Patents by Inventor Hitoshi Homma

Hitoshi Homma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8252395
    Abstract: An injection-molded body according to the present invention includes a tubular body portion, an airtight seal surface formed on a peripheral surface of the body portion near one end of the body portion, and a plurality of undercuts disposed at positions around the peripheral surface of the body portion that are closer to the end than the airtight seal surface is. The undercuts prevent a seal member mounted on the airtight seal surface from falling off, in which a clearance is formed between a peripheral wall and the undercuts. The peripheral wall defines an inner hole of the body portion, and the clearance accommodates deformation of the undercuts in radial directions.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: August 28, 2012
    Assignee: Alps Electric Co., Ltd.
    Inventors: Shinji Kikuchi, Hideki Abe, Junichi Hosogoe, Tsuguhisa Hayashida, Hitoshi Homma
  • Publication number: 20110229666
    Abstract: An injection-molded body according to the present invention includes a tubular body portion, an airtight seal surface formed on a peripheral surface of the body portion near one end of the body portion, and a plurality of undercuts disposed at positions around the peripheral surface of the body portion that are closer to the end than the airtight seal surface is. The undercuts prevent a seal member mounted on the airtight seal surface from falling off, in which a clearance is formed between a peripheral wall and the undercuts. The peripheral wall defines an inner hole of the body portion, and the clearance accommodates deformation of the undercuts in radial directions.
    Type: Application
    Filed: February 24, 2011
    Publication date: September 22, 2011
    Applicant: ALPS ELECTRIC CO., LTD.
    Inventors: Shinji KIKUCHI, Hideki ABE, Junichi HOSOGOE, Tsuguhisa HAYASHIDA, Hitoshi HOMMA
  • Patent number: 6361626
    Abstract: A Pb-free solder alloy and a soldered bond using the same, in which the solder alloy has no harmful environmental effect but has a solderability comparable to that of the conventional Pb—Sn solder alloy. The solder alloy of the present invention either consists of Zn: 3.0-14.0 wt %, Al: 0.0020-0.0080 wt %, and the balance of Sn and unavoidable impurities or consists of Zn: 3.0-14.0 wt %, Bi: 3.0-6.0 wt %, Al: 0.0020-0.0100 wt %, and the balance of Sn and unavoidable impurities. The soldered bond of the present invention consists of either of the present inventive solder alloys.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: March 26, 2002
    Assignee: Fujitsu Limited
    Inventors: Masayuki Kitajima, Hitoshi Homma, Masakazu Takesue, Tadaaki Shono, Yutaka Noda
  • Patent number: 5549244
    Abstract: The present disclosure concerns a thermally controlled valve, such as may be installed in the cooling water system of internal combustion engines. The thermally controlled valve eliminates thermal hunting as the temperature of the cooling water increases by restricting the initial flow of cooling water. Subsequently, additional cooling water flow is permitted as the temperature of the cooling water further increases.
    Type: Grant
    Filed: January 19, 1995
    Date of Patent: August 27, 1996
    Assignee: Nippon Thermostat Co., Ltd.
    Inventors: Kazuyuki Kai, Masahisa Hamano, Hitoshi Homma, Akira Mori, Takashi Masuko