparatus. The anisotropically conductive sheet is composed of an insulating sheet body, in which a through-hole has been formed, and an elastic anisotropically conductive film arranged in the through-hole. The insulating sheet body is formed of a material having a modulus of elasticity of 1×108 to 1×1010 Pa, a coefficient of linear thermal expansion of 3×10?6 to 3×10?5 K?1 and a saturation magnetization lower than 0.
    Type: Grant
    Filed: December 5, 2001
    Date of Patent: March 22, 2005
    Assignee: JSR Corporation
    Inventors: Kazuo Inoue, Hisao Igarashi
  • Patent number: 6849335
    Abstract: Disclosed herein is an anisotropically conductive sheet capable of holding charge in its surfaces under an unpressurised state, and moving the charge held in the surface in a thickness-wise direction thereof in a state pressurised in the thickness-wise direction, thereby controlling the quantity of the charge at the surface. This anisotropically conductive sheet comprises a sheet base composed of an elastomer and conductive particles exhibiting magnetism contained in the sheet base in a state oriented so as to arrange in rows in a thickness-wise direction of the sheet base, and dispersed in a plane direction thereof. Supposing that a volume resistivity in the thickness-wise direction under an unpressurised state is R0, and a volume resistivity in the thickness-wise direction in a state pressurised under a pressure of 1 g/mm2 in the thickness-wise direction is R1, the volume resistivity R1 is 1×107 to 1×1012 ?·m, and a ratio (R0/R1) of the volume resistivity R0 to the volume resistivity R1 is 1×101 to 1×104.
    Type: Grant
    Filed: August 8, 2001
    Date of Patent: February 1, 2005
    Assignee: JSR Corporation
    Inventors: Hisao Igarashi, Kazuo Inoue, Ryoji Setaka