Abstract: A method of forming a low-carbon silicon-containing film by CVD on a substrate having trenches includes: introducing a silicon-containing compound having three or less hydrocarbon units in its molecule and having a boiling temperature of 35° C. to 220° C.; applying RF power to the gas; and depositing a film on a substrate having trenches wherein the substrate is controlled at a temperature such that components of the silicon-containing compound are at least partially liquidified on the substrate, thereby filling the trenches with the film.

Abstract: A method of filling a recess with an insulation film includes: introducing an alkoxysilane or aminosilane precursor containing neither a Si—C bond nor a C—C bond into a reaction chamber where a substrate having an irregular surface including a recess is placed; and depositing a flowable Si-containing insulation film on the irregular surface of the substrate to fill the recess therewith by plasma reaction at ?50° C. to 100° C.

Abstract: A method of forming a low-carbon silicon-containing film by CVD on a substrate having trenches includes: introducing a silicon-containing compound having three or less hydrocarbon units in its molecule and having a boiling temperature of 35° C. to 220° C.; applying RF power to the gas; and depositing a film on a substrate having trenches wherein the substrate is controlled at a temperature such that components of the silicon-containing compound are at least partially liquidified on the substrate, thereby filling the trenches with the film.

Abstract: A measurement system (222) for measuring the position of a stage (248) along a first axis includes a first system (260) having a first beam source (260A) that directs a first beam (260H) on a first path that is parallel with a second axis and a first redirector (260D) that redirects the first beam so that the redirected first beam (260H) is on a first redirected path that is parallel with the first axis irrespective to the orientation of the first redirector (260D) about a third axis. The measurement system (222) can include a shield (380) that protects the first beam (260H) from environmental conditions.

Abstract: A measurement system (222) for measuring the position of a stage (248) along a first axis includes a first system (260) having a first beam source (260A) that directs a first beam (260H) on a first path that is parallel with a second axis and a first redirector (260D) that redirects the first beam so that the redirected first beam (260H) is on a first redirected path that is parallel with the first axis irrespective to the orientation of the first redirector (260D) about a third axis. The measurement system (222) can include a shield (380) that protects the first beam (260H) from environmental conditions.

Abstract: This invention relates to a wafer inspection apparatus having various types of structures for realizing a reduction in convey time of a selected wafer as an inspection target, an improvement in operability, or the like. In particular, this wafer inspection apparatus has a first convey system and a second convey system. The first convey system is movable in a direction perpendicular to a wafer convey reference surface and has a plurality of arm portions operable independently of each other. The second convey system has a plurality of rotary arm portions that are movable in the direction perpendicular to the wafer convey reference surface. Thus, a structure in which the wafer convey time is shorter than in a conventional wafer inspection apparatus is realized. This wafer inspection apparatus also has a lifting unit with a specific structure, thus realizing an improvement in operability of the apparatus or the like.

Abstract: An absorber of impact-caused vibrations which is excellent in absorbing impact-caused vibrations, particularly relates to vibration absorption from sports instruments, tools or bicycle associated with impact-caused vibrations, for example, with the absorber of impact-caused vibrations made of a weight and an elastomer attached to a part of devices such as grip end, absorbs impact-caused vibration energy by converting impact-caused vibrations of devices to moving energy of a weight.