Patents by Inventor Hisayuki Nozawa

Hisayuki Nozawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9902380
    Abstract: A saddle-straddling type motor vehicle on which an object is loadable for traveling with the motor vehicle. The motor vehicle includes a main body having a wheel, a motor that generates driving force for moving the main body, a wheel force calculator configured to calculate wheel force exerted between the wheel and a surface of a road on which the motor vehicle is traveling, and a wheel force corrector configured to correct the wheel force calculated by the wheel force calculator based on a condition of the object loaded on the motor vehicle.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: February 27, 2018
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Hisayuki Nozawa
  • Publication number: 20150127240
    Abstract: A saddle-straddling type motor vehicle on which an object is loadable for traveling with the motor vehicle. The motor vehicle includes a main body having a wheel, a motor that generates driving force for moving the main body, a wheel force calculator configured to calculate wheel force exerted between the wheel and a surface of a road on which the motor vehicle is traveling, and a wheel force corrector configured to correct the wheel force calculated by the wheel force calculator based on a condition of the object loaded on the motor vehicle.
    Type: Application
    Filed: October 31, 2014
    Publication date: May 7, 2015
    Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Hisayuki NOZAWA
  • Patent number: 8802561
    Abstract: Techniques disclosed herein prevent wire flaking (collapse). One aspect is an improved way of forming wires over trenches, which may be located in a hookup region of a 3D memory array, and may be used to form electrical connections between conductive lines in the memory array and drivers. The trenches are formed between CMP dummy structures. The trenches are partially filled with a flowable oxide film, which leaves a gap in the trench that is at least as wide as the total pitch of the wires to be formed. A capping layer is formed over the flowable film. After forming a conductive layer over the dielectric layer, the conductive layer is etched to form conductive wires. Some of the capping layer, as well as the CMP dummy structures may be removed. Thus, the conductive wires may be at least temporarily supported by lines of material formed from the capping layer.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: August 12, 2014
    Assignee: SanDisk 3D LLC
    Inventors: Chao Feng Yeh, Hiroaki Iuchi, Hitomi Fujimoto, Hisayuki Nozawa