Patents by Inventor Hitoki Kanagawa
Hitoki Kanagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180288883Abstract: A method for producing a suspension board with circuit assembly includes a preparing step of preparing a plurality of board assemblies each of which includes a plurality of suspension boards with circuit including a first terminal, a supporting portion collectively supporting the plurality of suspension boards with circuit, and a plurality of connecting portions connecting each of the suspension boards with circuit to the supporting portion; an assembly disposing step of disposing the plurality of board assemblies on a carrier board; a solder disposing step of disposing a first solder on the first terminal; an element disposing step of disposing an electronic element so as to be in contact with the first solder; and a reflow step of heating the first solder to be dissolved and connecting the electronic element to the first terminal. The solder disposing step, the element disposing step, and the reflow step are continuously performed.Type: ApplicationFiled: March 22, 2018Publication date: October 4, 2018Applicant: NITTO DENKO CORPORATIONInventors: Takatoshi SAKAKURA, Hitoki KANAGAWA
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Publication number: 20170365285Abstract: A head stack assembly (HSA) includes: a preamp having first contacts disposed on a first side and second contacts disposed on a second side which is opposite to the first side; a main actuator circuit disposed proximate the first side of the preamp and having Contacts configured to be electrically connected to the first contacts of the preamp; and a flexure/suspension circuit disposed proximate the second side of the preamp and having flexure/suspension circuit contacts configured to be directly electrically connected to the second contacts of the preamp.Type: ApplicationFiled: May 31, 2017Publication date: December 21, 2017Applicant: NITTO DENKO CORPORATIONInventors: Alex N.E. Cayaban, Hitoki KANAGAWA, Yukimasa KAWATO
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Publication number: 20170318676Abstract: A method for producing a wired circuit board, including an insulating layer having a first through portion passing through in a thickness direction thereof and a first terminal portion having a second through portion overlapped with the first through portion when projected in the thickness direction, includes the steps of providing a first bonding material at one surface in the thickness direction of the first terminal portion and allowing the first bonding material to flow from the one surface in the thickness direction of the first terminal portion toward the other surface in the thickness direction thereof into the second through portion by allowing the first bonding material to flow.Type: ApplicationFiled: July 17, 2017Publication date: November 2, 2017Applicant: NITTO DENKO CORPORATIONInventors: Takahiro TAKANO, Hitoki KANAGAWA, Takatoshi SAKAKURA
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Patent number: 9693467Abstract: A method for producing a suspension board with circuit includes the steps of (7) removing a first electroless plating layer corresponding to a first terminal and/or a second electroless plating layer corresponding to a second terminal by etching, (8) removing a metal supporting board in contact with the lower surface of a first conductive layer filling the inside of a first opening portion, and (9) providing an electrolytic plating layer on the surface of the first terminal with the first electroless plating layer removed and/or the surface of the second terminal with the second electroless plating layer removed and the lower surface of the first conductive layer exposed from the inside of the first opening portion by electrolytic plating supplying electricity from the metal supporting board.Type: GrantFiled: December 2, 2014Date of Patent: June 27, 2017Assignee: NITTO DENKO CORPORATIONInventors: Hiroyuki Tanabe, Hitoki Kanagawa
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Patent number: 9686869Abstract: A write wiring trace is formed over insulating layer. A coating layer, being directly in contact with at least a first portion of a surface of the write wiring trace, is formed over the insulating layer to cover the write wiring trace. A connection terminal is formed over the insulating layer to be electrically connected to the write wiring trace and exposed from the coating layer.Type: GrantFiled: June 29, 2015Date of Patent: June 20, 2017Assignee: NITTO DENKO CORPORATIONInventors: Hiroyuki Tanabe, Hitoki Kanagawa
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Publication number: 20160135296Abstract: A method for producing a wired circuit board, including an insulating layer having a first through portion passing through in a thickness direction thereof and a first terminal portion having a second through portion overlapped with the first through portion when projected in the thickness direction, includes the steps of providing a first bonding material at one surface in the thickness direction of the first terminal portion and allowing the first bonding material to flow from the one surface in the thickness direction of the first terminal portion toward the other surface in the thickness direction thereof into the second through portion by allowing the first bonding material to flow.Type: ApplicationFiled: November 9, 2015Publication date: May 12, 2016Applicant: NITTO DENKO CORPORATIONInventors: Takahiro TAKANO, Hitoki KANAGAWA, Takatoshi SAKAKURA
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Patent number: 9338888Abstract: A wired circuit board includes a wire and a terminal formed continuously to the wire and electrically connected to an electronic element at one surface thereof in a thickness direction. The terminal includes a first contact portion, and a second contact portion provided around the first contact portion to protrude more than the first contact portion toward one side in the thickness direction.Type: GrantFiled: March 14, 2013Date of Patent: May 10, 2016Assignee: NITTO DENKO CORPORATIONInventors: Saori Kanezaki, Hitoki Kanagawa, Yoshito Fujimura
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Publication number: 20160035968Abstract: A method for producing a suspension board with circuit includes a first step of preparing a suspension board including a metal supporting layer, a base insulating layer disposed at one surface in a thickness direction of the metal supporting layer, and a conductive pattern disposed at one surface in the thickness direction of the base insulating layer and having a terminal portion; a second step of connecting a piezoelectric element to the terminal portion by solder and heating the solder at a temperature of not less than a depolarization temperature allowing polarization of the piezoelectric element to start disappearing; and a third step of applying a voltage to the piezoelectric element so as to repolarize the piezoelectric element connected to the terminal portion.Type: ApplicationFiled: July 8, 2015Publication date: February 4, 2016Applicant: NITTO DENKO CORPORATIONInventors: Takatoshi SAKAKURA, Hitoki KANAGAWA
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Publication number: 20150382451Abstract: A write wiring trace is formed over insulating layer. A coating layer, being directly in contact with at least a first portion of a surface of the write wiring trace, is formed over the insulating layer to cover the write wiring trace. A connection terminal is formed over the insulating layer to be electrically connected to the write wiring trace and exposed from the coating layer.Type: ApplicationFiled: June 29, 2015Publication date: December 31, 2015Inventors: Hiroyuki TANABE, Hitoki KANAGAWA
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Publication number: 20150156892Abstract: A method for producing a suspension board with circuit includes the steps of (7) removing a first electroless plating layer corresponding to a first terminal and/or a second electroless plating layer corresponding to a second terminal by etching, (8) removing a metal supporting board in contact with the lower surface of a first conductive layer filling the inside of a first opening portion, and (9) providing an electrolytic plating layer on the surface of the first terminal with the first electroless plating layer removed and/or the surface of the second terminal with the second electroless plating layer removed and the lower surface of the first conductive layer exposed from the inside of the first opening portion by electrolytic plating supplying electricity from the metal supporting board.Type: ApplicationFiled: December 2, 2014Publication date: June 4, 2015Applicant: NITTO DENKO CORPORATIONInventors: Hiroyuki TANABE, Hitoki KANAGAWA
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Patent number: 8927870Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.Type: GrantFiled: February 8, 2013Date of Patent: January 6, 2015Assignee: Nitto Denko CorporationInventors: Yasushi Tamura, Ryouji Suezaki, Tetsuya Ohsawa, Hiroyuki Tanabe, Hitoki Kanagawa
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Patent number: 8913348Abstract: A suspension board with circuit includes a metal supporting layer, an insulating base layer formed on the metal supporting layer, a conductive layer formed on the insulating base layer, and a slider supported on the metal supporting layer via a pedestal. The conductive layer includes a conductive overlapping portion which overlaps a plane on which the slider is projected when projected in a thickness direction. The conductive overlapping portion is provided to be spaced apart from the slider.Type: GrantFiled: November 21, 2013Date of Patent: December 16, 2014Assignee: Nitto Denko CorporationInventors: Naotaka Higuchi, Hitoki Kanagawa, Tadashi Takahashi
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Patent number: 8872036Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.Type: GrantFiled: February 8, 2013Date of Patent: October 28, 2014Assignee: Nitto Denko CorporationInventors: Yasushi Tamura, Ryouji Suezaki, Tetsuya Ohsawa, Hiroyuki Tanabe, Hitoki Kanagawa
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Patent number: 8869391Abstract: A method for producing a wired circuit board includes the steps of preparing a metal supporting layer, forming an insulating layer on the metal supporting layer so as to form an opening, forming a conductive thin film on the insulating layer and on the metal supporting layer that is exposed from the opening of the insulating layer, heating the conductive thin film, forming a conductive pattern on the conductive thin film that is formed on the insulating layer, and forming a metal connecting portion to be continuous to the conductive pattern on the conductive thin film that is formed on the metal supporting layer exposing from the opening of the insulating layer.Type: GrantFiled: October 25, 2011Date of Patent: October 28, 2014Assignee: Nitto Denko CorporationInventors: Katsutoshi Kamei, Yuu Sugimoto, Hitoki Kanagawa
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Patent number: 8835767Abstract: A suspension board with circuit includes an insulating base layer and a conductive pattern that is laminated on a top surface of the insulating base layer. The conductive pattern includes a wire and a terminal portion that is connected to the wire for being joined by a melted metal. The insulating base layer, in a projected surface when projected in a laminating direction, includes an adjacent region that is adjacent to the terminal portion and a separated region that is separated from the terminal portion so as to sandwich the adjacent region with the terminal portion. The adjacent region is formed to be thinner than the separated region.Type: GrantFiled: January 27, 2012Date of Patent: September 16, 2014Assignee: Nitto Denko CorporationInventors: Saori Ishigaki, Hitoki Kanagawa, Yoshito Fujimura
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Publication number: 20140160599Abstract: A suspension board with circuit includes a metal supporting layer, an insulating base layer formed on the metal supporting layer, a conductive layer formed on the insulating base layer, and a slider supported on the metal supporting layer via a pedestal. The conductive layer includes a conductive overlapping portion which overlaps a plane on which the slider is projected when projected in a thickness direction. The conductive overlapping portion is provided to be spaced apart from the slider.Type: ApplicationFiled: November 21, 2013Publication date: June 12, 2014Applicant: NITTO DENKO CORPORATIONInventors: Naotaka HIGUCHI, Hitoki KANAGAWA, Tadashi TAKAHASHI
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Patent number: 8675313Abstract: A suspension board with circuit includes a mounting portion for mounting thereon a slider, a supporting portion for supporting one end portion of the mounting portion, a facing portion facing the mounting portion to be spaced apart therefrom, and a driving portion provided between the mounting portion and the facing portion. The driving portion includes a heater; and an expansive portion which is thermally expanded by heat generated from the heater.Type: GrantFiled: December 21, 2012Date of Patent: March 18, 2014Assignee: Nitto Denko CorporationInventors: Naotaka Higuchi, Hitoki Kanagawa, Tetsuya Ohsawa, Daisuke Yamauchi
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Patent number: 8618828Abstract: In a connection structure of an electronic component and a wired circuit board, the electronic component includes a plurality of external terminals. The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, and a conductive pattern formed on the insulating base layer. The conductive pattern includes a plurality of terminal portions for connection with the plurality of external terminals. The electronic component and the wired circuit board are disposed such that the plurality of external terminals and the plurality of terminal portions face each other. The wired circuit board is bent such that the conductive pattern is warped, and by the reaction force of the warping, the terminal portions and the external terminals are abutted, and the electronic component and the wired circuit board are electrically connected.Type: GrantFiled: November 18, 2010Date of Patent: December 31, 2013Assignee: Nitto Denko CorporationInventors: Tetsuya Ohsawa, Hitoki Kanagawa
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Publication number: 20130248233Abstract: A wired circuit board includes a wire and a terminal formed continuously to the wire and electrically connected to an electronic element at one surface thereof in a thickness direction. The terminal includes a first contact portion, and a second contact portion provided around the first contact portion to protrude more than the first contact portion toward one side in the thickness direction.Type: ApplicationFiled: March 14, 2013Publication date: September 26, 2013Applicant: NITTO DENKO CORPORATIONInventors: Saori KANEZAKI, Hitoki KANAGAWA, Yoshito FUJIMURA
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Patent number: 8460563Abstract: A producing method of a wired circuit board includes a laminating step of preparing a metal supporting board, forming an insulating base layer on the metal supporting board, forming a conductive layer including a terminal portion and a plating lead continued from the terminal portion on the insulating base layer, and forming an insulating cover layer on the insulating base layer so as to cover the conductive layer, a first etching step of etching the metal supporting board, and then etching the insulating base layer to expose the plating lead from the metal supporting board and the insulating base layer, and a second etching step of etching the exposed plating lead.Type: GrantFiled: May 4, 2009Date of Patent: June 11, 2013Assignee: Nitto Denko CorporationInventors: Jun Ishii, Hitoki Kanagawa