Abstract: An adhesive tape having an adhesive layer formed on one side of a substrate layer, which renders it possible to minimize the extent of development of chipping or fragmentation (nicks) or crack in chip when the silicon wafer, to which this tape is adhered, is cut into chips using a dicer. The adhesive layer of the tape has a storage modulus G? of 1 MPa or more at a temperature of 15 to 35° C., and preferably tan ? as represented by the ratio of a loss modulus G? to the storage modulus G? is 0.05 or less. The adhesive layer is preferably constructed principally of an olefin polymer.

Abstract: An adhesive tape having an adhesive layer formed on one side of a substrate layer, which renders it possible to minimize the extent of development of chipping or fragmentation (nicks) or crack in chip when the silicon wafer, to which this tape is adhered, is cut into chips using a dicer. The adhesive layer of the tape has a storage modulus G? of 1 MPa or more at a temperature of 15 to 35° C., and preferably tan ? as represented by the ratio of a loss modulus G? to the storage modulus G? is 0.05 or less. The adhesive layer is preferably constructed principally of an olefin polymer.

Abstract: An adhesive tape having an adhesive layer formed on one side of a substrate layer, which renders it possible to minimize the extent of development of chipping or fragmentation (nicks) or crack in chip when the silicon wafer, to which this tape is adhered, is cut into chips using a dicer. The adhesive layer of the tape has a storage modulus G′ of 1 MPa or more at a temperature of 15 to 35° C., and preferably tan&dgr; as represented by the ratio of a loss modulus G″ to the storage modulus G′ is 0.05 or less. The adhesive layer is preferably constructed principally of an olefin polymer.

Abstract: The underside of a base layer consisting of one or more sub-layers is overlaid with an adhesive layer that is chiefly composed of an .alpha.-olefin copolymer that is based on at least two .alpha.-olefins selected from among .alpha.-olefins having 2-12 carbon atoms and which has a crystallinity of up to 10%, and said adhesive layer will develop an initial tack of at least 20 g/25 mm when attached to the surface of a stainless steel plate at 23.degree. C. The thus produced surface protective film, when attached to various kinds of adherends, will not experience separation of the adhesive layer from the base layer while developing strong initial tack, will experience only small changes in adhesive strength (peel strength) with the lapse of time after attachment to the adherends, is sufficiently low in blocking force to provide ease in film handling during the rewinding operation and it yet can be manufactured at low cost.

Abstract: An amorphous polyester composition according to the present invention comprises (A) a low crystalline polyolefin modified with unsaturated carboxylic acids, (B) an amorphous polyester, (C) a silane coupling agent and (D) an optional inorganic filler, wherein (A) forms a matrix phase and (B) forms a domain phase. This amorphous polyester composition has excellent adhesion properties to different materials such as metal and has excellent damping performance, and therefore a damping material having excellent initial adhesion properties and water-resistant adhesion properties and excellent damping performance, particularly at high temperatures can be obtained from such an amorphous polyester composition.

Abstract: Composite laminates such as metal plate/vibration damper/metal plate, metal plate/vibration damper/metal plate/vibration damper, metal plate/vibration damper/metal plate/vibration damper/metal plate are disclosed. The vibration damper is composed of ethylene-(meth)acrylic acid salt copolymers or its modified products having a specific melting point and a particular heat of fusion. The composite laminate having at least one vibration damper exhibits excellent vibration damping performance, particularly at high temperatures.

Abstract: A method of resistance-welding two laminates each having a basic structure of a metal layer/a thermally softenable insulating layer/a metal layer, which allows welding with excellent welding strength and good outer appearance of a welded spot. In this method, two laminates are prepared in which each metal layer has a thickness of 0.02 to 0.5 mm, and a ratio of the total thickness of the metal layers of each laminate to the thickness of the laminate falls within a range between 1/3 and 2/3. Electrodes held at a temperature above the softening temperature of the insulating layers are urged against the laminates to soften the insulating layers and so bring the metal layers into contact with each other and to resistance-weld the laminates.

Abstract: A laminate comprises a sandwich plate of metal-thermoplastic resin-metal layers and a fiber reinforced plastics overlying at least one surface of the sandwich plate. The laminate is suitable for outer wall plates of various matters.