Patents by Inventor Hitoshi Kamoshida
Hitoshi Kamoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240120174Abstract: In order to improve the processing reproducibility, an ion milling device 100 includes a sample chamber 107, a sample stage 102 that is disposed in the sample chamber on which a sample is placed, an ion source 101 that emits an unfocused ion beam toward the sample, a control unit 112 that controls an output of the ion beam, an oscillator 104 that is disposed in the sample chamber, and an oscillation circuit 111 that oscillates the oscillator and outputs an oscillation signal to the control unit, in which the control unit controls the output of the ion beam such that a vibrational frequency change amount of the oscillator per unit time due to deposition of sputtered particles generated by irradiating the sample with the ion beam on the oscillator is kept within a predetermined range.Type: ApplicationFiled: January 22, 2021Publication date: April 11, 2024Inventors: Shota AIDA, Hisayuki TAKASU, Atsushi KAMINO, Hitoshi KAMOSHIDA
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Patent number: 11742178Abstract: The invention provides an ion milling device capable of cross-sectional milling on an all-solid-state battery while reducing an occurrence of a short circuit due to a redeposition film.Type: GrantFiled: August 23, 2019Date of Patent: August 29, 2023Assignee: Hitachi High-Tech CorporationInventors: Hitoshi Kamoshida, Hisayuki Takasu, Atsushi Kamino, Shota Aida, Megumi Nakamura
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Publication number: 20230048299Abstract: There is provided an ion milling apparatus that can enhance reproducibility of ion distribution. The ion milling apparatus includes an ion source 101, a sample stage 102 on which a sample processed by radiating a non-convergent ion beam from the ion source 101 is placed, a drive unit 107 that moves a measurement member holding section 106 holding an ion beam current measurement member 105 along a track located between the ion source and the sample stage, and an electrode 112 that is disposed near the track, in which a predetermined positive voltage is applied to the electrode 112, the ion beam current measurement member 105 is moved within a radiation range of the ion beam by the drive unit 107, in a state in which the ion beam is output from the ion source 101 under a first radiation condition, and an ion beam current that flows when the ion beam is radiated to the ion beam current measurement member 105 is measured.Type: ApplicationFiled: December 24, 2019Publication date: February 16, 2023Inventors: Shota AIDA, Hisayuki TAKASU, Atsushi KAMINO, Hitoshi KAMOSHIDA
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Patent number: 11508552Abstract: Provided is an ion milling device capable of improving the reproducibility of an ion distribution. An ion milling device includes: an ion source (1); a sample stage (2) on which a sample (4) to be processed by being irradiated with an unfocused ion beam from the ion source (1) is placed; and a drive unit (8) configured to be arranged between the ion source (1) and the sample stage (2), and to move a linear ion beam measuring member (7) extending in a first direction to a second direction orthogonal to the first direction, in which the drive unit (8) moves the ion beam measuring member (7) within an emission range of the ion beam in a state where the ion beam is outputted from the ion source (1) under a first emission condition, and an ion beam current flowing through the ion beam measuring member (7) is measured by irradiating the ion beam measuring member (7) with the ion beam.Type: GrantFiled: August 31, 2018Date of Patent: November 22, 2022Assignee: Hitachi High-Tech CorporationInventors: Hitoshi Kamoshida, Hisayuki Takasu, Atsushi Kamino
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Publication number: 20220367148Abstract: Provided is an ion milling apparatus capable of enhancing reproducibility of an ion distribution. The ion milling apparatus includes: an ion source 101; a sample stage 102 on which a sample to be processed by being irradiated with an unfocused ion beam from the ion source 101 is placed; and a measurement member holding unit 106 that holds an ion beam current measurement member 105. A covering material 120 is provided so as to cover at least a surface of the measurement member holding unit 106 and the sample stage 102 facing the ion source 101. A material of the covering material 120 contains, as a main component, an element having an atomic number smaller than that of an element of a material of a structure on which the covering material is provided.Type: ApplicationFiled: December 24, 2019Publication date: November 17, 2022Inventors: Shota AIDA, Hisayuki TAKASU, Atsushi KAMINO, Hitoshi KAMOSHIDA
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Publication number: 20220293391Abstract: The invention provides an ion milling device capable of cross-sectional milling on an all-solid-state battery while reducing an occurrence of a short circuit due to a redeposition film.Type: ApplicationFiled: August 23, 2019Publication date: September 15, 2022Inventors: Hitoshi KAMOSHIDA, Hisayuki TAKASU, Atsushi KAMINO, Shota AIDA, Megumi NAKAMURA
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Patent number: 11244802Abstract: By irradiating a sample with an unfocused ion beam, processing accuracy of an ion milling device for processing a sample or reproducibility accuracy of a shape of a processed surface is improved. Therefore, the ion milling device includes a sample chamber, an ion source position adjustment mechanism provided at the sample chamber, an ion source attached to the sample chamber via the ion source position adjustment mechanism and configured to emit an ion beam, and a sample stage configured to rotate around a rotation center. When a direction in which the rotation center extends when an ion beam center of the ion beam matches the rotation center is set as a Z direction, and a plane perpendicular to the Z direction is set as an XY plane, the ion source position adjustment mechanism is capable of adjusting a position of the ion source on the XY plane and a position of the ion source in the Z direction.Type: GrantFiled: February 28, 2018Date of Patent: February 8, 2022Assignee: Hitachi High-Tech CorporationInventors: Hitoshi Kamoshida, Hisayuki Takasu, Atsushi Kamino, Toru Iwaya
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Publication number: 20210183615Abstract: Provided is an ion milling device capable of improving the reproducibility of an ion distribution. An ion milling device includes: an ion source (1); a sample stage (2) on which a sample (4) to be processed by being irradiated with an unfocused ion beam from the ion source (1) is placed; and a drive unit (8) configured to be arranged between the ion source (1) and the sample stage (2), and to move a linear ion beam measuring member (7) extending in a first direction to a second direction orthogonal to the first direction, in which the drive unit (8) moves the ion beam measuring member (7) within an emission range of the ion beam in a state where the ion beam is outputted from the ion source (1) under a first emission condition, and an ion beam current flowing through the ion beam measuring member (7) is measured by irradiating the ion beam measuring member (7) with the ion beam.Type: ApplicationFiled: August 31, 2018Publication date: June 17, 2021Inventors: Hitoshi KAMOSHIDA, Hisayuki TAKASU, Atsushi KAMINO
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Publication number: 20210066020Abstract: By irradiating a sample with an unfocused ion beam, processing accuracy of an ion milling device for processing a sample or reproducibility accuracy of a shape of a processed surface is improved. Therefore, the ion milling device includes a sample chamber, an ion source position adjustment mechanism provided at the sample chamber, an ion source attached to the sample chamber via the ion source position adjustment mechanism and configured to emit an ion beam, and a sample stage configured to rotate around a rotation center. When a direction in which the rotation center extends when an ion beam center of the ion beam matches the rotation center is set as a Z direction, and a plane perpendicular to the Z direction is set as an XY plane, the ion source position adjustment mechanism is capable of adjusting a position of the ion source on the XY plane and a position of the ion source in the Z direction.Type: ApplicationFiled: February 28, 2018Publication date: March 4, 2021Inventors: Hitoshi KAMOSHIDA, Hisayuki TAKASU, Atsushi KAMINO, Toru IWAYA
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Patent number: 9426311Abstract: An image forming apparatus includes: an expansion/contraction ratio calculation unit that calculates a value of a ratio of expansion or contraction of a printing medium at a time of printing a second surface as compared with a time of printing a first surface; a storage control unit that causes an NVRAM to hold the calculated value of the ratio of expansion or contraction; and a magnification correcting unit that corrects magnification of an image on the second surface using a newly calculated value of the ratio when a difference between the newly calculated value and a value that has been held by the NVRAM until the new value is calculated is within a predetermined range, and corrects the magnification of the image on the second surface using a value closer to 0 than the newly calculated value when the difference exceeds the predetermined range.Type: GrantFiled: June 16, 2015Date of Patent: August 23, 2016Assignee: RICOH COMPANY, LTD.Inventors: Shigeru Tosa, Hitoshi Kamoshida, Tetsuya Ogawa
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Publication number: 20150371119Abstract: An image forming apparatus includes: an expansion/contraction ratio calculation unit that calculates a value of a ratio of expansion or contraction of a printing medium at a time of printing a second surface as compared with a time of printing a first surface; a storage control unit that causes an NVRAM to hold the calculated value of the ratio of expansion or contraction; and a magnification correcting unit that corrects magnification of an image on the second surface using a newly calculated value of the ratio when a difference between the newly calculated value and a value that has been held by the NVRAM until the new value is calculated is within a predetermined range, and corrects the magnification of the image on the second surface using a value closer to 0 than the newly calculated value when the difference exceeds the predetermined range.Type: ApplicationFiled: June 16, 2015Publication date: December 24, 2015Applicant: RICOH COMPANY, LTD.Inventors: Shigeru Tosa, Hitoshi Kamoshida, Tetsuya Ogawa
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Patent number: 6565174Abstract: When a print controller detects a nozzle that is not used for a predetermined period of duration, the print controller rewrites scan data so that the nozzle will be used in a present scan printing operation. The print controller further changes an amount of sheet feed in association with the rewritten scan data. Then, the present scan printing operation is performed. It is therefore possible to prevent any nozzles from not being used continuously for the predetermined period of time.Type: GrantFiled: December 14, 2001Date of Patent: May 20, 2003Assignee: Hitachi Koki Co., Ltd.Inventors: Hitoshi Kamoshida, Susumu Saito
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Publication number: 20020075339Abstract: When a print controller detects a nozzle that is not used for a predetermined period of duration, the print controller rewrites scan data so that the nozzle will be used in a present scan printing operation. The print controller further changes an amount of sheet feed in association with the rewritten scan data. Then, the present scan printing operation is performed. It is therefore possible to prevent any nozzles from not being used continuously for the predetermined period of time.Type: ApplicationFiled: December 14, 2001Publication date: June 20, 2002Inventors: Hitoshi Kamoshida, Susumu Saito