Abstract: The purpose of the present invention is to provide a method for measuring the inclination of a waterjet relative to a machine coordinate system of a laser machining device. The present invention provides a method for measuring the inclination of a waterjet of a laser machining device in which a laser beam that has been introduced and guided into a waterjet jetted from an optical head is moved relative to a workpiece fixed to a table so as to machine the workpiece, wherein measured is the inclination of the waterjet relative to the table which is within a stable-length range in which the laser beam passing through the inside of the waterjet can be reflected so as to advance in the axial direction.

Abstract: A method of manufacturing a semiconductor device according to an embodiment includes forming a bonding layer containing a metal on a first surface of a first semiconductor substrate having the first surface and a first back surface; bonding the first semiconductor substrate and a second semiconductor substrate having a second surface and a second back surface so that the second surface is in contact with the bonding layer; and forming a coating layer covering the bonding layer on an outer peripheral portion of the second semiconductor substrate.

Abstract: The purpose of the present invention is to provide a method for measuring the inclination of a waterjet relative to a machine coordinate system of a laser machining device. The present invention provides a method for measuring the inclination of a waterjet of a laser machining device in which a laser beam that has been introduced and guided into a waterjet jetted from an optical head is moved relative to a workpiece fixed to a table so as to machine the workpiece, wherein measured is the inclination of the waterjet relative to the table which is within a stable-length range in which the laser beam passing through the inside of the waterjet can be reflected so as to advance in the axial direction.

Abstract: Certain embodiments provide a method for manufacturing a semiconductor device including: forming a protection film on a top surface of a semiconductor wafer provided with a plurality of semiconductor elements to cover the plurality of semiconductor elements; removing the protection film of an outer circumferential portion of the semiconductor wafer; grinding at least a part of the outer circumferential portion of the semiconductor wafer exposed by removing the protection film, from the top surface of the semiconductor wafer to a predetermined depth; and polishing an entire surface of a bottom surface of the semiconductor wafer to cause the semiconductor wafer to have a predetermined thickness.

Abstract: The present invention pertains to a fluid aspiration-collection apparatus for aspirating and collecting a fluid into a suction chamber through a fluid inlet communicating with the suction chamber in the case, and for discharging the fluid through a fluid outlet after completion of fluid aspiration. A primary object of the present invention is to provide an apparatus which is simple in construction and is capable of aspirating the fluid at a constant pressure.