Patents by Inventor Hisashi Goda
Hisashi Goda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8242070Abstract: Disclosed is the method for producing an anionic surfactant powder, including removing impurities by introducing gas into a crude anionic surfactant containing water in a content of 0.01 to 5% by weight in a granulator or drier, having an agitating blade. Also disclosed is the method for producing an anionic surfactant powder, including introducing a gas along with the surface of an inner wall of a granulator or drier having an agitating blade at a reduced pressure to produce the anionic surfactant powder.Type: GrantFiled: October 15, 2007Date of Patent: August 14, 2012Assignee: Kao CorporationInventors: Toku Fujioka, Tatsuki Matsumoto, Hisashi Goda
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Patent number: 8207106Abstract: Disclosed is a method for producing an anionic surfactant powder, which comprises a step wherein an aqueous anionic surfactant solution having an anionic surfactant concentration of 0.01-40% by weight is introduced into a granulating machine or a drying machine having a mixing blade under a reduced pressure for granulation and drying.Type: GrantFiled: December 7, 2007Date of Patent: June 26, 2012Assignee: Kao CorporationInventors: Hisashi Goda, Tatsuki Matsumoto, Toku Fujioka
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Patent number: 8026204Abstract: The present invention relates to a method for producing an anionic surfactant granule, which includes granulating an anionic surfactant powder in a granulator having an agitating blade, while adding water, at a temperature of the granule being higher by 0.5 to 30° C. than a boiling point of water under a pressure of the inside of the granulator.Type: GrantFiled: July 9, 2008Date of Patent: September 27, 2011Assignee: Kao CorporationInventors: Toku Fujioka, Tatsuki Matsumoto, Hisashi Goda
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Publication number: 20110166374Abstract: Disclosed is the method for producing an anionic surfactant powder, including removing impurities by introducing gas into a crude anionic surfactant containing water in a content of 0.01 to 5% by weight in a granulator or drier, having an agitating blade. Also disclosed is the method for producing an anionic surfactant powder, including introducing a gas along with the surface of an inner wall of a granulator or drier having an agitating blade at a reduced pressure to produce the anionic surfactant powder.Type: ApplicationFiled: October 15, 2007Publication date: July 7, 2011Applicant: Kao CorporationInventors: Toku Fujioka, Tatsuki Matsumoto, Hisashi Goda
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Publication number: 20110000987Abstract: The present invention relates to a method for producing an anionic surfactant granule, which includes granulating an anionic surfactant powder in a granulator having an agitating blade, while adding water, at a temperature of the granule being higher by 0.5 to 30° C. than a boiling point of water under a pressure of the inside of the granulator.Type: ApplicationFiled: July 9, 2008Publication date: January 6, 2011Applicant: Kao CorporationInventors: Toku Fujioka, Tatsuki Matsumoto, Hisashi Goda
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Publication number: 20100324325Abstract: Disclosed is a method for producing an anionic surfactant powder, which comprises a step wherein an aqueous anionic surfactant solution having an anionic surfactant concentration of 0.01-40% by weight is introduced into a granulating machine or a drying machine having a mixing blade under a reduced pressure for granulation and drying.Type: ApplicationFiled: December 7, 2007Publication date: December 23, 2010Applicant: KAO CORPORATIONInventors: Hisashi Goda, Tatsuki Matsumoto, Toku Fujioka
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Patent number: 7732396Abstract: The invention provides a granular anionic surfactant and a detergent composition blended with the same. Disclosed are a process for producing a granular anionic surfactant, which including stirring particles containing 50 to 100 wt % of an anionic surfactant at a temperature at which the anionic surfactant exhibits thermoplasticity at a stirring Froude number as defined below by equation (i) of 0.1 or more and less than 2.0; a granular anionic surfactant obtained by the process; a granular anionic surfactant having a surface roughness (Ra) of 1.0 ?m or less; and a detergent composition comprising the granular anionic surfactant. Fr=V/[(R×g)0.5]??(i) wherein Fr is Froude number, V is the peripheral speed at the top of a stirring blade [m/s], R is the radius of gyration of a stirring blade [m], and g is the acceleration of gravity [m/s2].Type: GrantFiled: December 22, 2004Date of Patent: June 8, 2010Assignee: Kao CorporationInventors: Hisashi Goda, Taiji Nakamae, Kazuhito Miyoshi
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Publication number: 20050170993Abstract: The invention provides a granular anionic surfactant and a detergent composition blended with the same. Disclosed are a process for producing a granular anionic surfactant, which including stirring particles containing 50 to 100 wt % of an anionic surfactant at a temperature at which the anionic surfactant exhibits thermoplasticity at a stirring Froude number as defined below by equation (i) of 0.1 or more and less than 2.0; a granular anionic surfactant obtained by the process; a granular anionic surfactant having a surface roughness (Ra) of 1.0 ?m or less; and a detergent composition comprising the granular anionic surfactant. Fr=V/[(R×g)0.5]??(i) wherein Fr is Froude number, V is the peripheral speed at the top of a stirring blade [m/s], R is the radius of gyration of a stirring blade [m], and g is the acceleration of gravity [m/s2].Type: ApplicationFiled: December 22, 2004Publication date: August 4, 2005Applicant: Kao CorporationInventors: Hisashi Goda, Taiji Nakamae, Kazuhito Miyoshi
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Patent number: 5336365Abstract: A method of etching a polysilicon film specimen by an electronic cyclotron resonance etching technique or a microwave plasma etching technique includes the first process in which a mixed gas containing Cl.sub.2 and HBr is used as a process gas for etching, the Cl.sub.2 occupying 50-70 vol. % of the whole mixed gas; and the second process in which a mixed gas containing HBr and He is used, with HBr being in a proportion of 20-50 vol. % of the mixed gas, and a low bias voltage from -100 to -30 volts is applied to a specimen carrier. Further, in the first and second processes, a mixed gas containing HBr and He is used, with HBr being in a proportion of 20-50 vol. %, and a relatively high bias voltage from -250 to -100 volts is applied to the specimen carrier in the first process, while a low bias voltage from -100 to -30 volts is applied to the same in the second process. According to the present invention, a polysilicon film can be etched without causing undercut and with high dimensional accuracy.Type: GrantFiled: February 25, 1993Date of Patent: August 9, 1994Assignee: Nippon Steel Semiconductor CorporationInventors: Hisashi Goda, Yasutoshi Asahina, Masayuki Hashimoto, Naoki Oka