Abstract: A printing screen cleaning apparatus and a method for cleaning a printing screen by employing the cleaning apparatus which includes a cleaning head having a wiping member and a backup member for sucking the paste via a wiping member while sliding the wiping member on a lower surface of the printing screen. The backup member includes a suction port provided in a suction region of a backup surface of the backup member. The backup member also has a groove that extends parallel to the suction region and approximately perpendicular to the sliding direction of the wiping member. The groove partially releases the backup of the wiping member.

Abstract: When solder paste passes through a first gap located between a pressurizing member and a printing mask during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.

Abstract: When solder paste passes through a first gap located between a pressurizing member and a printing mask during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.

Abstract: When solder paste passes through a first gap (34) located between a pressurizing member (28) and a printing mask (3) during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.

Abstract: When solder paste passes through a first gap (34) located between a pressurizing member (28) and a printing mask (3) during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.

Abstract: An adhesive applying apparatus having an adhesive applying nozzle (1), an elevation drive unit (B) for vertically moving the adhesive applying nozzle, a purging station (6) provided with a purging tape (5), a unit (10) for supporting a circuit board (4) and an X-Y direction drive unit (30) which moves the adhesive applying nozzle so as to position the adhesive applying nozzle in a specified position in a horizontal direction of the circuit board and the purging tape. The elevation drive unit is constructed so as to be able to selectively set the lowermost end position of the adhesive applying nozzle. Also, a control means (D) is provided for controlling the elevation drive unit with a command in order to set the lowermost end position of the adhesive applying nozzle, located in a position above the purging station, to a specified position.

Abstract: An adhesive applying apparatus having an adhesive applying nozzle (1), an elevation drive unit (B) for vertically moving the adhesive applying nozzle, a purging station (6) provided with a purging tape (5), a unit (10) for supporting a circuit board (4) and an X-Y direction drive unit (30) which moves the adhesive applying nozzle so as to position the adhesive applying nozzle in a specified position in a horizontal direction of the circuit board and the purging tape. The elevation drive unit is constructed so as to be able to selectively set the lowermost end position of the adhesive applying nozzle. Also, a control means (D) is provided for controlling the elevation drive unit with a command in order to set the lowermost end position of the adhesive applying nozzle, located in a position above the purging station, to a specified position.

Abstract: An application method of adhesive for applying an adhesive by an application nozzle on an application object. Each application object is positioned in a direction intersecting the conveying direction by the move of each tables and the individual application heads corresponding to the tables are individually moved and positioned in the conveying direction, and the adhesive is applied simultaneously to necessary positions of the application objects by the application heads, so that the production efficiency of electronic circuit boards is enhanced in various aspects without increasing the size of the apparatus.

Abstract: An application method of adhesive for applying an adhesive by an application nozzle on an application object. Each application object is positioned in a direction intersecting the conveying direction by the move of each table, and the individual application heads corresponding to the tables are individually moved and positioned in the conveying direction, and the adhesive is applied simultaneously to necessary positions of the application objects by the application heads, so that the production efficiency of electronic circuit boards is enhanced in various aspects without increasing the size of the apparatus.