Patents by Inventor Hisao Okuda
Hisao Okuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9272898Abstract: There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern, the contact electrode coming into contact with the conductive pattern, and a bridge electrode elastically deformable, the bridge electrode connecting the conductive pattern and a portion of the base member outside the outline.Type: GrantFiled: July 16, 2014Date of Patent: March 1, 2016Assignee: FUJITSU LIMITEDInventors: Tadashi Nakatani, Hisao Okuda, Takashi Katsuki
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Patent number: 9244269Abstract: A micro movable device includes: a micro movable substrate in which a micro movable unit is formed, the micro movable unit including a frame, a movable part, and a coupling part for coupling the frame and the movable part to define an axial center of rotation of the movable part; a supporting substrate; and a reinforced fixed part provided between the frame and the supporting substrate, and including a first spacer that joins the frame to the supporting substrate and an adhesive part that covers the first spacer and joins the frame to the supporting substrate, wherein the frame includes a first area facing the movable part in a direction of extent of the axial center, and a second area different from the first area, and the reinforced fixed part is bonded to the second area of the frame.Type: GrantFiled: October 5, 2009Date of Patent: January 26, 2016Assignee: DRNC Holdings, Inc.Inventors: Hiromitsu Soneda, Tsuyoshi Matsumoto, Yoshihiro Mizuno, Norinao Kouma, Hisao Okuda, Osamu Tsuboi
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Publication number: 20140367807Abstract: There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern, the contact electrode coming into contact with the conductive pattern, and a bridge electrode elastically deformable, the bridge electrode connecting the conductive pattern and a portion of the base member outside the outline.Type: ApplicationFiled: July 16, 2014Publication date: December 18, 2014Inventors: Tadashi Nakatani, Hisao Okuda, Takashi Katsuki
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Patent number: 8816452Abstract: There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern, the contact electrode coming into contact with the conductive pattern, and a bridge electrode elastically deformable, the bridge electrode connecting the conductive pattern and a portion of the base member outside the outline.Type: GrantFiled: September 13, 2012Date of Patent: August 26, 2014Assignee: Fujitsu LimitedInventors: Tadashi Nakatani, Hisao Okuda, Takashi Katsuki
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Patent number: 8518789Abstract: An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.Type: GrantFiled: March 21, 2011Date of Patent: August 27, 2013Assignees: Fujitsu Limited, Taiyo Yuden Co., Ltd.Inventors: Xiaoyu Mi, Yoshihiro Mizuno, Tsuyoshi Matsumoto, Hisao Okuda, Satoshi Ueda, Takeo Takahashi
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Patent number: 8471152Abstract: A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face.Type: GrantFiled: April 21, 2011Date of Patent: June 25, 2013Assignee: Fujitsu LimitedInventors: Yoshihiro Mizuno, Norinao Kouma, Hisao Okuda, Hiromitsu Soneda, Tsuyoshi Matsumoto, Osamu Tsuboi
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Publication number: 20130134529Abstract: There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern, the contact electrode coming into contact with the conductive pattern, and a bridge electrode elastically deformable, the bridge electrode connecting the conductive pattern and a portion of the base member outside the outline.Type: ApplicationFiled: September 13, 2012Publication date: May 30, 2013Applicant: FUJITSU LIMITEDInventors: Tadashi Nakatani, Hisao Okuda, Takashi Katsuki
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Patent number: 8202382Abstract: A method for manufacturing a micro movable element includes: forming a movable section, a frame, and a connecting section connecting the movable section with the frame on a substrate; bonding a film to a surface of the substrate in forming the movable section, the frame, and the connecting section; and patterning the film to form a support structure being bridged between the movable section and the frame.Type: GrantFiled: July 27, 2009Date of Patent: June 19, 2012Assignee: Fujitsu LimitedInventors: Norinao Kouma, Osamu Tsuboi, Yoshihiro Mizuno, Hiromitsu Soneda, Hisao Okuda, Tsuyoshi Matsumoto, Ippei Sawaki
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Patent number: 8093780Abstract: A micro-oscillation element facilitates adjusting the natural frequency relevant to the oscillating motion of the oscillating portion. The micro-oscillation element includes, for example, an oscillating portion, a frame, and a link portion that connects the oscillating portion and the frame. The link portion defines the oscillation axial center of oscillating motion of the oscillating portion with respect to the frame. The oscillating portion includes a main oscillating body, and a weight portion attached to the main oscillating body. The weight portion is movable in a direction intersecting the oscillation axial center.Type: GrantFiled: August 16, 2007Date of Patent: January 10, 2012Assignee: Fujitsu LimitedInventors: Osamu Tsuboi, Norinao Kouma, Hiromitsu Soneda, Hisao Okuda
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Patent number: 8093086Abstract: A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip.Type: GrantFiled: February 3, 2011Date of Patent: January 10, 2012Assignee: Fujitsu LimitedInventors: Yoshihiro Mizuno, Norinao Kouma, Hisao Okuda, Hiromitsu Soneda, Tsuyoshi Matsumoto, Osamu Tsuboi
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Patent number: 8018118Abstract: A micro-oscillation element includes a base frame, an oscillating portion, and a link portion connecting the base frame and the oscillating portion to each other. The oscillating portion has a movable functional portion, a first driving electrode connected to the movable functional portion, and a weight portion joined to the first driving electrode. The link portion defines an axis of the oscillating motion of the oscillating portion. The second driving electrode, fixed to the base frame, generates driving force for the oscillating motion in cooperation with the first driving electrode.Type: GrantFiled: June 24, 2008Date of Patent: September 13, 2011Assignee: Fujitsu LimitedInventors: Osamu Tsuboi, Norinao Kouma, Hiromitsu Soneda, Hisao Okuda, Yoshihiro Mizuno, Tsuyoshi Matsumoto, Ippei Sawaki
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Publication number: 20110192635Abstract: A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face.Type: ApplicationFiled: April 21, 2011Publication date: August 11, 2011Applicant: FUJITSU LIMITEDInventors: Yoshihiro Mizuno, Norinao Kouma, Hisao Okuda, Hiromitsu Soneda, Tsuyoshi Matsumoto, Osamu Tsuboi
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Publication number: 20110171806Abstract: An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.Type: ApplicationFiled: March 21, 2011Publication date: July 14, 2011Applicants: FUJITSU LIMITED, TAIYO YUDEN CO., LTD.Inventors: Xiaoyu Mi, Yoshihiro Mizuno, Tsuyoshi Matsumoto, Hisao Okuda, Satoshi Ueda, Takeo Takahashi
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Patent number: 7952033Abstract: A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face.Type: GrantFiled: February 28, 2008Date of Patent: May 31, 2011Assignee: Fujitsu LimitedInventors: Yoshihiro Mizuno, Norinao Kouma, Hisao Okuda, Hiromitsu Soneda, Tsuyoshi Matsumoto, Osamu Tsuboi
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Publication number: 20110124143Abstract: A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip.Type: ApplicationFiled: February 3, 2011Publication date: May 26, 2011Applicant: FUJITSU LIMITEDInventors: Yoshihiro Mizuno, Norinao Kouma, Hisao Okuda, Hiromitsu Soneda, Tsuyoshi Matsumoto, Osamu Tsuboi
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Patent number: 7948056Abstract: An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.Type: GrantFiled: August 25, 2006Date of Patent: May 24, 2011Assignees: Fujitsu Limited, Taiyo Yuden Co., Ltd.Inventors: Xiaoyu Mi, Yoshihiro Mizuno, Tsuyoshi Matsumoto, Hisao Okuda, Satoshi Ueda, Takeo Takahashi
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Patent number: 7906822Abstract: A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip.Type: GrantFiled: June 30, 2008Date of Patent: March 15, 2011Assignee: Fujitsu LimitedInventors: Yoshihiro Mizuno, Norinao Kouma, Hisao Okuda, Hiromitsu Soneda, Tsuyoshi Matsumoto, Osamu Tsuboi
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Patent number: 7903315Abstract: A micro oscillating device includes a first frame; an oscillating portion; a first twist coupling portion and a second twist coupling portion coupling the first frame and the oscillating portion to define a first shaft center of an oscillating operation of the oscillating portion; a second frame including a support base and an arm portion extended from the support base toward the oscillating portion; and a third twist coupling portion and a fourth twist coupling portion coupling the second frame and the first frame to define a second shaft center of an oscillating operation of the first frame, wherein the third twist coupling portion is coupled to the first frame and the arm portion between the oscillating portion and the support base, and the fourth twist coupling portion is coupled to the first frame and the support base or the arm portion between the oscillating portion and the support base.Type: GrantFiled: June 15, 2009Date of Patent: March 8, 2011Assignee: Fujitsu LimitedInventors: Osamu Tsuboi, Norinao Kouma, Yoshihiro Mizuno, Hiromitsu Soneda, Hisao Okuda, Tsuyoshi Matsumoto
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Patent number: 7903313Abstract: A micro movable element including a movable portion; first and second driving electrodes; first and second conductor portions electrically connected to the first and second driving electrodes, respectively; an intermediate insulating portion disposed between the first conductor portion and the second conductor portion; and a partly laminated structure portion including the first conductor portion, the intermediate insulating portion and the second conductor portion, wherein the first conductor portion has an opposed face making contact with the intermediate insulating portion, a side face adjacent to the opposed face and an edge portion forming the boundary between the opposed face and the side face, part of the edge portion opposed to the second conductor portion is covered with an insulating film, and parts of the first and second driving electrodes are not covered with an insulating film.Type: GrantFiled: March 4, 2009Date of Patent: March 8, 2011Assignee: Fujitsu LimitedInventors: Yoshihiro Mizuno, Norinao Kouma, Hisao Okuda, Hiromitsu Soneda, Tsuyoshi Matsumoto, Osamu Tsuboi
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Patent number: 7893596Abstract: A micro movable device suitable for suppressing deterioration of driving characteristics, and a micro movable device array including such a micro movable device are provided. The micro movable device (X1) of the present invention includes a movable portion including a first driving electrode, a second driving electrode for generating electrostatic attraction between the first driving electrode and the second driving electrode, a first conductor portion (22c) electrically connected to the first driving electrode, a second conductor portion (22b) electrically connected to the second driving electrode, and a third conductor portion (21a) which is not electrically connected to the first and the second driving electrodes and which is bonded to the first conductor portion (22c) via an insulating film (23) and bonded to the second conductor portion (22b) via the insulating film (23).Type: GrantFiled: April 15, 2010Date of Patent: February 22, 2011Assignee: Fujitsu LimitedInventors: Osamu Tsuboi, Norinao Kouma, Yoshihiro Mizuno, Hisao Okuda, Hiromitsu Soneda, Tsuyoshi Matsumoto