Patents by Inventor Hitoshi Nori
Hitoshi Nori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150250075Abstract: A cooler includes: a casing arranged opposed to a heat releasing surface of a heater element; and a first flow channel which is provided in the casing and through which a refrigerant flows, wherein in a direction orthogonal to the heat releasing surface, a length of the first flow channel on a heat releasing surface side is shorter than a length of the first flow channel on the opposite side to the heat releasing surface.Type: ApplicationFiled: December 31, 2014Publication date: September 3, 2015Inventors: Keita Hirai, Hitoshi Nori, Tsuyoshi So
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Patent number: 8611087Abstract: To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.Type: GrantFiled: July 15, 2011Date of Patent: December 17, 2013Assignees: Fujitsu Limited, Fuji Furukawa Engineering & Construction Co., LtdInventors: Yoichi Sato, Kenji Tosaka, Mitsuo Hayashi, Akihiro Yasuo, Hideki Kimura, Kengo Ueda, Katsuhiko Nakata, Yoshihisa Iwakiri, Hitoshi Nori, Tomoaki Haneda, Mika Tokumitsu, Naoki Shinjo, Kouji Kuroda, Yoshihiro Kusano
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Publication number: 20110317357Abstract: To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers earch composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air curents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are dispossed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.Type: ApplicationFiled: July 15, 2011Publication date: December 29, 2011Applicants: FUJI FURUKAWA ENGINEERING & CONSTRUCTION CO., LTD., FUJITSU LIMITEDInventors: Yoichi Sato, Kenji Tosaka, Mitsuo Hayashi, Akihiro Yasuo, Hideki Kimura, Kengo Ueda, Katsuhiko Nakata, Yoshihisa Iwakiri, Hitoshi Nori, Tomoaki Haneda, Mika Tokumitsu, Naoki Shinjo, Kouji Kuroda, Yoshihiro Kusano
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Patent number: 8004839Abstract: To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.Type: GrantFiled: February 29, 2008Date of Patent: August 23, 2011Assignees: Fujitsu Limited, Fuji Furukawa Engineering & Construction Co., Ltd.Inventors: Yoichi Sato, Kenji Tosaka, Mitsuo Hayashi, Akihiro Yasuo, Hideki Kimura, Kengo Ueda, Katsuhiko Nakata, Yoshihisa Iwakiri, Hitoshi Nori, Tomoaki Haneda, Mika Tokumitsu, Naoki Shinjo, Kouji Kuroda, Yoshihiro Kusano
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Publication number: 20080232064Abstract: To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.Type: ApplicationFiled: February 29, 2008Publication date: September 25, 2008Applicants: FUJITSU LIMITED, FUJI DENKI SOSETSU CO., LTD.Inventors: Yoichi Sato, Kenji Tosaka, Mitsuo Hayashi, Akihiro Yasuo, Hideki Kimura, Kengo Ueda, Katsuhiko Nakata, Yoshihisa Iwakiri, Hitoshi Nori, Tomoaki Haneda, Mika Tokumitsu, Naoki Shinjo, Kouji Kuroda, Yoshihiro Kusano
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Patent number: 7428154Abstract: A package structure to be mounted on was external printed circuit board includes a package board that is mounted with an exoergic circuit element, and a heat sink that radiates heat from the exoergic circuit element, wherein first pressure for connecting the heat sink to the package board is separated from second pressure for compressing the package board against the printed circuit board.Type: GrantFiled: September 16, 2003Date of Patent: September 23, 2008Assignee: Fujitsu LimitedInventors: Junichi Ishimine, Tsuyoshi So, Hitoshi Nori
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Patent number: 7055341Abstract: The cooling system allows the liquid coolant discharged from the pump to flow into the evaporation chamber. The liquid coolant passes through the atomizer. Minute droplets of the atomized coolant is discharged from the atomizer into the evaporation chamber. The minute droplets serve to form a uniform thin liquid film over the surface of the fin. Heat conducting from a target heat generating object to the fin promotes the evaporation of the liquid coolant over the surface of the fin, for example. The coolant absorbs a large amount of heat from the fin based on the evaporation. The target heat generating object can thus efficiently be cooled.Type: GrantFiled: June 3, 2003Date of Patent: June 6, 2006Assignee: Fujitsu LimitedInventors: Hitoshi Nori, Jie Wei
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Publication number: 20040084764Abstract: A package structure to be mounted on was external printed circuit board includes a package board that is mounted with an exoergic circuit element, and a heat sink that radiates heat from the exoergic circuit element, wherein first pressure for connecting the heat sink to the package board is separated from second pressure for compressing the package board against the printed circuit board.Type: ApplicationFiled: September 16, 2003Publication date: May 6, 2004Inventors: Junichi Ishimine, Tsuyoshi So, Hitoshi Nori, Takashi Urai
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Publication number: 20030205054Abstract: The cooling system allows the liquid coolant discharged from the pump to flow into the evaporation chamber. The liquid coolant passes through the atomizer. Minute droplets of the atomized coolant is discharged from the atomizer into the evaporation chamber. The minute droplets serve to form a uniform thin liquid film over the surface of the fin. Heat conducting from a target heat generating object to the fin promotes the evaporation of the liquid coolant over the surface of the fin, for example. The coolant absorbs a large amount of heat from the fin based on the evaporation. The target heat generating object can thus efficiently be cooled.Type: ApplicationFiled: June 3, 2003Publication date: November 6, 2003Applicant: FUJITSU LIMITEDInventors: Hitoshi Nori, Jie Wei
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Patent number: 5894882Abstract: A heat sink structure of a module substrate includes a plurality of stripe-like bottom regions extending in a longitudinal direction and repeated in a lateral direction with a predetermined pitch, a plurality of stripe-like top regions extending in said longitudinal direction and repeated in the lateral direction with said predetermined pitch, such that the stripe-like bottom regions and the stripe-like top regions are repeated alternately in the lateral direction, wherein the stripe-like top regions and the stripe-like bottom regions have respective lateral edges that are connected with each other by cooling fins.Type: GrantFiled: May 17, 1996Date of Patent: April 20, 1999Assignee: Fujitsu LimitedInventors: Shunichi Kikuchi, Minoru Hirano, Kiyotaka Seyama, Hideaki Yoshimura, Takashi Kanda, Hitoshi Nori
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Patent number: 5763950Abstract: A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.Type: GrantFiled: February 8, 1996Date of Patent: June 9, 1998Assignee: Fujitsu LimitedInventors: Akihiko Fujisaki, Junichi Ishimine, Masumi Suzuki, Masahiro Miyo, Shunichi Kikuchi, Minoru Hirano, Hitoshi Nori
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Patent number: 5586006Abstract: A multi-chip module includes a base board, a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements mounted on a main surface of the thin-film multi-layer circuit board, and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.Type: GrantFiled: December 15, 1995Date of Patent: December 17, 1996Assignee: Fujitsu LimitedInventors: Kiyotaka Seyama, Shunichi Kikuchi, Makoto Sumiyoshi, Naoki Yasuda, Minoru Hirano, Hitoshi Nori