Patents by Inventor Hitoshi Horita

Hitoshi Horita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120687
    Abstract: A connector includes an electrically conductive base body and a keying member. The electrically conductive base body defines a mating opening and a connector mating portion adapted to receive a mating connector inserted through the mating opening. The keying member is removably inserted into the connector mating portion. The keying member is adapted to permit a correspondingly shaped mating connector to be inserted into the connector mating portion.
    Type: Application
    Filed: December 21, 2023
    Publication date: April 11, 2024
    Applicant: Tyco Electronics Japan G.K.
    Inventor: Hitoshi Horita
  • Patent number: 11088477
    Abstract: A board-mounting type shield connector includes a contact, a housing supporting the contact and having a mating opening, a shield shell surrounding the housing and having a first board connection portion in a vicinity of a rear end portion of the shield shell, an enclosure having a plugging passage for plugging of a mating connector, and a ground member supported on the enclosure in a vicinity of a front end portion of the enclosure. The plugging passage opens in a frontward direction and communicates with the mating opening. The first board connection portion is connected to a ground pattern on a circuit board. The ground member has a second board connection portion connected to the ground pattern.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: August 10, 2021
    Assignee: Tyco Electronics Japan G.K.
    Inventors: Tohru Yamamoto, Hitoshi Horita
  • Publication number: 20200220288
    Abstract: A board-mounting type shield connector includes a contact, a housing supporting the contact and having a mating opening, a shield shell surrounding the housing and having a first board connection portion in a vicinity of a rear end portion of the shield shell, an enclosure having a plugging passage for plugging of a mating connector, and a ground member supported on the enclosure in a vicinity of a front end portion of the enclosure. The plugging passage opens in a frontward direction and communicates with the mating opening. The first board connection portion is connected to a ground pattern on a circuit board. The ground member has a second board connection portion connected to the ground pattern.
    Type: Application
    Filed: March 13, 2020
    Publication date: July 9, 2020
    Applicant: Tyco Electronics Japan G.K.
    Inventors: Tooru Yamamoto, Hitoshi Horita
  • Patent number: 9197002
    Abstract: A connector supporting structure includes a substrate, a connector mounted on the substrate, and a casing covering at least a portion of the substrate and supporting the connector. The casing includes an opening to expose a part of the connector from an inside of the casing to an outside. Side surfaces of the connector are pressed by inner surfaces of the opening.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: November 24, 2015
    Assignee: HITACHI METALS, LTD.
    Inventors: Masataka Satoh, Kouki Hirano, Hitoshi Horita, Masanobu Ito
  • Patent number: 9158067
    Abstract: An optical board including a substrate including a plate-shaped resin including a first main plane and a second main plane facing each other, and a slit-shaped optical fiber receiving portion which penetrates between the first main plane and the second main plane in a thickness direction, a metal layer provided on the second main plane, and a wiring pattern consisting of metal and provided on the first main plane. An inclined plane is provided at an end of the optical fiber receiving portion in the substrate, a tilt angle of the inclined plane with respect to the first main plane is an obtuse angle, and a reflective layer is provided on the inclined plane for reflecting a light output from an optical fiber received in the optical fiber receiving portion toward the first main plane.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: October 13, 2015
    Assignee: Hitachi Metels, Ltd.
    Inventors: Hiroki Yasuda, Hiroshi Ishikawa, Kouki Hirano, Hitoshi Horita
  • Publication number: 20140227908
    Abstract: A connector supporting structure includes a substrate, a connector mounted on the substrate, and a casing covering at least a portion of the substrate and supporting the connector. The casing includes an opening to expose a part of the connector from an inside of the casing to an outside. Side surfaces of the connector are pressed by inner surfaces of the opening.
    Type: Application
    Filed: January 31, 2014
    Publication date: August 14, 2014
    Applicant: HITACHI METALS, LTD.
    Inventors: Masataka SATOH, Kouki HIRANO, Hitoshi HORITA, Masanobu ITO
  • Patent number: 8746988
    Abstract: Provided is a cable with a connector (1) having a form in which a connector is fitted to a cable (6). A housing (2) of the connector is constituted by two case members (2a, 2b). A root portion of the cable (6) is covered with a boot (8) made of a resin, and a flange (8a) is formed in the boot (8). Inside the boot (8), a stop ring (10) made of a metal is arranged. The stop ring (10) allows a transmission line (6a) to be inserted through a main body thereof having a cylinder shape, and a jacket (6b) is covered on its outer side. A flange (10a) is also formed in the stop ring (10), and the flange (10a) and the flange (8a) are inserted into grooves (2c, 2d) in an overlapped state.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: June 10, 2014
    Assignee: Hitachi Metals, Ltd.
    Inventors: Juhyun Yu, Hitoshi Horita, Kouki Hirano
  • Publication number: 20120243834
    Abstract: Provided is a cable with a connector (1) having a form in which a connector is fitted to a cable (6). A housing (2) of the connector is constituted by two case members (2a, 2b). A root portion of the cable (6) is covered with a boot (8) made of a resin, and a flange (8a) is formed in the boot (8). Inside the boot (8), a stop ring (10) made of a metal is arranged. The stop ring (10) allows a transmission line (6a) to be inserted through a main body thereof having a cylinder shape, and a jacket (6b) is covered on its outer side. A flange (10a) is also formed in the stop ring (10), and the flange (10a) and the flange (8a) are inserted into grooves (2c, 2d) in an overlapped state.
    Type: Application
    Filed: October 18, 2011
    Publication date: September 27, 2012
    Applicant: HITACHI CABLE, LTD.
    Inventors: Juhyun Yu, Hitoshi Horita, Kouki Hirano
  • Patent number: 8026858
    Abstract: An antenna element 1 is installed at a glass part 5 of a vehicle 4. The antennal element 1 has a ground part 3 and a radiating element 2. A metallic part side ground part 3b of the ground part 3 is overlapped with a metallic part 6 of the vehicle 4, while a glass part side ground part 3a of the ground part 3 and the radiating element 2 are not overlapped with the metallic part 6. The ground part 3 is installed such that a ratio of the area of the glass part side ground part 3a to be overlapped with the glass part 5 to the area of the metallic part side ground part 3b to be overlapped with the metallic part 6 is from 1:5 to 1:10.
    Type: Grant
    Filed: January 2, 2008
    Date of Patent: September 27, 2011
    Assignee: Hitachi Cable, Ltd.
    Inventors: Shinichi Takaba, Hitoshi Horita, Yuichi Anzai, Masayoshi Kaneyasu
  • Publication number: 20080246671
    Abstract: An antenna element 1 is installed at a glass part 5 of a vehicle 4. The antennal element 1 has a ground part 3 and a radiating element 2. A metallic part side ground part 3b of the ground part 3 is overlapped with a metallic part 6 of the vehicle 4, while a glass part side ground part 3a of the ground part 3 and the radiating element 2 are not overlapped with the metallic part 6. The ground part 3 is installed such that a ratio of the area of the glass part side ground part 3a to be overlapped with the glass part 5 to the area of the metallic part side ground part 3b to be overlapped with the metallic part 6 is from 1:5 to 1:10.
    Type: Application
    Filed: January 2, 2008
    Publication date: October 9, 2008
    Applicant: HITACHI CABLE, LTD.
    Inventors: Shinichi TAKABA, Hitoshi HORITA, Yuichi ANZAI, Masayoshi KANEYASU
  • Patent number: 6963310
    Abstract: A mobile phone antenna has: a first conductive radiation element that is formed in a sheet metal conductor and resonates at a predetermined resonance frequency; a second conductive radiation element that is formed in the sheet metal conductor and resonates at the predetermined resonance frequency; and a ground that is connected through a conductive ground connector with the second conductive radiation element. The ground is placed such that the ground is not opposed to the first and second conductive radiation elements.
    Type: Grant
    Filed: September 8, 2003
    Date of Patent: November 8, 2005
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hitoshi Horita, Takahiro Sugiyama, Shin Kataoka, Shinichi Takaba
  • Publication number: 20040130493
    Abstract: A mobile phone antenna has: a first conductive radiation element that is formed in a sheet metal conductor and resonates at a predetermined resonance frequency; a second conductive radiation element that is formed in the sheet metal conductor and resonates at the predetermined resonance frequency; and a ground that is connected through a conductive ground connector with the second conductive radiation element. The ground is placed such that the ground is not opposed to the first and second conductive radiation elements.
    Type: Application
    Filed: September 8, 2003
    Publication date: July 8, 2004
    Applicant: HITACHI CABLE, LTD.
    Inventors: Hitoshi Horita, Takahiro Sugiyama, Shin Kataoka, Shinichi Takaba