Abstract: An apparatus for processing an elongated structure includes a mold within which an uncross-linked rubber material is placed, at least one heating unit configured to heat the mold, and a pressure device configured to press the rubber material using the mold heated by the heating unit to promote shaping the rubber material by the mold while proceeding the cross-linking of the rubber material. The heating unit includes a central heating device configured to heat a longitudinal central portion of the mold, multiple cooling devices configured to cool two longitudinal end portions of the mold, multiple intermediate heating devices configured to heat two intermediate portions between the longitudinal central portion and the longitudinal end portions of the mold, heat shield plates disposed between the central heating device and the intermediate heating devices, and heat shield plates disposed between the cooling devices and the intermediate heating devices.

Abstract: An apparatus for processing an elongated structure includes a mold within which an uncross-linked rubber material is placed, at least one heating unit configured to heat the mold, and a pressure device configured to press the rubber material using the mold heated by the heating unit to promote shaping the rubber material by the mold while proceeding the cross-linking of the rubber material. The heating unit includes a central heating device configured to heat a longitudinal central portion of the mold, multiple cooling devices configured to cool two longitudinal end portions of the mold, multiple intermediate heating devices configured to heat two intermediate portions between the longitudinal central portion and the longitudinal end portions of the mold, heat shield plates disposed between the central heating device and the intermediate heating devices, and heat shield plates disposed between the cooling devices and the intermediate heating devices.

Abstract: A molding apparatus for a loop structure includes a molding die within which both ends of an elongated structure are located in such a manner that the ends are in contact with each other, the elongated structure being formed of a rubber to which a peroxide cross-linking agent is added; a liftable housing including a lower part having an opening, the housing defining a containment space within which the molding die and the elongated structure are located when the housing is lowered; a degassing device configured to depressurize and degas the containment space; a heating device configured to heat the molding die in the containment space; a pressure device configured to pressurize the ends of the elongated structure with the use of the heated molding die in the containment space to proceed cross-linking reaction of the rubber, thereby bonding the ends of the elongated structure; and an elevating device configured to lift and lower the housing.

Abstract: A seal molding material for cell electrolytic solution, which comprises an EPDM composition comprising a peroxide-crosslinkable EPDM and an organic peroxide, the seal molding material being for use at the electrode site of a nickel-hydrogen cell, wherein the EPDM composition comprises preferably 100 parts by weight of a peroxide-crosslinkable EPDM, 10 to 150 parts by weight of a filler and 1 to 8 parts by weight of an organic peroxide, and not more than 40 parts by weight of hydrocarbon-based oil can be further contained. The seal material molded from the seal molding material for cell electrolytic solution has a sufficient durability against a potassium hydroxide-based electrolytic solution and a longer life, and is free from any deterioration, when energized at the electrode site of a nickel-hydrogen cell.

Abstract: A seal molding material for cell electrolytic solution, which comprises an EPDM composition comprising a peroxide-crosslinkable EPDM and an organic peroxide, the seal molding material being for use at the electrode site of a nickel-hydrogen cell, wherein the EPDM composition comprises preferably 100 parts by weight of a peroxide-crosslinkable EPDM, 10 to 150 parts by weight of a filler and 1 to 8 parts by weight of an organic peroxide, and not more than 40 parts by weight of hydrocarbon-based oil can be further contained. The seal material molded from the seal molding material for cell electrolytic solution has a sufficient durability against a potassium hydroxide-based electrolytic solution and a longer life, and is free from any deterioration, when energized at the electrode site of a nickel-hydrogen cell.

Abstract: A seal molding material for cell electrolytic solution, which comprises an EPDM composition comprising a peroxide-crosslinkable EPDM and an organic peroxide, the seal molding material being for use at the electrode site of a nickel-hydrogen cell, wherein the EPDM composition comprises preferably 100 parts by weight of a peroxide-crosslinkable EPDM, 10 to 150 parts by weight of a filler and 1 to 8 parts by weight of an organic peroxide, and not more than 40 parts by weight of hydrocarbon-based oil can be further contained. The seal material molded from the seal molding material for cell electrolytic solution has a sufficient durability against a potassium hydroxide-based electrolytic solution and a longer life, and is free from any deterioration, when energized at the electrode site of a nickel-hydrogen cell.

Abstract: A curable organopolysiloxane composition is disclosed, comprising (A) 100 parts by weight of an organopolysiloxane having at least two monovalent aliphatic unsaturated hydrocarbon groups bonded to the silicon atoms per molecule, (B) an organopolyhydrogensiloxane having at least three hydrogen atoms bonded to the silicon atoms per molecule in such an amount that the number of the hydrogen atoms bonded to the silicon atoms falls within a range of from 0.25 to 8 per monovalent aliphatic unsaturated hydrocarbon group in component (A), (C) a catalyst selected from the group consisting of platinum and platinum compounds in an amount of from 0.

Abstract: An active halogen-containing acrylic rubber composition for molding oil filter-gaskets, which comprises an active halogen-containing acrylic rubber and a metal phosphonate represented by the following general formula:RR'nPO(OH)(OM)wherein R is an alkyl group having 1 to 32 carbon atoms, a polyfluorocarbon group or a perfluoropolyether group; R' is an alkylene group having 1 to 6 carbon atoms, a phenylene group, an oxyphenylene group or a sulfonamide group; M is an alkali metal; and n is 0 or 1, gives oil filter-gaskets having a distinguished durable protection against fixation without lowering of high temperature sealability, even if used in engine oil.

Abstract: A room temperature-curable organopolysiloxane composition is disclosed, comprising (A) 100 parts by weight of an organopolysiloxane terminated with a silanol group or an alkoxy group, (B) from 0.1 to 30 parts by weight of an organosilicon compound containing more than 2, in average, of hydrolyzable groups bonded to the silicon atom per molecule, (C) from 1 to 650 parts by weight of an oil-absorbing filler which has been prepared by impregnating (a) a porous filler with (b) a volatile organic compound which is incompatible or partly compatible to component (A) and compatible with an organic oily substance in an amount of from 1% by weight based on the weight of the porous filler up to a saturation amount and, if desired, (D) a requisite amount of a curing catalyst. The composition exhibits satisfactory adhesion to a substrate in such adhesion operation as an FIPG system without requiring wiping of organic oily contaminants on the substrate, such as hydrocarbon oils, e.g.

Abstract: A fungiresistant polyorganosiloxane composition comprising(A) 100 parts by weight of a polyorganosiloxane having a viscosity at 25.degree. C. of from 100 to 500,000 cSt, each of both the terminals of which being blocked with a silanol group or an alkoxy group,(B) from 0.1 to 20 parts by weight of an organisilicon compound having on the average more than 2 hydrolyzable groups each bonded to a silicon atom in the molecule,(C) from 0.001 to 25 parts by weight of a benzimidazolylcarbamate compound represented by the formula ##STR1## wherein R.sup.1 represents a hydrogen atom, an alkyl group having from 1 to 4 carbon atoms, a halogen atom, or a nitro group; R.sup.2 represents an alkyl group having from 1 to 4 carbon atoms or an alkoxyalkyl group having from 2 to 4 carbon atoms: and R.sup.3 represents a hydrogen atom, an N-substituted or unsubstituted carbamoyl group or an N-substituted or unsubstituted carbamoyloxy group, and(D) from 0.

Abstract: Disclosed is a curable resin composition comprising (a) 100 parts by weight of a siloxane-amide block copolymer of formula (1): ##STR1## where R.sup.1 is a substituted or unsubstituted divalent hydrocarbon group; R.sup.2 may be the same or different and each is a substituted or unsubstituted monovalent hydrocarbon group; R.sup.3 is substituted or unsubstituted divalent aromatic hydrocarbon group; and m and an each are a number of 1 or more; (b) from 1 to 100 parts by weight of a crosslinking agent containing 2 or more epoxy groups in the molecule, and (c) up to 15 parts by weight of a curable catalyst. The composition can be cured at room temperature and in the absence of moisture in a closed system to give a cured product having high oil resistance and mechanical strength.

Abstract: A room temperature vulcanizing type electroconductive silicone rubber composition comprising(A) 100 parts by weight of an organopolysiloxane having in one molecule thereof at least two hydroxyl groups and/or alkoxy groups, said hydroxyl groups and alkoxy groups being bonded to silicon atoms;(b) 10 to 850 parts by weight of a powdery or fibrous metallic oxide-type electroconductive material showing a white or a light and bright color;(C) 0.1 to 30 parts by weight of a crosslinking agent;(D) 0 to 5 parts by weight of a crosslinking catalyst; and(E) 1 to 500 parts by weight of a volatile organic solventis disclosed. The composition can cold cure to form a rubber-like elastomer showing a white color or a light and bright color and having a stable semiconducting properties over a long period of time.

Abstract: A primer composition comprising (A) a solvent-soluble polyorganosiloxane consisting essentially of R.sup.1 SiO.sub.3/2 units and R.sup.1 SiO units in a specific ratio, (B) an organosiloxane and/or a partial hydrolysis condensate thereof, the organosiloxane having more than two silicon-bonded hydrolyzable groups per molecule, (C) an electroconductive filler, (D) a curing catalyst, and (E) an organic solvent. The primer composition shows good coating properties and excellent storage stability. Primer film obtained from the primer composition has various excellent properties such as adhesiveness, electroconductivity, heat resistance and moisture resistance.

Abstract: A room temperature-curable composition comprising(a) 100 parts by weight of a siloxane-amide block copolymer represented by the formula (1) ##STR1## wherein Y represents a hydrolyzable group-containing organosilyl group of the formula --SiR.sup.5.sub.a X.sub.a-ain whichR.sup.5 represents a substituted or unsubstituted monovalent hydrocarbon group,a is an integer of 0, 1 or 2, andX is directly bonded to the silicon atom and represents a hydolyzable group or a hydroxyl group,R.sup.1 represents a divalent group selected from the group consisting of ##STR2## in which R.sup.6 represents a hydrogen atom, a substituted or unsubstituted monovalent hydrocarbon group, or an organosilyl group of the formula --SiR.sup.8.sub.b X.sub.3-bin whichR.sup.8 represents a substituted or unsubstituted monovalent hydrocarbon group,b is an integer of 0, 1, 2, or 3, and X is the same as defined above, andR.sup.

Abstract: A siloxane-amide block copolymer having an alkenyl group or a photopolymerizable organic group at both terminals thereof which is represented by formula (I): ##STR1## wherein R.sup.1 represents a reaction residual group of an epoxy compound containing an alkenyl group or a photopolymerizable organic group and/or a substitution reaction product between said reaction residual group and an organosilyl group and the other symbols are as defined in the specification. The copolymer is produced by reacting a polycondensate of a diaminosiloxane and a dicarboxylic acid dihalide with a compound containing an alkenyl group or a photopolymerizable organic group at one terminal thereof and an epoxy group at the other terminal thereof. The siloxane-amide block copolymer exhibits excellent processability and reactive curability by application of heat, light or radiation.

Abstract: A siloxane-amide block copolymer represented by formula (I): ##STR1## wherein the symbols are as defined in the specification, is disclosed. The polymer of formula (I) is produced by reacting a polycondensate of a diaminosiloxane and a dicarboxylic acid dihalide with an epoxysilane to induce ring-opening addition reaction between the terminal amino groups of the polymer and the epoxy group of the epoxysilane. The siloxane-amide block copolymer exhibits excellent processability and reactive curability due to the hydrolyzable silyl groups at the both terminals.