Patents by Inventor Hisao Sakuma

Hisao Sakuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ethylene-&agr;-olefin copolymer and composition, and film, laminate and electrical insulating material comprising same
    Patent number: 6423808
    Abstract: A laminate containing a polyolefin resin composition containing ethylene-&agr;-olefin copolymer having: (A) a density d of 0.86 to 0.96 g/cm3; (B) a melt flow rate MFR of 0.01 to 200 g/10 min; (C) a molecular weight distribution Mw/Mn of 1.5 to 4.5; (D) a composition distribution parameter Cb of 1.08 to 2.00; and (E) an orthodichlorobenzene-soluble content X (wt %), at 25° C. a density of d (g/cm3) and a melt flow rate MFR (g/10 min) satisfying that: (i) when the density (d) and the melt flow rate MFR satisfy relationship (I): d−0.008×log MFR≧0.93  (I)  the orthodichlorobenzene-soluble content X satisfies relationship (II): X<2.0  (II) (ii) when the density d and the melt flow rate MFR satisfy relationship (III): d−0.008×log MFR<0.93  (II)  the orthodichlorobenzene-soluble content X satisfies relationship (IV): X<9.8×103×(0.9300−d+0.008×log MFR)2+2.
    Type: Grant
    Filed: August 22, 2000
    Date of Patent: July 23, 2002
    Assignee: Japan Polyolefins Co., Ltd.
    Inventors: Hideo Watanabe, Masahiko Sato, Masaaki Ikeda, Takaaki Hattori, Yoshihiro Hatakeyama, Naoki Miwa, Tatsuyuki Kamiya, Hisao Sakuma, Yuka Umeshima
  • Ethylene-.alpha.-olefin copolymer and composition, and film, laminate and electrical insulating material comprising same
    Patent number: 6162871
    Abstract: A polyolefin resin composition containing an ethylene-.alpha.-olefin copolymer having: (A) a density d of 0.86 to 0.96 g/cm.sup.3 ; (B) a melt flow rate MFR of 0.01 to 200 g/10 min; (C) a molecular weight distribution Mw/Mn of 1.5 to 4.5; (D) a composition distribution parameter Cb of 1.08 to 2.00; and (E) an orthodichlorobenzene-soluble content X (wt %), at 25.degree. C. a density of d (g/cm.sup.3) and a melt flow rate MFR (wt %) satisfying that: (i) when the density (d) and the melt flow rate MFR satisfy relationship (I):d-0.008.times.logMFR.gtoreq.0.93 (I)the orthodichlorobenzene-soluble content X satisfies relationship (II):X<2.0 (II)(ii) when the density d and the melt flow rate MFR satisfy relationship (III):d-0.008.times.logMFR<0.93 (III)the orthodichlorobenzene-soluble content X satisfies relationship (IV):X<9.8.times.10.sup.3 .times.(0.9300-d+0.008.times.logMFR).sup.2 +2.
    Type: Grant
    Filed: October 5, 1998
    Date of Patent: December 19, 2000
    Assignee: Nippon Petrochemical Co., Ltd.
    Inventors: Hideo Watanabe, Masahiko Sato, Masaaki Ikeda, Takaaki Hattori, Yoshihiro Hatakeyama, Naoki Miwa, Tatsuyuki Kamiya, Hisao Sakuma, Yuka Umeshima
  • Ethylene-.alpha.-olefin copolymer and composition, and film, laminate and electrical insulating material comprising same
    Patent number: 5874513
    Abstract: An ethylene-.alpha.-olefin copolymer having: (A) a density d of 0.86 to 0.96 g/cm.sup.3 ; (B) a melt flow rate MFR of 0.01 to 200 g/10 min; (C) a molecular weight distribution Mw/Mn of 1.5 to 4.5; (D) a composition distribution parameter Cb of 1.08 to 2.00; and (E) an orthodichlorobenzene-soluble content X (wt %), at 25.degree. C. a density of d (g/cm.sup.3) and a melt flow rate MFR (g/10 min) satisfying that: (i) when the density (d) and the melt flow rate MFR satisfy relationship (I):d-0.008.times.logMFR.gtoreq.0.93 (I)the orthodichlorobenzene-soluble content X satisfies relationship (II):X<2.0 (II)(ii) when the density d and the melt flow rate MFR satisfy relationship (III):d-0.008.times.logMFR<0.93 (III)the orthodichlorobenzene-soluble content X satisfies relationship (IV):X<9.8.times.10.sup.3 .times.(0.9300-d+0.008.times.logMFR).sup.2 +2.
    Type: Grant
    Filed: March 28, 1996
    Date of Patent: February 23, 1999
    Assignee: Nippon Petrochemicals Co., Ltd.
    Inventors: Hideo Watanabe, Masahiko Sato, Masaaki Ikeda, Takaaki Hattori, Yoshihiro Hatakeyama, Naoki Miwa, Tatsuyuki Kamiya, Hisao Sakuma, Yuka Umeshima