Patents by Inventor Hisayoshi Ichikawa
Hisayoshi Ichikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9819104Abstract: A connector is attachable to an object having a lock portion. The connector includes a housing and a frame. The housing has a press portion and a support portion. The housing is fixed to the object under an attached state where the connector is attached to the object. The frame has a supported portion, a pressed portion and a locked portion. When the connector is in the attached state, the supported portion is positioned between the pressed portion and the locked portion in a front-rear direction and is supported from below by the support portion in an up-down direction perpendicular to the front-rear direction. Under the attached state, the pressed portion is pressed by the press portion from above. Under the attached state, the locked portion applies a force to the lock portion from below.Type: GrantFiled: March 31, 2015Date of Patent: November 14, 2017Assignees: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED, SONY CORPORATIONInventors: Hisayoshi Ichikawa, Takamitsu Wada, Shinya Hattori
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Publication number: 20170033477Abstract: A connector is attachable to an object having a lock portion. The connector includes a housing and a frame. The housing has a press portion and a support portion. The housing is fixed to the object under an attached state where the connector is attached to the object. The frame has a supported portion, a pressed portion and a locked portion. When the connector is in the attached state, the supported portion is positioned between the pressed portion and the locked portion in a front-rear direction and is supported from below by the support portion in an up-down direction perpendicular to the front-rear direction. Under the attached state, the pressed portion is pressed by the press portion from above. Under the attached state, the locked portion applies a force to the lock portion from below.Type: ApplicationFiled: March 31, 2015Publication date: February 2, 2017Applicants: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED, SONY CORPORATIONInventors: Hisayoshi ICHIKAWA, Takamitsu WADA, Shinya HATTORI
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Patent number: 8158209Abstract: Method and apparatus for coating a surface of a work with a thin resin or plastic film suitable for use in imprinting a pattern by impressing a master pattern on a transfer surface of a mold on the coated resin film. A curable resin liquid is coated on a work by the use of an inkjet feed means having a plural number of inkjet nozzle holes in a row or rows on a nozzle assembly, in association with actuators to propel droplets of resin liquid from the respective inkjet nozzle holes in controlled timings while moving the inkjet feed means and the work relative to each other.Type: GrantFiled: December 17, 2009Date of Patent: April 17, 2012Assignee: Hitachi High-Technologies CorporationInventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Patent number: 8034277Abstract: An apparatus for transferring a pattern of minute surface structures, using a pair of press members which are located opposingly for movements toward and away from each other. One press member is adapted to support thereon a mold having on a transfer surface a master pattern of minute structures to be transferred, while the other press member is adapted to support thereon an annular substrate plate having a curable resin layer coated thereon and to press the resin layer against the transfer surface of the mold to transfer said minute structures to the resin layer. The mold is provided with a circular center hole defining at least three small-diameter segments and three large-diameter segments alternately and at uniform angular intervals along an inner periphery of the mold. The annular substrate plate has an inside diameter exactly matching with the small-diameter segments at the inner periphery of the mold.Type: GrantFiled: October 1, 2009Date of Patent: October 11, 2011Assignee: Hitachi High-Technologies CorporationInventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Patent number: 7964135Abstract: Disclosed herein is a method for transferring a pattern of minute dents and projections to an energy ray-setting resin layer coated on a substrate plate by pressing a master pattern on a transfer mold, followed by irradiation of energy rays. The pattern transfer method comprises the steps of pressing a master pattern on a transfer mold against the resin layer under a predetermined imprinting pressure, irradiating the resin layer under the imprinting pressure with energy rays, interrupting the irradiation of energy rays and at the same time cancelling application of the imprinting pressure and holding the resin layer and the transfer mold in a non-pressed state to relieve the resin layer of internal stresses, and recommencing irradiation of the resin layer with energy rays to complete hardening of the resin layer which is held in contact with the transfer mold in a non-pressed state.Type: GrantFiled: March 9, 2010Date of Patent: June 21, 2011Assignee: Hitachi High-Technologies CorporationInventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Publication number: 20100156006Abstract: Disclosed herein is a method for transferring a pattern of minute dents and projections to an energy ray-setting resin layer coated on a substrate plate by pressing a master pattern on a transfer mold, followed by irradiation of energy rays. The pattern transfer method comprises the steps of pressing a master pattern on a transfer mold against the resin layer under a predetermined imprinting pressure, irradiating the resin layer under the imprinting pressure with energy rays, interrupting the irradiation of energy rays and at the same time cancelling application of the imprinting pressure and holding the resin layer and the transfer mold in a non-pressed state to relieve the resin layer of internal stresses, and recommencing irradiation of the resin layer with energy rays to complete hardening of the resin layer which is held in contact with the transfer mold in a non-pressed state.Type: ApplicationFiled: March 9, 2010Publication date: June 24, 2010Inventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Publication number: 20100092684Abstract: Method and apparatus for coating a surface of a work with a thin resin or plastic film suitable for use in imprinting a pattern by impressing a master pattern on a transfer surface of a mold on the coated resin film. A curable resin liquid is coated on a work by the use of an inkjet feed means having a plural number of inkjet nozzle holes in a row or rows on a nozzle assembly, in association with actuators to propel droplets of resin liquid from the respective inkjet nozzle holes in controlled timings while moving the inkjet feed means and the work relative to each other.Type: ApplicationFiled: December 17, 2009Publication date: April 15, 2010Inventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Publication number: 20100015380Abstract: An apparatus for transferring a pattern of minute surface structures, using a pair of press members which are located opposingly for movements toward and away from each other. One press member is adapted to support thereon a mold having on a transfer surface a master pattern of minute structures to be transferred, while the other press member is adapted to support thereon an annular substrate plate having a curable resin layer coated thereon and to press the resin layer against the transfer surface of the mold to transfer said minute structures to the resin layer. The mod is provided with a circular center hole defining at least three small-diameter segments and three large-diameter segments alternately and at uniform angular intervals along an inner periphery of the mold. The annular substrate plate has an inside diameter exactly matching with the small-diameter segments at the inner periphery of the mold.Type: ApplicationFiled: October 1, 2009Publication date: January 21, 2010Inventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Patent number: 7600993Abstract: An apparatus for transferring a pattern of minute surface structures, using a pair of press members which are located opposingly for movements toward and away from each other. One press member is adapted to support thereon a mold having on a transfer surface a master pattern of minute structures to be transferred, while the other press member is adapted to support thereon an annular substrate plate having a curable resin layer coated thereon and to press the resin layer against the transfer surface of the mold to transfer said minute structures to the resin layer. The mod is provided with a circular center hole defining at least three small-diameter segments and three large-diameter segments alternately and at uniform angular intervals along an inner periphery of the mold. The annular substrate plate has an inside diameter exactly matching with the small-diameter segments at the inner periphery of the mold.Type: GrantFiled: August 17, 2007Date of Patent: October 13, 2009Assignee: Hitachi High-Technologies CorporationInventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Publication number: 20080075908Abstract: An apparatus for transferring a pattern of minute surface structures, using a pair of press members which are located opposingly for movements toward and away from each other. One press member is adapted to support thereon a mold having on a transfer surface a master pattern of minute structures to be transferred, while the other press member is adapted to support thereon an annular substrate plate having a curable resin layer coated thereon and to press the resin layer against the transfer surface of the mold to transfer said minute structures to the resin layer. The mod is provided with a circular center hole defining at least three small-diameter segments and three large-diameter segments alternately and at uniform angular intervals along an inner periphery of the mold. The annular substrate plate has an inside diameter exactly matching with the small-diameter segments at the inner periphery of the mold.Type: ApplicationFiled: August 17, 2007Publication date: March 27, 2008Inventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Publication number: 20080018024Abstract: Disclosed herein is a method for transferring a pattern of minute dents and projections to an energy ray-setting resin layer coated on a substrate plate by pressing a master pattern on a transfer mold, followed by irradiation of energy rays. The pattern transfer method comprises the steps of pressing a master pattern on a transfer mold against the resin layer under a predetermined imprinting pressure, irradiating the resin layer under the imprinting pressure with energy rays, interrupting the irradiation of energy rays and at the same time cancelling application of the imprinting pressure and holding the resin layer and the transfer mold in a non-pressed state to relieve the resin layer of internal stresses, and recommencing irradiation of the resin layer with energy rays to complete hardening of the resin layer which is held in contact with the transfer mold in a non-pressed state.Type: ApplicationFiled: July 19, 2007Publication date: January 24, 2008Inventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Publication number: 20070289530Abstract: Method and apparatus for coating a surface of a work with a thin resin or plastic film suitable for use in imprinting a pattern by impressing a master pattern on a transfer surface of a mold on the coated resin film. A curable resin liquid is coated on a work by the use of an inkjet feed means having a plural number of inkjet nozzle holes in a row or rows on a nozzle assembly, in association with actuators to propel droplets of resin liquid from the respective inkjet nozzle holes in controlled timings while moving the inkjet feed means and the work relative to each other.Type: ApplicationFiled: May 23, 2007Publication date: December 20, 2007Inventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Patent number: 6790300Abstract: Method and apparatus for registering and bonding upper and lower substrate plates together through a sealer material and in such a way as to form a gap of a predetermined width between the two substrate plates. Registered substrate plates are provisionally pressed to form a joined substrate assembly, which is then pressed under heated conditions at a hot press station, thereby compressing the sealer material into a flattened form and at the same time thermally hardening the sealer material to form a predetermined gap space between the two substrate plates. In order to correct positional deviations which occur to the upper and lower substrate plates in the course of the hot pressing, on the basis detected positional deviations of upper and lower substrate plates of a hot-pressed substrate assembly, upper and lower substrates are set in offset positions instead of aligned positions when registering them at the provisional press station to cancel predicted positional deviations at the hot press station.Type: GrantFiled: September 14, 2001Date of Patent: September 14, 2004Assignee: Hitachi Electronics Engineering Co., Ltd.Inventors: Hiroyuki Watanabe, Yuji Otsubo, Shinji Sugizaki, Hisayoshi Ichikawa, Hiroaki Kiyomiya
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Publication number: 20020043344Abstract: Method and apparatus for registering and bonding upper and lower substrate plates together through a sealer material and in such a way as to form a gap of a predetermined width between the two substrate plates. Registered substrate plates are provisionally pressed to form a joined substrate assembly, which is then pressed under heated conditions at a hot press station, thereby compressing the sealer material into a flattened form and at the same time thermally hardening the sealer material to form a predetermined gap space between the two substrate plates. In order to correct positional deviations which occur to the upper and lower substrate plates in the course of the hot pressing, on the basis detected positional deviations of upper and lower substrate plates of a hot-pressed substrate assembly, upper and lower substrates are set in offset positions instead of aligned positions when registering them at the provisional press station to cancel predicted positional deviations at the hot press station.Type: ApplicationFiled: September 14, 2001Publication date: April 18, 2002Applicant: Hitachi Electronics Engineering Co., Ltd.Inventors: Hiroyuki Watanabe, Yuji Otsubo, Shinji Sugizaki, Hisayoshi Ichikawa, Hiroaki Kiyomiya
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Patent number: 6004487Abstract: Method and apparatus for a disk texturing operation in which laser pulses are successively bombarded against a delimited surface area on the face of a rotating disk, from an optical laser pulse irradiating means which is put in movement in a radial direction relative to the disk to provide a textured zone of a predetermined width on the disk. A pulsed laser beam from a laser light source is adjusted to an optimum power level for an aimed bump diameter. The laser beam is then transformed into an annular beam of a collimated light flux having specified inner and outer diameters, and the resulting laser pulses are successively bombarded on the texturing zone through an objective optical system condensing said laser pulses into a specified spot diameter thereby to form minute bumps of predetermined shape and diameter uniformly on the surface of the disk.Type: GrantFiled: July 7, 1998Date of Patent: December 21, 1999Assignee: Hitachi Electronics Engineering Co., Ltd.Inventors: Kenya Wada, Hisayoshi Ichikawa, Kazuto Kinoshita, Shinji Sugizaki
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Patent number: 5952014Abstract: An apparatus for forming a textured zone in a predetermined surface area on a magnetic data recording disc, which is capable of precisely controlling the position and range of the texturing zone. Bumps 4 are formed on a CSS zone on the inner peripheral side of a magnetic recording disc 1 by the use of a spindle means 6 and a laser beam bombarding means 7. The spindle means 6 is provided with a chuck mechanism 13 with opposingly confronting tapered surfaces 18a and 21a to hold a disc 1 in a centered position in alignment with the rotational axis of a spindle shaft 10. On the other hand, the laser beam bombarding means 7 has part of component parts of its optical system, from a laser energy source 34 up to an electromagnetic shutter 39, mounted on its main casing 7a, and has a reflector mirror 40 and an objective lens 41 accommodated in a movable housing 31 which is movable in the direction of its optical axis to displace a laser spot position on the surface of the disc 1 in a radial direction thereof.Type: GrantFiled: April 18, 1997Date of Patent: September 14, 1999Assignee: Hitachi Electronics Engineering Co., Ltd.Inventors: Kenya Wada, Hisayoshi Ichikawa, Takahisa Ishida
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Patent number: 5885143Abstract: A disk texturing apparatus for texturing surfaces of a magnetic disk or the like with cross-pattern grooves. The texturing apparatus is basically constituted by a rotational drive having a spindle for supporting and rotating a disk, and a tape transport mechanism for moving a texturing tape across and in pressed with a texturing surface of said disk. The spindle of the rotational drive mechanism is arranged to hold a disk in an eccentrically deviated position off the rotational axis of the rotational drive. As a result, the disk is revolved along an eccentrically deflecting orbit around the rotational axis of said rotational drive while being rotated with the spindle, moving in and out in radial directions in a degree commensurate with the amount of deviation from said rotational axis to form cross-pattern grooves on the disk surface.Type: GrantFiled: July 17, 1997Date of Patent: March 23, 1999Assignee: Hitachi Electronics Engineering Co., Ltd.Inventors: Hisayoshi Ichikawa, Takahisa Ishida
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Patent number: 5879576Abstract: Method and apparatus for processing substrates through a number of wet treatments. A substrate is set on a substrate rotating means for rotation in a horizontal face-up position, within a housing which is open on its top side. By a treating liquid feed means having a treating liquid feed nozzle member, at least one kind of treating liquid is supplied onto upper surfaces of the substrate being rotated by the substrate rotating means. The treating liquid feed nozzle member is supported on a movable arm for displacement to and from an operative position vertically confronting the substrate and a receded standby position away from the substrate on the substrate rotating means. Located face to face with lower surfaces of the substrate is a nozzle means which supplies a fluid to the lower side of the substrate.Type: GrantFiled: May 7, 1997Date of Patent: March 9, 1999Assignee: Hitachi Electronics Engineering Co., Ltd.Inventors: Kenya Wada, Kazuhiko Gonmori, Hisayoshi Ichikawa, Nobuo Morita, Hiroshi Fukuda
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Patent number: 5092011Abstract: Described herein is a disk washing apparatus for cleaning substrate disks of memory medium, which comprises in combination: a loader section having a magazine for holding a number of disks to be washed; a working section including a washing stage arranged to wash the front and rear faces of a disk simultaneously with inner and outer peripheral surfaces thereof, a rinsing stage arranged to rinse the front and rear faces of a disk simultaneously with inner and outer peripheral surfaces thereof, and a drying stage adapted to dry a washed and rinsed disk by high speed spin drying; an unloader section having a magazine for accommodating cleaned disks; and disk transfer chucks adapted to transfer disks one after another stepwise from the loader section to the unloader section, passing the disks successively to the washing, rinsing and drying stages of the working section, the washing, rinsing, and drying stages being located in series between the loader and unloader sections.Type: GrantFiled: April 12, 1991Date of Patent: March 3, 1992Assignee: Hitachi Electronics Engineering Co., Ltd.Inventors: Kazuhiko Gommori, Hisayoshi Ichikawa, Takahisa Ishida